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Surfscan
SP1 DLS
Unpatterned Surface Inspection Solution
DEFECT CONTROL
T H E S U R F S C A N S P 1 D L S I S T H E F I R S T 3 0 0 M M I N S P E C T I O N S Y S T E M that provides brightfield, darkfield, and nanotopography defect information in a single scan. It is designed to capture the widest variety of yield-limiting defects down to 50 nm at high
throughput (up to 125 wafers per hour) to accelerate yield learning in design rules at 130 nm, 100 nm, and smaller. The combination
of high sensitivity at high throughput with real-time defect classification (RTDC) makes the Surfscan SP1 DLS the industry’s lowest
cost-of-ownership tool. The thorough inspection capabilities of the Surfscan SP1 DLS enable wafer and integrated circuit (IC) manufacturers to more rapidly develop and ramp their advanced processes for the production of devices at 130 nm and below.
PRODUCT DESCRIPTION
also classifies defects in real time. This defect-classification capa-
Dual-Laser Inspection
A dual-laser system, the Surfscan SP1
DLS
uses multiple detectors to col-
bility enables rapid failure analysis and root-cause analysis, and it
lect complete defect information on wafer surfaces. For darkfield
also reduces false defect alarms by separating yield-impacting
inspection, one laser captures defects using two modes of illumination:
defects from nuisance defects and noise. As a result, fabs can
normal and oblique. For brightfield inspection, a second laser captures
achieve faster development and ramps and maintain yield during
non-scattering or weakly-scattering defects. This simultaneous dark-
the manufacturing phase.
field-brightfield mode delivers thorough inspection capability that
X-Y Coordinate Accuracy
enables users to detect the widest range of defects at the highest cap-
The Surfscan SP1DLS delivers the same coordinate accuracy for darkfield
ture rate in a single pass.
defects (at 15 microns, 95 percentile) as the Surfscan SP1TBI. This
Complete Defectivity/Surface Nanotopography (SNT) Information
permits easy review on optical and scanning electron microscopes as
The Surfscan SP1
DLS
rapidly delivers complete defectivity information in
well as map-to-map overlay functions.
a single scan. It does this through a combination of multiple data chan-
Edge Handling
nels: darkfield optimized for small defects down to 50 nm PSL (poly-
Full wafer–edge handling capability enables inspection for frontside
styrene latex) equivalent, and also brightfield (DIC) and surface nanoto-
defects without backside contact—a critical requirement for 300 mm
pography (SNT) optimized for defects ranging from several tens of
double-sided polished wafers.
microns up to a millimeter in size. This enables the capture and characterization of critical-defect types on blanket film wafers during film
deposition, lithography, etch, CMP, and on bare film wafers during
wafer production. The rapid access to defect information provided by
the Surfscan SP1DLS speeds the root-cause analysis of defects on wafers
and accelerates development cycles and fab ramps.
High-Resolution Haze Information
The optimized collection geometry of multiple data channels enables
high-resolution haze measurement on the Surfscan SP1DLS. Haze is a
critical parameter that closely correlates to wafer surface quality (i.e.,
surface roughness and nonuniformity in film layers). The Surfscan
SP1DLS collects haze data as it inspects wafers and captures defects,
thus enabling users to monitor thoroughly and quickly process excursions in wafer and IC fabs.
Backside Inspection
Defects and contamination resulting from contact with the wafer backside can lead to yield loss in advanced IC manufacturing. The backside
inspection module (BSIM) option enables nondestructive inspection of
the backside of product and monitor wafers, thus allowing early detection and monitoring of both process problems and sources of backside
defects.
S E A M L E S S I N S P E C T I O N , R E V I E W, A N D A N A LY S I S
Managing defectivity also requires the ability to source defects quickly
and resolve the process or equipment problem with minimum yield
impact. This necessitates the use of efficient and effective defect classification and data analysis as part of an overall, seamless solution for
defect reduction and control. Through a complete suite of automated
inspection, review, and classification tools, KLA-Tencor delivers the
Real-Time Defect Classification (RTDC)
most comprehensive defect reduction and control technology available
In addition to capturing the widest variety of defects, the SP1 DLS
for yield optimization and acceleration.
Unpatterned Surface Inspection Solution
Surfscan
SP1 DLS
BENEFITS
Best sensitivity at corresponding highest
X-Y coordinate accuracy enables fast and
throughput enables capture of defects of
easy defect review and map-to-map overlay.
interest at 100 nm design rules on all
200 mm/300 mm bridge platform.
blanket films; delivers 50 nm sensitivity
Meets 300 mm factory automation
on bare silicon wafers.
requirements.
Simultaneous brightfield/darkfield/
Typical defect on SOI wafer captured by the
brightfield channel of SP1 DLS .
nanotopography scans—all in a single
A P P L I C AT I O N S
pass—deliver reduced inspection time
" Wa f e r
and improved cost of ownership (CoO).
Process development and final inspection.
Thorough inspection of frontside and
" IC
backside of monitor wafers, and
Applications in all process modules (IQC,
backside of product wafers.
films, copper, CMP, etch, litho):
Optimum defect capture rate and real-
Fab ramp (equipment qualification for
time defect classification enable nui-
tool- and process-related defects)
sance-defect filtering, thus providing
SP1 DLS haze map showing non-uniform
resist coating across a wafer.
faster time-to-results and classification
Routine tool qualification (daily/shift
of yield-killing defects.
tool-qualification checks)
Excellent matching with the industry
Post-maintenance tool qualification
standard SP1TBI platform permits the
during production (qualify tool post
import of recipes and calibration curves
maintenance)
from SP1
Plating-related defect on Cu wafer captured
by the brightfield channel of SP1 DLS .
TBI
.
Routine process monitoring
Enhanced smooth- and rough-film sensi-
Advanced process development
tivity enables the inspection of advanced
(minimize yield-limiting defects during
materials (low-k dielectrics, copper, SOI).
development phase—e.g., copper,
KLARF data output provides network
low-k development)
connectivity to KLA-Tencor analysis tools
" OEM
such as Klarity Defect and review tools
Characterization and qualification of
such as the eV300 e-beam review system.
process tools.
K L A - T E N C O R : A C C E L E R AT I N G Y I E L D
KLA-TENCOR SERVICE/SUPPORT
KLA-Tencor’s portfolio of solutions includes the industry’s
Customer service and support are an integral part of
broadest line of advanced inspection and metrology systems,
KLA-Tencor’s yield optimization solution. Our vast customer
which enables customers to gather all of the yield-critical
support organization services our worldwide installed base
defect and metrology data. It also includes the sophisticated
and is responsible for customer support following shipment
software to turn that data into quick corrective action.
of equipment and software. Services include system
Finally, it includes the expertise to help customers rapidly
installation, secure online monitoring, on-site repair,
understand and resolve complex manufacturing problems so
telephone support, relocation services, and selected post-
they can reap the financial and market rewards associated
sales applications.
with faster time to market and increased product yields.
© 2001 KLA-Tencor Corporation. All brands or product names may be trademarks of their respective
Printed in the U.S.A. 01/11
companies. KLA-Tencor reserves the right to change the hardware and/or software specifications without notice.
K L A - T E N C O R C O R P O R AT I O N
W W W. K L A - T E N C O R . C O M
160 RIO ROBLES
SAN JOSE, CA 95134
W-RV-1330
PHONE 408.875.3000
FAX 408.875.4144

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