“Ready for the Future Technology today” 2014

“Ready for the Future Technology today”
2014
Streamline Circuit’s Facility
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Manufacturing all levels of technology
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The facility was established in 1982
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Located in Silicon Valley
Delivery convenience for out of state customers
Located in Silicon Valley
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Complete manufacturing process under one roof
1 mile from the San Jose Airport
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New management team installed September 2003
56,000 sq ft PCB manufacturing facility
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Time sensitive prototyping through production
Short car ride away for pick up & deliveries
Financially secure in current market
conditions
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Low cost infrastructure
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The Team & Their Experience
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Chuck Dimick- CEO | Founder
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Over 33 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder
of the company's predecessor, Dynamic Circuits Inc. (1991)
Greg Halvorson- President | Founder
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Over 31 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc.
and Dynamic Circuits Inc.
Tom Doslak-Vice President of Sales & Marketing | Founder
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Over 23 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional
Sales Manager for Dynamic Details Inc.
Ed Pitney- Operations Manager
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Over with 32 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a
Director of Manufacturing Operations later purchased by DDI Global Inc.
Steve Morris – Director of Engineering
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Over 27 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for
Multek (a division of Flextronics) and a key member of the HP PWB Corporate commodity team.
JR Ramirez- Production Manager | Founder
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Over 32 years of experience in the industry. Former Production Manager for both Dynamic Details Inc.
and Dynamic Circuits Inc.
Lorraine Hook - Director of Quality
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Over 43 years of industry experience. Former Director of Quality for many successful companies
including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager.
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Customer Service Support
• Customer Service (24 hours - 7 days a week)
– Sales, Engineering, Manufacturing and Quality
• Dedicated customer service readily availableour support group’s located onsite in the
facility
• Quick response to all requests such as:
Inside Sales Customer
Support
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Job status
Delivery pull-in
Quantity Increases
Engineering design modification
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Proactive Engineering Services
• Manufacturing Capabilities
– Prototype though volume
– All time sensitive builds
• DFM (Design for Manufacturability)
Cam Valor Stations
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DFM Software (reviews in 10 minutes)
Net list compare to customer data
Custom Verification programs
Looking for customer design error
In plan Smart data Collection System
• Controlled Impedance Verification
– Stack up assistance
– Copper distribution
– Material verification
4 Laser Direct Imaging units
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Quality Reassurance
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Net list compare prior to MFG
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Front End DRC (design rule check)
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Verifying inner & outer layers
X-Ray Verification
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After Lam (Inspecta), After Drilling
Cross Section Verification
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Hole Integrity
Controlled Impedance Testing
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TDR test of panel coupons
100% Net List Test On All Product
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In house Mil & deliverable Lab
Searching for customer design mistakes
AOI Automated Optical Inspection
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Automated Optical Inspection
Matching Net list to Gerber data
Eliminator Tester & flying probe
Coordinate Measurement
Machine
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First articles, 100% measurement
verification
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On Time Delivery Reassurance
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100% In-house manufacturing from start to
finish
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Employee Training program
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8 flying Probe Testers
Control delivery & customer flexibility
In-process quality verification system
No out sourcing delivery delays
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Performance evaluation every 6 months
In-house Chemical Laboratory
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Cross Sections
Chemical analysis
Mil spec verification
Vacuum Lamination press
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Controlled Impedance Verification
Stack up assistance
Copper distribution
Material verification
Continuous Improvement Programs
• Working daily on:
Management meetings
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Research and Development
Pre-Engineering Programs
Improvement Process Program
Department Performance Reviews
Preventative maintenance program
Employee Training Program
Planned Capital expense program
7 Laser drills
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A Full PCB Solution
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Multilayer Rigid / Rigid- Flex / Flex
1 to 50 Layers +
28:1 High Aspect Ratio
3.23 Mils Hole to Copper
Buried / Blind Vias
9 Sequential Laminations
13+ Stacked Vias
1 Mil Trace & Space
Cavity Constructions
6 oz. + Copper Thickness
Copper Filled Micro Vias
+/- 5% Controlled Impedance Tol.
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AS9100 Rev. C / ISO 9001
Mil-Spec 55110 / ITAR
RoHS & Halogen Free Materials
IPC 6012 Rigid / 6013 Flex / 6015 MCM /
6016 HDI / 6018 High Frequency
4 Mil Mechanical Drills
24” x 30” Oversize Panel
2 Mil Laser Drill Vias
Up to 345 Mils Board Thickness
Via Under Pad (Conductive & NonConductive Filled)
40+ Materials (Hybrid Constructions)
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Nadcap
ISO 9001:2000
IPC 6012,13,15,16,18
Class 3
ITAR
AS9100 Rev C
Certification Recommended and Anticipated
Mil-Spec 55110
Mil-Spec 31032 in process
Q-Pulse Total Quality Management:
• Quality Assurance Systems
• Q-Pulse Quality System
• NCMR’s and Corrective Actions
• Audits
• Training
• Equipment Calibrations
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BACK
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Shipment Dollars by Year
$50,000,000
$45,000,000
$40,000,000
$35,000,000
$30,000,000
$25,000,000
$20,000,000
$15,000,000
$10,000,000
$5,000,000
Year
2004 2006 2008 2010 2012
Streamline’s Capital Expenditures
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Use advanced equipment technologies to
manufacture today's printed circuit board
requirements
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The future in PCB manufacturing is about
technology and automation
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Hire and Train equipment operators
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High percentage engineering personnel and
staff
Laser Direct Imaging
Cuposit & Electroless Line
DES Inner Layer Stripline
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Design Strategies
Epoxy fill with copper Vias
Resin Fill off set ViasResin fill/stacked Vias
All Copper Fill process
V-Stacks: Patented MicroVia technology that will change everything
A combination of Streamline's engineering talent created V-Stack, a new MicroVia
manufacturing process that will change everything we know about Via Stacking. This
technology allows a manufacturer to create MicroVia structures greater than 3 layers deep
with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer
to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology
is a cost effective route for advanced technology.
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RIGID-FLEX EXAMPLES
6 Layer
Rigid Flex
6 Layer
Rigid Flex
with Cavity
8 Layer Rigid
Flex Micro via
10 Layer
Micro via
BGA

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