24 FED Conference

24th FED Conference
15/16 September 2016 Bonn
The Electronics Industry in Transition Technologies in Focus
Kindly supported by:
CSK - CAD Systeme Kluwetasch
www.cskl.de
The
Electronics Industry in Transition - Technologies in Focus
Plenarvortrag
Prof. Dr. Rainer Thüringer
Chairman of the FED
Ladies and Gentlemen,
dear FED members!
The only constant is change.
Innovative developments in hardand software, driven by the
digital transformation of our
society, keep creating new
technologies. The focus of this
year's FED Conference lies on
Embedded Components
Technology and 3D Technology.
Experts and professionals will
speak about these from different
perspectives. Presentations will
be accompanied by a facilitated
discussion to answer participants'
questions and derive important
practical recommendations for
action.
The keynote speech on Friday,
“Enterprise 2020 – The Internet
was just the beginning” will also
draw our attention to the coming
change and all of its challenges
and opportunities.
For this speech, we have been
able to recruit the internationally
renowned expert and progressive
thinker, Tim Cole.
Our newly structured
presentation programme
consisting of two conference days
contains current topics,
innovative technologies and
management topics. Another
novelty is our Speakers' Corner
within the accompanying trade
exhibition. Make use of these
various possibilities for your
personal training and for
maintaining and generating new
contacts.
In the name of my fellow Board
members, the Advisory Council
and the team at our FED office, I
am very pleased to invite you to
attend our 24th FED Conference
in Bonn.
Yours
Prof. Dr. Rainer Thüringer
Focus Topics
3D Technologies
Embedded Technology
Our Focus Topic on Thursday, 15
September, will look at different 3D
techniques. These range from the
necessary design tools across
various printing technologies,
specific application examples in 3D
printing, and 3D MID technology up
to manufacturing and 3D assembly.
Furthermore, a process will be
presented to calculate and analyse
the clearance and creepage
distances of electronic 3D
assemblies.
On Friday, 16 September, we will
focus on presentations dealing
with embedded devices and
embedded systems. These will
cover different hands-on
examples of assemblies with
embedded active and passive
components. At the same time,
we will look at questions
regarding the illustration of
embedded components in the
CAD system, component library
information and data formats.
Afterwards, a facilitated roundtable discussion has been
planned including all speakers
and the EDA suppliers of Altium,
FlowCAD, Mentor and Zuken.
Users, speakers and audience will
be able to ask the EDA suppliers
questions concerning the
practical implementation of the
embedded technology with their
software.
Thu 15/09/2016
Conference Programme
from 8:00 am
Registration at FED desk and exhibition attendance
Plenum
9:00 am
Opening of conference and welcome - Prof. Dr. Rainer Thüringer, Chairman of the FED
9:15 am
Words of welcome from the city of Bonn – Mayor Reinhard Limbach
Management
9:30 am
Current Topics
Business Outlook for Global &
European Electronics Markets
- World & European electronic
equipment, EMS, component &
materials markets
PCB-Design für Leistungselektronik
- Isolationskoordination in
leistungselektronischen
Baugruppen und Geräten
Walter Custer (EIPC)
Peter Mauer (Semikron)
Focus Topic
3D-Techniques
Innovative Topics
Intelligente Sensorik für
elektronische Komponenten und
Systeme
- Vernetzung und umfassende
Nutzung von Maschinen- und
Sensordaten für die
Smart Factory
3D-Druck in der Elektronikfertigung
Prof. Dr.-Ing. Claus Emmelmann,
Leiter des Instituts für Laser- und
Anlagensystemtechnik (iLAS) an der
TU Hamburg-Harburg und CEO der
LZN Laser Zentrum Nord GmbH
Franz Stieber (ifm electronic)
10:15 am
Gewährleistung, Untersuchungsund Rügepflichten
- Auswirkungen der aktuellen
Rechtsprechung und
