HEI High Density Interconnect Capabilities We offer advanced flex circuits, specializing in flex and rigid-flex rapid prototyping of high density, miniaturized designs. Our quick-turn capability will accelerate your development projects and commercialization schedules! Certifications and Compliance to: ISO 9001:2008; AS9100 Rev. C ITAR Registered IPC-A-600 (acceptability to circuit boards) Speed and Support • High Density Flex & Rigid-Flex Substrates • Full design & development support • 5 and 10 day turns avaialable on select programs Expanding Range of Materials for Specialty Applications • Rogers, BT, LCP and Teflon© • High-TG FR4, Polyimide Flex, Acrylic Adhesive & latest high speed materials Leading-Edge Technology • • • • • • Line widths & spacing down to .001” (25 µm) Laser Direct Imaging Laser drilled via holes down to .002” (50 µm) Blind & buried vias 1 - 10 layer count Substrate thickness down to .001” (25 µm) with 5 µm copper • Substrate thickness down to .0005” (12 µm) with 12 µm copper Fabrication • X-Ray optimization for high tolerance mechanical drilling (Pluritec Combo) • Routed Array, Laser Routing. Mechanical Route, High Precision Routing (X-Ray Pluritec System) • Step & repeat registration to +/- 1 mil tolerance for mechanical & laser (ESI 5335 & Pluritec) • 75 µm - 100 µm Route-Edge Tolerance • 50 µm Laser Route - Positional Tolerance • 125 µm Mechanical X-Ray System Route-Edge Tolerance • 50 µm Mechanical X-Ray System Route-Positional Tolerance • Controlled depth milling • Edge plating HEI-2057 Rev. A Electrical Test • Flying Probe, Hi Pot Laminate / Cover Materials • Nelco (all series), Isola (FR408, 370HR, FR06), Arlon (all series), Hitachi, Rogers (all series), Zeta (all series) Surface Finishes • ENIG, ENEPIG, Wire Bondable Gold, Selective Gold, Gold Over Copper, Thick Nickel, Selective Copper Plating Solder Masks • Taiyo Flex FXT Series, Taiyo Flex LDI, PSR-4000 AUS5, PSR-AUS308, Taiyo Multi-Colors • LDI imaging of Photoimageable solder mask Legend / Silkscreen • All colors Manufacturing Standards Class II & Class III, IPC6012, IPC6013 CONFIDENCE DELIVERED Call 866-720-2397 or click www.heii.com HEI, Incorporated, an American company in business since 1968, provides contract manufacturing services for applications including military, high-end communications, medical, hearing, Class II and Class III medical device markets. We are an ITAR Registered, FDA Registered Contract Manufacturer specializing in Electronic Manufacturing Services (EMS), including medical device manufacturing, microelectronic assembly and turnkey manufacturing plus ceramic, flex and rigid-flex substrates. Our company provides rapid prototyping and engineering services, product design, automation and test services, box build manufacturing, distribution and fulfillment solutions. High Density Interconnect Business Division 610 South Rockford Drive Tempe, AZ 85281 1-480-274-7423 Microelectronic Business Division & Corporate Headquarters 1495 Steiger Lake Lane Victoria, MN 55386 1-866-720-2397 Advanced Medical Operations Business Division 4801 63rd Street Boulder, CO 80301 1-800-231-3779 HEI-2057 Rev. A