Material Declaration Table Package Type: LQFP 208 Package Code: LET208 Dimension: 28 x 28 x 1.7 mm IC Weight (mg): 2550.0000 Assembly Location: J-devices/Miyagi Product is RoHS Compliant 部位名 Location in Product 部位重量(mg) Part W eight 69.4300 チップ:Chip CAS No. 7440-21-3 7440-50-8 リードフレーム Lead frame 639.9000 7440-22-4 Trade Secret 7440-22-4 ダイ付け剤 Die attach 10.4300 Trade Secret Trade Secret ボンデイングワイヤー Bonding W ire 4.3800 7440-57-5 Trade Secret 封止樹脂 Encapsulation resin 1808.5200 シリコン Silicon(Ｓi) 銅 Copper (Cu) 銀 Silver (Ag) ポリイミドテープ Polyimide tape 銀 Silver (Ag) エポキシ樹脂 Epoxy Resin (EP) フェノール樹脂 Phenolic Resin 金 Gold (Au) 有機リン化合物 Organic phosphorus compounds (P) シリカ:Silica(SiO2) カーボンブラック 1333-86-4 Carbon black (C） エポキシ樹脂 Trade Secret Epoxy Resin (EP) 錫 17.3400 7440-31-5 Tin (Sn) リードフレーム 半田メッキ 合 計 Total 7631-86-9 含有物質名 Contained material Name 2550.0000 使用目的 Purpose of use チップ材料 Chip Material リードフレーム材 料 Lead f rame 含有量(mg) Contained material W eight 製品重量に対する含有率 Weight percent and ppm values per IC weight ｗｔ％ ｐｐｍ 部位重量に対する含有率 Weight percent and ppm values per part weight ｗｔ％ ｐｐｍ 69.4300 2.7227% 27,227 10000.0000% 1,000,000 631.2900 24.7565% 247,565 9865.4477% 986,545 Agﾒｯｷ Ag Plating 1.7800 0.0698% 698 27.8168% 2,782 リード固定 6.8300 0.2678% 2,678 106.7354% 10,674 ダイ付け剤 Die attach 樹脂材料 Resin Material 樹脂材料 Resin Material ワイヤー材料 Wire materiel 硬化促進剤 Hardening accelerator 添加剤 Additive 着色顔料 Coloring pigment 樹脂材料 Resin Material 半田メッキ Solder plating 7.3000 0.2863% 2,863 6999.0412% 699,904 1.6700 0.0655% 655 1601.1505% 160,115 1.4600 0.0573% 573 1399.8082% 139,981 4.3800 0.1718% 1,718 10000.0000% 1,000,000 67.3200 2.6400% 26,400 372.2381% 37,224 1653.7900 64.8545% 648,545 9144.4385% 914,444 3.0300 0.1188% 1,188 16.7540% 1,675 84.3800 3.3090% 33,090 466.5693% 46,657 17.3400 0.6800% 6,800 10000.0000% 1,000,000 2550.0000 100.0000% 1,000,000 Disclaimer In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. 注）ヒ素はチップ中にイオン化し打ち込み、素子材料として含有していますが、微量のため表からは除外しています。チップ全面に打ち込む（現実には有り得ませんが、 理論上の最大値）と仮定して、チップ重量に対し１１ｐｐｍの含有となります。 Note) This product contains Arsenic(As) as a device material through ion implantation, however, it is not listed in the table due to the minuscule quantities.Given that Arsenic is implanted into entire surface of the chip (That situation is improbable in reality and the theoretical maximum value is calculated ) , it would be 11ppm per a chip weight. Document No. 002-16984 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - LQFP 208 (LET208) - J-devices_Miyagi - Au Wire Document Number: 002-16984 Rev. ** ECN No. Orig. of Change 5471162 AAC Document No. 002-16984 Rev. ** Description of Change Initial Release. Page 2 of 2
© Copyright 2024 ExpyDoc