Gesetzgebung auf Ihre
Lieferverträge
Lagenaufbau und
Stromversorgungsdesign für
Highspeed-Anwendungen
Das neue Proportionale
Berechnungsmodell
Immer kleinere Bauteile erfordern
optimierte Anschlussflächen auf
Leiterplatten
3D-Elektronik, neue generative
Verfahren für die Elektronik
Dr. Kai-Oliver Giesa
(CMS Hasche Sigle)
Jennifer Vincenz (tecnotron)
Rainer Taube (TAUBE ELECTRONIC)
Hanno Platz (GED)
11:00 am
11:30 am
Coffee break - meeting and networking at the exhibition (Speakers’ Corner)
Aktuelle Änderungen und
Ergänzungen in der
Umweltgesetzgebung
(EuP, RoHs, REACh, WEEE und ELV)
Jan-Henryk Serzisko
(Alpha Assembly Solutions)
Dr. Otmar Deubzer
(Fraunhofer IZM)
12:15 pm
Produkthaftungsrecht im Rahmen
der Umweltgesetzgebung
Dr. Jens Nusser,
(KOPP-ASSENMACHER
Rechtsanwälte)
Reliability
3:00 pm
6:30 pm
doors open
Karl-Heinz Kluwetasch (csk)
3D-Technologien und 3D Druck
- 3D Druck vom Prototyp zur
Großserie
Dr. Thomas Krebs (Mecadtron)
Sebastian Bechmann
(Christian Koenen)
Andreas Kraus (Kraus Hardware)
Current Topics
Innovative Topics
Entwurfswerkzeug zur Adaption
kritischer Teilschaltungen im
Entwurfsprozess kompakter
Baugruppen
The New Age of PCBDocumentation
- Integrierte Dokumentation
Alexander Klemm
(TU Dresden)
Bernd Stube (Fraunhofer IZM)
Damien Kirscher (Altium)
Zuverlässige Netzteile
-Reine Glückssache?
Konkrete Analysen für
aussagefähige Ergebnisse
Selbst- und Zeitmanagement in der If every single mesh counts –
Projektarbeit
an innovative qualification
-mehr Zeit für das Wesentliche
technique for printing screens
Reinhard Greim
(Organisations-Entwicklung)
Jürgen Brag
(Technologieberatung)
Current Topics
Verschließen von Vias mit
Lötstopplack
- Vor- und Nachteile
- Designbedingungen
Martin Sachs
(db electronic)
Sonderapplikationen mit dem
selektiven Heißgaslötprozess
- Reworkprozesse für die Reparatur
und Modifikation von hoch
komplexen Baugruppen
Jörg Brand (Kraus Hardware)
Coffee break - meeting and networking at the exhibition (Speakers’ Corner)
3:45 pm
ends
5:00 pm
Luft- und Kriechstreckenanalyse
von elektromechanischen BG´n
- Luft- und Kriechstreckenanalyse
für 3D-Leiterplattensysteme
In-Situ Röntgenuntersuchungen an
Lötstellen der Leistungselektronik
- Echtzeituntersuchung der
Porenbildung
Marcus Rehm (IBR)
4:15 pm
Dampfphasenlöten –
pro / contra Vakuum
- Lötverfahren (Vergleich)
- Vorteile/Nachteile
CAD-systemunabhängige Erstellung
von SMD Anschlussflächen nach
IPC-7351C
- Courtyard Outline
- Namenskonvention
- PCB Library Expert
- CAD-Formate
Lunch break - meeting and networking at the exhibition
1:00 pm
2:15 pm
Bleifreie Lötverbindungen für
hochzuverlässige Baugruppen
- Hochtemperatur-Anwendungen
- Niedrigtemperatur-Anwendungen
Zuverlässigkeitsbetrachtungen mit
Hilfe thermomechanischer FEMSimulation
An Investigation into Parallel
Conductor Heating in PWBs
- Conductor Temperature Rise Due
to Current Changes in Conductors
Lester Pena Gomez
(CADFEM GmbH)
Mike Jouppi
(Thermal Management LLC)
Automatisierte Analyse von
Leiterplattenlayouts zur
Vermeidung von SI, PI und EMV
Problemen
Smart Manufacturing Systems Pave
the Way for Embedded
Technologies
Joe Krolla
(Mentor Graphics)
Sven Lamprecht (Atotech)
Evening event - awarding of the PCB Design Award - starts: 7:00 pm
Fri 16/09/2016
Conference Programme
8:30 am
Registration at the FED desk and exhibition attendance
Plenum
9:30 am
Welcoming of the participants – Prof. Dr. Rainer Thüringer, Chairman of the FED
9:45 am
Unternehmen 2020 – Das Internet war erst der Anfang
Tim Cole – Internet publisher and bestselling author
Management
Current Topics
Kostenoptimiertes
11:00 am Leiterplattendesign
11:45 am
- Kostenoptimiertes
Leiterplattendesign aus Sicht der
Elektronikfertigung Brückenschlag zwischen Design
und Fertigung
Michael Matthes (Wittenstein)
Anatol Schwersenz (Würth)
Laminate für Hochtemperatur
Integration von 3D-Bauteilen
Anwendungen – eine Alternative zu in Embedded Printed Circuit Boards
Keramik?
