IMAPS Nordic 2014 Preliminary Programme Monday June 9 Bus transportation, leaving 15:00 from Scandic Hotel for VTT and returning back 17:30 15.00 - 17.30 Excursion to Printocent 17.30 - 19.00 Registration at Scandic Hotel 19.30 - 21.30 Welcome Reception Location to be announced later Tuesday June 10 at VTT, Kaitoväylä 1 8.30 - 9.15 Coffee and registration 9.15 - 9.20 Opening session 9.20 - 11.25 Material issues in integration Petri Savolainen Hans Danielsson IMAPS Nordic / Huawei Technologies (Finland) MikroElektronik Konsult AB Wire bonding to modern IC:s may have some problems Rajan Ambat Technical University of Denmark An overview on the climatic reliability issues of electronic devices Jussi Putaala University of Oulu Aspects for accelerated testing and reliable lifetime estimation of leadfree solder interconnections Akiko Gädda VTT Examination of UBM for GaAs pixel detector and its flip chip hybridization methods Piotr Guzdek Institute of Electron Technology, Cracow Magnetoelectric effect in ferro(ferri)magnetic - ferroelectric structures 11.30 - 12.00 General Business Meeting and Exhibition Annual Meeting for IMAPS Nordic members 12.00 - 13.00 Lunch and Exhibition Next to exhibition area 13.00 - 14.45 Displays and Photovoltaic Hans Kuosmanen OptoFidelity Oy Reliability testing in combination with touch display functional testing Toptester Ltd Touch panel performance measurements Samuli Yrjänä VTT Decorative energy-autonomous sensor platform concept with printed OPV-cells Aki P. Mäyrä VTT Tolerance management in wafer scale glass optics Esko Nevala 14.40 - 15.10 Coffee and Exhibition 15.10 - 16.50 High reliability in volume manufacture Keynote Henrik Lind Hans Danielsson Christophe Zinck Timo Tarvainen Volvo Car Corporation Active safety functions leading to new challenges on integration and reliability of automotive electronics MikroElektronik Konsult AB ASE Safety electronics in cars, an application with NEW reliability problems. MEMS & Sensors packaging: evolution of technology to enable standardization, high volumes and flexible platforms. New flexible circuit structure for R2R production of Printed Electronics components Elcoflex Oy 20:00 - 24:00 Banquet Dinner at Restaurant Uusi Seurahuone, Rantakatu 4 Wednesday June 11 at VTT, Kaitoväylä 1 9.00 - 11.05 Special Session: Printed Electronics Keynote Jukka Hast Printocent/VTT Manufacturing of flexible and rigid 3D electronics using printing and hybrid integration processes. Paper: Roll-to-Roll printed sensors Timo Tarvainen Elcoflex Oy Printed Metal-Polymer Circuits Turo Piila Neficon Oy PrintoCent Designer’s Handbook - Stimulating Printed Electronics adaptation Antti Keränen TactoTek Oy Hybrid integration manufacturing: Marketplace demands to Technology University of Oulu Printed Temperature and Moisture Sensors Tetsuya Onishi G. J. Tech LED Flip Chip Packaging Trends Olli Tapaninen VTT Thermal management in flexible substrates for LEDs Carl Engblom Ericsson Drivers and aspects on integration based on 2.5/3D integration and photonics as potential game-changers Alexander Kasper AT&S AG Medical Electronics – miniaturization challenges for electronic modules IPDiA Silicon Interposers with Integrated Passive Devices: Ultra-Miniaturized Solution using 2.5D Packaging Platform Low- Temperature and Pressureless Sintering of Electrical Conductive Adhesives Based on Metal-Organic and Resin Re-Inforcing Technology Juha-Veikko Voutilainen 11.05 - 11.35 Coffee and Exhibition 11.35 - 12.25 LED packaging 12.25 - 13.25 Lunch and Exhibition 13.25 - 15.05 2.5 and 3D packaging Keynote Stephane Bellenger Gerhard Kopp Namics Europe GmbH 15.05 - 15.35 Coffee and Exhibition 15.35 - 16.25 Volume manufacturing Tetsuya Onishi Horatio Quinones 16.25 - 16.30 Closing Session G. J. Tech Cu plating on film substrate by UV surface reformation treatment technology. Hilara / Milara High Viscosity Dispensing Monitoring and Control Systems