COMBO - SEAL Project

Semiconductor
Equipment
Assessment
Leveraging Innovation
SEAL PROJECT – BULLETIN
SEAL SP17 – COMBO
COMBINED IMAGE-BASED
AND DIFFRACTION-BASED
OVERLAY METROLOGY FOR
THE 22NM TECHNOLOGY
Advances in COMBO
 Development,
demonstration
and
qualification of the two sensor concept
(imaging
sensor
and
spectroscopic
ellipsometer)
 Test on several stacks for which tight
specifications are required
AT A GLANCE
 Platform assessment for
overlay measurements
to meet 22nm nodes
requirements.
 Performance evaluation
for image and diffraction
based techniques
SEAL SP17 – PARTNERS
KLA-Tencor
Imec
Micron
FIGURE 1: ARCHER
EQUIPPED WITH SCOL HEAD THE
TOOL COMBINES TWO SENSORS: AN IMAGING SENSOR AND
A SPECTROSCOPIC ELLIPSOMETER.
SEAL WEBSITE
www.seal-project.eu
Semiconductor
Equipment
Assessment
Leveraging Innovation
SEAL PROJECT – BULLETIN
SEAL SP17 – COMBO
COMBINED IMAGE-BASED AND DIFFRACTIONBASED OVERLAY METROLOGY FOR THE 22NM
TECHNOLOGY
Project Results
SEAL PROJECT MANAGEMENT
Prof. Lothar Pfitzner
Fraunhofer IISB
Schottkystraße 10
D–91058 Erlangen
T: +49(0)9131/761-110
I: www.iisb.fraunhofer.de
The COMBO use case was planned to be introduced on the new KLA-Tencor’s
Archer overlay tools. This new platform is currently available in the market
offering both imaging and scatterometry technologies together on the same
platform. The imaging technology is the main technology within the fabs today.
This technology keeps improving. On the other hand, progress in the
diffraction based overlay was made as well and it is still under investigation: in
tool merits (TMU, TIS, etc.) in target design (smaller, more process robust) and
more. Looking forward to the expected benefits of scatterometry technology,
many customers are starting to pursue the scatterometry tools and try to
supplement them into their metrology section. The transition towards
scatterometry, however, will take its time, and it seems to be that different
layers require different types of technology to achieve best results. Moreover,
imaging based overlay serves today as the reference technology, and
therefore scatterometry results are compared with it. All these considerations
create the need for a COMBO tool, both for the transition period and for the
coexistence of these two technologies later on.
The COMBO use case was proven to achieve robust metrology results
while dealing with die real estate problems. All of these activities above
will come together to perform a better COMBO use case that will
complement the movement of the industry into the 22nm and 14nm
nodes and beyond with robust overlay metrology, smarter sampling and
higher yield for the semiconductors fabs.
SP17 – CONTACT
Daniel Kandel
KLA-Tencor
I: www.kla-tencor.com
SEAL WEBSITE
www.seal-project.eu

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