- Abbildung der Bauteile im
CADSystem
- Informationen, Datenformate,
Schnittstellen (IEC 62878-2)
Anna Graf (Isola)
Michael Schleicher (Semikron)
Current Topics
UL-Forum
Focus Topic
Embedded Technology
Backdrill Failure Hierarchy and Stub
Length Analysis
- Design of IST reliability coupons
- 6 x 260° C reflow simulation
Evaluation Kabelkonfektion
- Einschätzung/Bewertung
- Abstimmung mit dem Kunden
- Qualitäts-Anforderungen
UL PCB Recognition – What does it
really mean?
Alun Morgan (EIPC)
Stephan-Johannes Paul
(spe Paul Kabelkonfektion)
Emma Hudson
UL International (UK) Ltd
Interconnect Stress Test
- Messmethode nach IPC-TM-650
- Messen und Bewerten
- Analyse der Messergebnisse
Fehlervermeidung
- Fehlerursachen und Hinweise zu
deren Vermeidung
Wärmestabilität und ULZertifizierung aus Sicht eines
Basismaterialherstellers
Embedded Power Electronics on
the way to be launched
Hermann Reischer (Polar
Instruments)
Stephan-Johannes Paul
(spe Paul Kabelkonfektion)
Roland Schönholz (Isola)
Mike Morianz (AT&S)
Next Generation PCB and panelbased Packages using Embedding
Technologies
Lars Böttcher (Fraunhofer IZM)
Coffee break - meeting and networking at the exhibition (Speakers’ Corner)
3:00 pm
Reliability
3:30 pm
Dirk Müller (FlowCAD)
Point of no Return ?
Rückstrompfadauslegungen
(flächig, GND-Hatch, GND-Balls)
und ihr Einfluss auf das
Übertragungsverhalten schneller
digitaler Signale
Ralf Brüning (Zuken)
Reliability
2:15 pm
Subkutan implantierbarer Receiver
zur Übertragung von Energie zu
einem Implantat
- Embedded Multilayerinduktivität
mit integrierten Bauteilen
Lunch break - meeting and networking at the exhibition
12:30 pm
1:30 pm
Designmethodik zur
Drahtlose, effiziente
Miniaturisierung elektrischer
Energieübertragung mit loser
Schaltungen bei steigender Qualität Kopplung
und Zuverlässigkeit
Marcus Rehm (IBR)
Helge Schimanski (Fraunhofer ISIT)
Focus Topic
Embedded Technology
Innovative Topics
Qualitätsregelung mit
automatischer inline Inspektion
- Inline-Prüfung
- Qualitätskennzahlen erfassen
- Qualitätsregelschleifen
Michael Mügge (Viscom)
Current Topics
UL-Forum
Qualifizierte Lötprofilerstellung für
Reflow-, Wellen- und
Selektivwellenlötprozesse
UL recognition in the view of a PCB
manufacturer
Jürgen Deutschmann (AT&S)
- von den Vorgaben durch
Temperaturmessung zu
belastbaren Profilen
Roundtable-Diskussion
Moderation: Sven Nehrdich
Teilnehmer: Emma Hudson,
Roland Schönholz,
Jürgen Deutschmann
Focus Topic
Embedded Technology
Embedded Technology
Roundtable-Diskussion
Realisierung von Embedded
Technologies im CAD-System
- Anwenderfragen an die EDAAnbieter
- Lösungen der EDA-Anbieter
Moderation: Prof. Rainer Thüringer
und Rainer Taube
Optimierung der Zuverlässigkeit
Helge Schimanski (Fraunhofer
von bestückten Leiterplatten durch (Fraunhofer ISIT)
Simulation
– QFN und BGA Bauelemente
Kleine Ursache, große Wirkung
Auswirkungen des
Leiterplattendesigns auf die
Qualität und Zuverlässigkeit
ends
5:00 pm
Dr. Victor Tiederle
(RELNETyX)
Sven Nehrdich
(Jenaer Leiterplatten)
5:15 pm
Farewell of the conference participants and outlook on the 25th FED Conference 2017 in Berlin
4:15 pm
Prof. Dr. Rainer Thüringer, Chairman of the FED
Michael Matthes, Michael
Schleicher, Lars Böttcher, Michael
Morianz, Altium, FlowCad, Mentor,
Zuken
Keynote Speech
Fri 16/09/2016
09:45 am
Tim Cole
Tim Cole is an expert on topics
regarding the Internet, eBusiness,
Social Web and IT Security. Born
in Washington in 1950, he lived
for more than 40 years in
Germany, working as a journalist,
book author, TV host and speaker
at congresses and corporate
events. As a columnist and
commentator, he is well
appreciated for his clear and
neutral analyses and his critical
assessment of technological
developments in Germany and in
the world, as well as their
consequences for the economy.
