Programme 2014

IMAPS Nordic 2014
Preliminary Programme
Monday June 9
Bus transportation, leaving 15:00 from Scandic Hotel for VTT and
returning back 17:30
15.00 - 17.30 Excursion to Printocent
17.30 - 19.00 Registration at Scandic Hotel
19.30 - 21.30 Welcome Reception
Location to be announced later
Tuesday June 10
at VTT, Kaitoväylä 1
8.30 - 9.15
Coffee and registration
9.15 - 9.20
Opening session
9.20 - 11.25
Material issues in integration
Petri Savolainen
Hans Danielsson
IMAPS Nordic / Huawei Technologies (Finland)
MikroElektronik Konsult AB
Wire bonding to modern IC:s may have some problems
Rajan Ambat
Technical University of Denmark
An overview on the climatic reliability issues of electronic devices
Jussi Putaala
University of Oulu
Aspects for accelerated testing and reliable lifetime estimation of leadfree solder interconnections
Akiko Gädda
Examination of UBM for GaAs pixel detector and its flip chip
hybridization methods
Piotr Guzdek
Institute of Electron Technology, Cracow
Magnetoelectric effect in ferro(ferri)magnetic - ferroelectric structures
11.30 - 12.00 General Business Meeting and Exhibition
Annual Meeting for IMAPS Nordic members
12.00 - 13.00 Lunch and Exhibition
Next to exhibition area
13.00 - 14.45 Displays and Photovoltaic
Hans Kuosmanen
OptoFidelity Oy
Reliability testing in combination with touch display functional testing
Toptester Ltd
Touch panel performance measurements
Samuli Yrjänä
Decorative energy-autonomous sensor platform concept with printed
Aki P. Mäyrä
Tolerance management in wafer scale glass optics
Esko Nevala
14.40 - 15.10 Coffee and Exhibition
15.10 - 16.50 High reliability in volume manufacture
Henrik Lind
Hans Danielsson
Christophe Zinck
Timo Tarvainen
Volvo Car Corporation
Active safety functions leading to new challenges on integration and
reliability of automotive electronics
MikroElektronik Konsult AB
Safety electronics in cars, an application with NEW reliability problems.
MEMS & Sensors packaging: evolution of technology to enable
standardization, high volumes and flexible platforms.
New flexible circuit structure for R2R production of Printed Electronics
Elcoflex Oy
20:00 - 24:00 Banquet Dinner
at Restaurant Uusi Seurahuone, Rantakatu 4
Wednesday June 11
at VTT, Kaitoväylä 1
9.00 - 11.05 Special Session: Printed Electronics
Jukka Hast
Manufacturing of flexible and rigid 3D electronics using printing and
hybrid integration processes. Paper: Roll-to-Roll printed sensors
Timo Tarvainen
Elcoflex Oy
Printed Metal-Polymer Circuits
Turo Piila
Neficon Oy
PrintoCent Designer’s Handbook - Stimulating Printed Electronics
Antti Keränen
TactoTek Oy
Hybrid integration manufacturing: Marketplace demands to Technology
University of Oulu
Printed Temperature and Moisture Sensors
Tetsuya Onishi
G. J. Tech
LED Flip Chip Packaging Trends
Olli Tapaninen
Thermal management in flexible substrates for LEDs
Carl Engblom
Drivers and aspects on integration based on 2.5/3D integration and
photonics as potential game-changers
Alexander Kasper
Medical Electronics – miniaturization challenges for electronic modules
Silicon Interposers with Integrated Passive Devices: Ultra-Miniaturized
Solution using 2.5D Packaging Platform
Low- Temperature and Pressureless Sintering of Electrical Conductive
Adhesives Based on Metal-Organic and Resin Re-Inforcing Technology
Juha-Veikko Voutilainen
11.05 - 11.35
Coffee and Exhibition
11.35 - 12.25 LED packaging
12.25 - 13.25 Lunch and Exhibition
13.25 - 15.05 2.5 and 3D packaging
Stephane Bellenger
Gerhard Kopp
Namics Europe GmbH
15.05 - 15.35 Coffee and Exhibition
15.35 - 16.25 Volume manufacturing
Tetsuya Onishi
Horatio Quinones
16.25 - 16.30 Closing Session
G. J. Tech
Cu plating on film substrate by UV surface reformation treatment
Hilara / Milara
High Viscosity Dispensing Monitoring and Control Systems