Material Declaration Table Package Type: WLCSP 20 Package Code: U4D020 Dimension: 2.15 x 1.94 x 0.625 mm IC Weight (mg): 4.7700 Assembly Location: TeraProbe Product is RoHS Compliant 部位名 Part Name 部位重量(mg) Part Weight チップ:Chip 絶縁層 Insulating layer メタルポスト Metal Post 配線:Wiring 封止樹脂 Encapsulation resin シリコン面コート Coating on Silicon はんだボール Solder ball 合 計 Total 2.8180 0.0227 0.2770 0.0428 0.2242 0.1745 1.2108 4.7700 CAS No. 含有物質名 Contained material Name シリコン 7440-21-3 Silicon (Si) ポリイミドテープ Trade Secret Polyimide tape 銅 7440-50-8 Copper (Cu) チタン 7440-32-6 Titanium (Ti) 銅 7440-50-8 Copper (Cu) シリカ 60676-86-0 Silica (SiO2) カーボンブラック 1333-86-4 Carbon black (C） エポキシ樹脂 Trade Secret Epoxy Resin (EP) エポキシ樹脂 Trade Secret Epoxy Resin (EP) 錫 7440-31-5 Tin (Sn) 銀 7440-22-4 Silver (Ag) 銅 7440-50-8 Copper (Cu) 使用目的 Purpose of use チップ材料 Chip Material 層間絶縁 Inter-level isolation UBM Under Barrier Metal UBM Under Barrier Metal 配線 Wiring material 添加剤 Additive 着色顔料 Coloring pigment 樹脂材料 Resin Material 樹脂材料 Resin Material はんだボール Solder ball はんだボール Solder ball はんだボール Solder ball 含有量(mg) Contained material Weight 製品重量に対する含有率 Weight percent and ppm values per IC weight ｗｔ％ ｐｐｍ 部位重量に対する含有率 Weight percent and ppm values per part weight ｗｔ％ ｐｐｍ 2.8180 0.5908 590776 1.0000 1000000 0.0227 0.0048 4759 1.0000 1000000 0.2770 0.0581 58071 1.0000 1000000 0.0010 0.0002 210 0.0234 23364 0.0418 0.0088 8763 0.9766 976636 0.2120 0.0444 44444 94.5584 945584 0.0010 0.0002 210 0.4460 4460 0.0112 0.0023 2348 4.9955 49955 0.1745 0.0366 36583 1.0000 1000000 1.1684 0.2450 244952 0.9650 965000 0.0363 0.0076 7615 0.0300 30000 0.0061 0.0013 1269 0.0050 5000 4.7700 1.0000 1000000 Disclaimer In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. 注）ヒ素はチップ中にイオン化し打ち込み、素子材料として含有していますが、微量のため表からは除外しています。チップ全面に打ち込む（現実には有り得ませんが 、理論上の最大値）と仮定して、チップ重量に対し１１ｐｐｍの含有となります。 Note) This product contains Arsenic(As) as a device material through ion implantation, however, it is not listed in the table due to the minuscule quantities.Given that Arsenic is implanted into entire surface of the chip (That situation is improbable in reality and the theoretical maximum value is calculated ) , it would be 11ppm per a chip weight. Document No. 002-13783 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Document Number: Material Declaration Datasheet (MDDS) - WLCSP 20 (U4D020) (E1) - TeraProbe 002-13783 Rev. ECN No. ** 5316366 Orig. of Change AAC Document No. 002-13783 Rev. ** Description of Change Initial Release. Page 2 of 2
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