Internet publisher and
bestselling author
Enterprise 2020 - The Internet was just the beginning
Germany at a digital crossroads
Why do some companies find it
so hard to handle the changes of
the digital age, and why do others
succeed? Why is Apple today
worth more than GE, Wal-Mart,
GM and McDonald's together?
And, above all, why is there not a
single German enterprise that can
compete with the ”Big 4“ – Apple,
Google, Facebook and Amazon?
Internet publisher and bestselling
author Tim Cole will address these
and other questions in his speech.
His thesis: the next five to ten
years will decide who is part of
the winners and who is part of the
losers of the digital transformation. Companies need to
reinvent themselves, give up wellknown habits and ways of
thinking, and adapt internal
processes to the pressure of the
new. This concerns all company
areas, from sales to purchasing,
from marketing to logistics, from
manufacturing to human
resources.
Wed, 14/09/2016
FED General Meeting
Use your opportunity to shape
our association!
We are pleased to invite all of
our members to attend our FED
General Meeting 2016 on
14 September 2016 at Maritim
Hotel Bonn.
Afterwards, participants will get
together for a snack and an
evening of networking.
“Digital Transformation“ is a term
Cole would like to be understood
as a wake-up call. To him,
Germany is standing at a digital
crossroads today: there is an
actual risk of other countries,
especially the so-called
developing countries, to catch up
with Germany or even start to
overtake. It is about time to set
the course for the digital future –
and time is short.
Please note!
Contrary to former
practice, the General
Meeting will already
be held on
Wednesday evening
and not on Thursday.
06:00 pm
Thu 15/09/2016 - Fri 16/09/2016
Trade
Exhibition
Plenarvortrag
Accompanying exhibition – a cross-section of the field of electronics
The event area has been perfectly
integrated into the Maritim Hotel
Bonn. Its generous foyer with an
exhibition area of approx. 1,000
sq. offers an excellent open-space
setting for the accompanying
trade exhibition.
tions at the Speakers' Corner as
well as hard- and software demos.
Take part in our trade exhibition
as an exhibitor and use the
opportunity to present your
company to a broad professional
audience!
Presentations will be held at the
various seminar rooms directly
connected to the foyer. As usual,
coffee breaks will take place
directly inside the exhibition area.
During session breaks, you can
look forward to short presenta-
Thu 15/09/2016
PCB Design Award
Plenarvortrag
07:00 pm
20:00 Uhr
Awarding of the PCB Design Award 2016
PCB and assembly designers
represent the bridge between electronics development and manufacturing. They are the interface
for all people involved in the development process, where all requirements merge.
The start of the evening event of
the 24th FED Conference in Bonn
has for the third time been reserved for those PCB designers who
have submitted a sample of their
work.
The judging panel will finally
disclose the best-kept secret of
the industry – the winners of the
PCB Design Award.
The PCB Design Award 2016 will
be awarded in four categories:
Ÿ3D/Space
ŸHigh-Power
ŸHigh Wiring Density, High
Transfer Rates, HDI
ŸSpecial Creativity
Three candidates are nominated
as per category and invited to our
evening event, and one of each
will win the PCB Design Award
2016 in the chosen category. Furthermore, one of the competition's participants can look forward
to winning an Apple iPad in our
lottery. We would like to thank
the sponsoring companies who
have supported the FED in this
call.
