Material Declaration Table

Material Declaration Table
Package Type:
LQFP80DR
IC Weight:
0.4700
Product is RoHS Compliant
部位名
Part Name
部位重量(mg)
Part Weight
チップ:Chip
11.6330
リードフレーム
Lead frame
127.4700
CAS No.
7440-21-3
7440-50-8
7440-22-4
7440-22-4
ダイ付け剤
Die attach
1.8730
Trade Secret
Trade Secret
ボンデイングワイヤー
Bonding Wire
7440-50-8
0.5300
7440-05-3
Trade Secret
封止樹脂
Encapsulation resin
60676-86-0
322.5740
1333-86-4
Trade Secret
リードフレーム
半田メッキ
Solder plating of Lead
frame
合　計
Total
5.9200
470.0000
7440-31-5
含有物質名
Contained material
Name
使用目的
Purpose of use
シリコン
Silicon(Si)
銅
Copper (Cu)
銀
Silver (Ag)
銀
Silver (Ag)
エポキシ樹脂
Epoxy Resin (EP)
その他樹脂
Organic Ingredient,
not to declare
銅
Copper (Cu)
パラジウム
Palladium (Pd)
フェノール樹脂
Phenolic Resin
シリカ
Silica (SiO2)
カーボンブラック
Carbon black (C）
エポキシ樹脂
Epoxy Resin (EP)
チップ材料
Chip Material
リードフレーム材料
Lead frame material
Agﾒｯｷ
Ag Plating
ダイ付け剤
Die attach
ダイ付け剤
Die attach
錫
Tin (Sn)
半田メッキ
Solder plating
ダイ付け剤
Die attach
ワイヤー材料
Wire material
ワイヤー材料
Wire material
添加剤
Additive
添加剤
Additive
着色顔料
Coloring pigment
樹脂材料
Resin Material
含有量(mg)
Contained
material Weight
製品重量に対する含有率
Weight percent and ppm
values per IC weight
ｗｔ％
ｐｐｍ
部位重量に対する含有率
Weight percent and ppm
values per part weight
ｗｔ％
ｐｐｍ
11.6330
2.4751%
24751
100.0000%
1000000
126.7100
26.9596%
269596
99.4038%
994038
0.7600
0.1617%
1617
0.5962%
5962
1.3110
0.2789%
2789
70.0000%
700000
0.3000
0.0638%
638
16.0000%
160000
0.2620
0.0557%
557
14.0000%
140000
0.5140
0.1094%
1094
97.0000%
970000
0.0160
0.0034%
34
3.0000%
30000
17.7420
3.7749%
37749
5.5000%
55000
276.9290
58.9211%
589211
85.8500%
858500
0.4840
0.1030%
1030
0.1500%
1500
27.4190
5.8338%
58338
8.5000%
85000
5.9200
1.2596%
12596
100.0000%
1000000
470.0000
100.0000%
1000000
Disclaimer
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20
percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm.
注）ヒ素はチップ中にイオン化し打ち込み、素子材料として含有していますが、微量のため表からは除外しています。チップ全面に打ち込む（現実には有り得ませんが、
理論上の最大値）と仮定して、チップ重量に対し１１ｐｐｍの含有となります。
Note) This product contains Arsenic(As) as a device material through ion implantation, however, it is not listed in the table due to the minuscule quantities.Given that Arsenic is
implanted into entire surface of the chip (That situation is improbable in reality and the theoretical maximum value is calculated ) , it would be 11ppm per a chip weight.
Document No. 002-13662 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - QFP (LQFP80DR) (E2) - CuPd Wire
Document Number: 002-13662
Rev.
**
ECN No. Orig. of
Change
5305677 AAC
Document No. 002-13662 Rev. **
Description of Change
Initial Release.
Page 2 of 2

Download Report