UCPSS 2014 – PROGRAMME MONDAY 22 SEPTEMBER 2014 SESSION 1C - FEOL: ETCHING OF IV-SEMICONDUCTORS 16:00 - 16:15 16:00 - 17:15 1.7 - Process Control Challenges of Wet Etching Large MEMS Si Cavities Ismail Kashkoush, Jennifer Rieker, Gim Chen, Dennis Nemeth Akrion Systems, United States of America 16:15 - 16:30 1.8 - Wet etch rate behavior of poly-Si in TMAH solution at various ambient gas conditions 1 1 1 1 1 1 1 Ted Guo , Lin Euing , C.C. Chien , M.H. Chang , Yu Wesley , N.H. Yang , J.F. Lin , J.Y. 1 2 2 2 Wu , M. Robb Kenneth , Baldaro Alessandro , A.N. Other 1 United Microelectronic Corporation, Taiwan Lam Research Corporation, Austria 2 16:30 - 16:45 1.9 - Advanced Monitoring of TMAH Solution Jingjing Wang, Eugene Shalyt, Chuannan Bai, Guang Liang, Michael MacEwan, Vishal Parekh ECI Technology, United States of America 16:45 - 17:00 1.10 - Effect of Dissolved Oxygen for Advanced Wet Processing Yukifumi Yoshida SCREEN, Belgium 17:00 - 17:15 1.11 - Watermark formation on bare silicon: Impact of illumination and substrate doping Amir-Hossein Tamaddon, Harold Philipsen, Paul W Mertens, Frank Holsteyns, Marc Heyns, Stefan De Gendt, Dennis H. Van Dorp IMEC, Belgium (student paper) SESSION 1D - FEOL: SI3N4 ETCHING 17:15 - 17:30 17:15 - 17:45 1.12 - Selective Nitride Etching With Phosphoric and Sulfuric Acid Mixtures Using a Single-Wafer Wet Processor 1 2 2 1 Jeffrey Lauerhaas , Vincent Sih , Berthold Reimer , Anthony Ratkovich , Jeffery 1 Butterbaugh 1 TEL FSI, Inc., United States of America Global Foundries, Germany 2 17:30 - 17:45 1.13 - Single wafer selective silicon nitride removal with phosphoric acid and steam 1 1 1 1 1 1 1 Ted Guo , Yu Wesley , C.C. Chien , Lin Euing , N.H. Yang , J.F. Lin , J.Y. Wu , Ratkovich 2 2 2 2 Anthony , Kahaian Don , W. Butterbaugh Jeffery , M. Lauerhaas Jeffrey 1 United Microelectronic Corporation, Taiwan TEL FSI, United States of America 2 17:45 - 19:15 EXHIBITOR RECEPTION - POSTER SESSION UCPSS 2014 Programme - version 4 August 2014 – page 1
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