Event
Venue
Plenarvortrag
Maritim Hotel Bonn
Godesberger Allee
53175 Bonn
The 24th FED Conference will be held at the
Maritim Hotel Bonn. Along with its universities, a
number of Fraunhofer Institutes, the German Aerospace Center (DLR) and a high-performance IT sector, Bonn has developed into a centre for economy
and science.
Upon request, we will be glad to provide you with
a further selection of hotels, or please refer to the
overview at our conference website. Please book
your accommodation as early as possible. Contingencies are limited. Keyword for room reservation:
FED.
Room reservation
We kindly ask you to reserve your rooms as early
as possible (keyword: FED).
We kindly ask you to reserve your own hotel room
and settle the accommodation costs yourself.
Maritim Hotel Bonn
Tel. +49 (0)228 8108 777 or E-Mail
[email protected]
Keyword: FED
Single room from 119.00 EUR/night/person incl.
breakfast. This contingency will be available to you
until 03 August 2016.
© Maritim Bonn
Your
Contact
Plenarvortrag
FED e.V.
Frankfurter Allee 73c
10247 Berlin
Tel.: +49 (0) 30 340 60 30 50
Fax: +49 (0) 30 340 60 30 61
www.fed.de
[email protected]
www.facebook.com/fachverbandelektronikdesign
Registration
Plenarvortragfor 24th FED Conference
Conference attendance
No. 01-03: Early booking discount of 10% before 15 July 2016
Members
Non-Members
01
Conference 1 Day on Thu (15/09/2016) incl. evening event
490 EUR
710 EUR
02
Conference 1 Day on Fri (16/09/2016)
490 EUR
710 EUR
03
Conference 2 Days (15 and 16/09/2016) incl. evening event
850 EUR
1,200 EUR
04
Additional person evening event (15/09 from 6:30 pm)
70 EUR
100 EUR
05
Student (fee per day)
100 EUR
100 EUR
Trade exhibition
A1
Premium Partner exhibitor package 2 days (15 - 16/09/2016)
Members
Non-Members
3,500 EUR
4,900 EUR
1,340 EUR
1,990 EUR
690 EUR
990 EUR
incl. 2 booth staffs, incl. advertising package (logo at website, conference
programme and advert, slot at Speakers' Corner), free choice of place
A2
Standard exhibitor package 2 days (15 -16/09/2016)
incl. 1 booth staff
A3
additional booth staff 2 days (15 -16/09/2016)*
A1 - A3 plus VAT
* max. 2 booth staffs per exhibition booth incl. conference attendance and evening event
Your data/conditions of participation
With this registration, I accept the conditions
of participation stated below and the terms
and conditions of the FED.
Company
http://www.fed.de/downloads/AGB_2014.pdf
Invoice Adress
Participant First Name Last Name
Date, Stamp, Signature
Telephone, Fax, E-Mail
Participation fees (01, 02, 03, 05, A1, A2, A3) include: conference participation (incl. attendance of all presentations and
the trade exhibition), conference transcript, lunch, snacks during breaks, refreshments during breaks, as well as (for 01, 03,
04, A1, A2, A3) dinner at the evening event, Thu 15/09/2016
incl. champagne reception.
Upon receipt of your registration, you will receive your
invoice as a confirmation of registration. The amount stated
on the invoice has to be remitted to the FED prior to the start
of the event. You can cancel your registration up to four
weeks prior to the start of the event at no charge. Later than
that, cancellation is only possible up to two weeks prior to the
start of the event at a charge of 10 % of the total invoice
amount. Upon expiry of this deadline, the full amount of the
invoice has to be paid in any case. The legal right of withdrawal according to paragraph 6 will remain unaffected by
this. Cancellations need to be received in writing by mail (as
evidenced by postmark), E-Mail or fax. In case of nonattendance or late cancellation, there is no right of refund of
the participation fees. It is possible to inform the office in writing about alternate participants in due time prior to the conference's start.
Fees do not include any hotel accommodation. Participants
are responsible for accommodation booking.
Please register by fax at +49 (0)30 340 60 30 61
or send an E-Mail to [email protected]
Online registration: http://j.mp/konf2016

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