Material Declaration Table

Material Declaration Table
Package Type:
MLF-80LQV3-NW
IC Weight:
0.4700
Product is RoHS Compliant
部位名
Part Name
部位重量(mg)
Part Weight
チップ:Chip
18.2670
リードフレーム
Lead frame
100.7000
CAS No.
7440-21-3
7440-50-8
7440-22-4
7440-22-4
ダイ付け剤
Die attach
2.9400
Trade Secret
Trade Secret
7440-50-8
ボンデイングワイヤー
Bonding Wire
0.6097
7440-05-3
Trade Secret
封止樹脂
Encapsulation resin
341.5633
60676-86-0
1333-86-4
Trade Secret
リードフレーム
半田メッキ
Solder plating of Lead
frame
合　計
Total
7440-69-9
5.9200
7440-31-5
470.0000
含有物質名
Contained material
Name
シリコン
Silicon(Si)
銅
Copper (Cu)
銀
Silver (Ag)
銀
Silver (Ag)
エポキシ樹脂
Epoxy Resin (EP)
その他樹脂
Organic Ingredient,
not to declare
銅
Copper (Cu)
パラジウム
Palladium (Pd)
有機リン化合物
Organic phosphorus
compounds (P)
シリカ
Silica (SiO2)
カーボンブラック
Carbon black (C）
エポキシ樹脂
Epoxy Resin (EP)
ビスマス
Bismuth (Bi)
錫
Tin (Sn)
使用目的
Purpose of use
チップ材料
Chip Material
リードフレーム材料
Lead frame material
Agﾒｯｷ
Ag Plating
ダイ付け剤
Die attach
ダイ付け剤
Die attach
ダイ付け剤
Die attach
ワイヤー材料
Wire material
ワイヤー材料
Wire material
硬化促進剤
Hardening
accelerator
添加剤
Additive
着色顔料
Coloring pigment
樹脂材料
Resin Material
半田メッキ
Solder plating
半田メッキ
Solder plating
含有量(mg)
Contained
material Weight
製品重量に対する含有率
Weight percent and ppm
values per IC weight
ｗｔ％
ｐｐｍ
部位重量に対する含有率
Weight percent and ppm
values per part weight
ｗｔ％
ｐｐｍ
18.2670
3.8866%
38866
100.0000%
1000000
99.8600
21.2468%
212468
99.1658%
991658
0.8400
0.1787%
1787
0.8342%
8342
2.0580
0.4379%
4379
70.0000%
700000
0.4700
0.1000%
1000
16.0000%
160000
0.4120
0.0877%
877
14.0000%
140000
0.5917
0.1259%
1259
97.0000%
970000
0.0180
0.0038%
38
3.0000%
30000
13.6630
2.9070%
29070
4.0000%
40000
310.1393
65.9871%
659871
90.8000%
908000
0.6830
0.1453%
1453
0.2000%
2000
17.0780
3.6336%
36336
5.0000%
50000
0.1184
0.0252%
252
2.0000%
20000
5.8016
1.2344%
12344
98.0000%
980000
470.0000
100.0000%
1000000
Disclaimer
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20
percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm.
注）ヒ素はチップ中にイオン化し打ち込み、素子材料として含有していますが、微量のため表からは除外しています。チップ全面に打ち込む（現実には有り得ませんが、
理論上の最大値）と仮定して、チップ重量に対し１１ｐｐｍの含有となります。
Note) This product contains Arsenic(As) as a device material through ion implantation, however, it is not listed in the table due to the minuscule quantities.Given that Arsenic is
implanted into entire surface of the chip (That situation is improbable in reality and the theoretical maximum value is calculated ) , it would be 11ppm per a chip weight.
Document No. 002-13703 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - QFP (MLF-80LQV3-NW) (E1) - CuPd Wire
Document Number: 002-13703
Rev.
**
ECN No. Orig. of
Change
5307401 AAC
Document No. 002-13703 Rev. **
Description of Change
Initial Release.
Page 2 of 2

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