High Reliability Cu Alloy Bonding Wire

CA-1
High Reliability Cu Alloy Bonding Wire
高信頼性対応Cu合金ボンディングワイヤ
Characteristics
特徴
● 高い接合信頼性
● Higher
bond reliability
● Wider bonding window
● Lower resistivity
● Softer FAB
● 広いボンディングウインドウ
● 低い電気抵抗
● 柔らかいFAB
Bond Reliability
HTS1300hrs
Ω20％Up Failar Ratio / ％
100
90
Bare Cu
80
CA-1
Bare Cu
70
60
50
40
Aging Temp. : 175℃
Mold Resin :
Conventional
(Non-Green)
30
20
10
CA-1
CA-1
0
0
500
1000
1500
2000
AgingTime / hr
WD : 18μｍ
2nd Bond Process Window
Bare Cu
0
CA-1
20
40
60
US (mA)
80 100 120 140 160 180 200
0
20
40
60
80
Force 100
(gf) 120
140
160
180
200
20
40
60
20
40
60
80
Force 100
(gf) 120
140
160
180
200
K&S iConn WD : 18μｍ
NSOL
Resistivity / uΩ・cm
4
3.1
3
1.9
2.2
1
0
Bare Cu
Pd Coated Cu
CA-1
Short Tail
FAB Hardness
Compression stress at 20%
deformation from initia / MPa
Resistivity
2
US (mA)
80 100 120 140 160 180 200
2N Au
12
110
FAB:38μｍ
100
90
80
70
AVE.
60
50
Bare Cu
CA-1
Pd coated Cu
CLR-1A
High Performance Cu Bonding Wire
高性能Cuボンディングワイヤ
Characteristics
特徴
● 高く安定したステッチ接合性
● High
and stable bondability
● Excellent reliability
● Wide bonding window
● 優れた接合信頼性
● 広いボンディングウインドウ
Characteristics of CLR-1A
Wire
cost
FAB Shape and Roundness
Squashed
2nd
Capillary
ball
life
roundness bondability
CLR-1A
Bare Cu
Au
Wire φ0.78mil
FAB φ1.5mil
Electrical resistance on uHAST
σ:0.65
100
Failure rate（Ω10%up）
2nd Pull Strength (mN)
80
70
60
50
Ave:71.3
φ20um,
n=140, Ag Frame
40
CLR-1A
σx-y=0.9
Reliability
90
σ:0.29
90mA
136ms
Ave:59.7
60
40
20
0
Bare Cu
CLR-1A （Halogen）
Bare Cu （Halogen）
CLR-1A （Green）
Bare Cu （Green）
80
0
400
800
1200
Aging Time（hrs）
2nd Bond Parameter Window
US Power
。
Storage Condition :130 C 85%
Failure = R/R0>10%
Wire Diameter : 25μm
BGA Substrate（FR-4）
Mold resin : Conventional type
3
Force
13
1600
CLR-1A
2nd Bondability
45mA
337ms

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