Session 4

UCPSS 2014 – PROGRAMME
TUESDAY 23 SEPTEMBER 2014
SESSION 4: FLUID DYNAMICS, MECHANICS
10:30 - 10:45
10:30 - 12:00
4.1 - Effect of DI-water dilution and etchant arm movement on spinning type wet
etch
1
1
1
2
Huihwan Lee , Dukmin Ahn , Seungtaek Lim , Taesung Kim
1
Samsung Electronics Co., South-Korea
SKKU Advanced Institute of Nanotechnology (SAINT) in Sungkyunkwan University, South-Korea
2
10:45 - 11:00
4.2 - Physical chemistry of water droplets in wafer cleaning with low water use
Jacques Van der Donck, Jurrian Bakker, Jeroen Smeltink, Robin Kolderweij, Ben Van der
Zon, Marc Van Kleef
TNO, The Netherlands
11:00 - 11:15
4.3 - Novel Slurry Injection System for Improved Slurry Flow and Reduced Defects in
CMP
Ara Philipossian, Leonard Borucki, Yasa Sampurno, Yun Zhuang
Araca Incorporated, United States of America
11:15 - 11:30
4.4 - Effect of viscoelasticity of PVA brush on friction during post- CMP cleaning: A
guideline for nodule configuration
1
1
2
2
Yoshitaka Hara , Toshiyuki Sanada , Akira Fukunaga , Hirokuni Hiyama
1
Shizuoka University, Japan
Ebara Corporation, Japan
(student paper)
2
11:30 - 11:45
4.5 - Fluid flow and defect density considerations when drying bumped wafers using
spin and surface tension gradient methods
Daniel Goodman, Dustin Rabideau, Mani Sobhian
TEL-NEXX Inc., United States of America
11:45 - 12:00
4.6 - Detection of HO2•/O2•- Radicals Formed in Aqueous Solutions Irradiated with
Megasonic Waves using a Cavitation Threshold (CT) Cell Set-up
1
1
2
3
Srini Raghavan , Zhenxing Han , Ian Brown , Mark Beck
1
University of Arizona, United States of America
Tokyo Electron Ltd., United States of America
3
Product Systems, Inc., United States of America
2
12:00 - 13:45
LUNCH – POSTER VIEWING
UCPSS 2014 Programme - version 4 August 2014 – page 1

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