UCPSS 2014 – PROGRAMME
MONDAY 22 SEPTEMBER 2014
SESSION 1C - FEOL: ETCHING OF IV-SEMICONDUCTORS
16:00 - 16:15
16:00 - 17:15
1.7 - Process Control Challenges of Wet Etching Large MEMS Si Cavities
Ismail Kashkoush, Jennifer Rieker, Gim Chen, Dennis Nemeth
Akrion Systems, United States of America
16:15 - 16:30
1.8 - Wet etch rate behavior of poly-Si in TMAH solution at various ambient gas
conditions
1
1
1
1
1
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1
Euing Lin , Ted Guo , C.C. Chien , M.H. Chang , Wesley Yu , N.H. Yang , J F Lin , J.Y.
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2
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2
2
Wu , Kenneth M. Robb , Alessandro Baldaro , L.F. Hung , Jerry Chang
1
United Microelectronic Corporation, Taiwan
Lam Research Corporation, Austria
2
16:30 - 16:45
1.9 - Advanced Monitoring of TMAH Solution
Jingjing Wang, Eugene Shalyt, Chuannan Bai, Guang Liang, Michael MacEwan, Vishal
Parekh
ECI Technology, United States of America
16:45 - 17:00
1.10 - Effect of Dissolved Oxygen for Advanced Wet Processing
Yukifumi Yoshida
SCREEN, Belgium
17:00 - 17:15
1.11 - Watermark formation on bare silicon: Impact of illumination and substrate
doping
Amir-Hossein Tamaddon, Harold Philipsen, Paul W Mertens, Frank Holsteyns, Marc
Heyns, Stefan De Gendt, Dennis H. Van Dorp
IMEC, Belgium
(student paper)
SESSION 1D - FEOL: SI3N4 ETCHING
17:15 - 17:30
17:15 - 17:45
1.12 - Selective Nitride Etching With Phosphoric and Sulfuric Acid Mixtures Using a
Single-Wafer Wet Processor
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Jeffrey Lauerhaas , Vincent Sih , Berthold Reimer , Anthony Ratkovich , Jeffery
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Butterbaugh
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TEL FSI, Inc., United States of America
Global Foundries, Germany
2
17:30 - 17:45
1.13 - Single wafer selective silicon nitride removal with phosphoric acid and steam
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Ted Guo , Yu Wesley , C.C. Chien , Lin Euing , N.H. Yang , J.F. Lin , J.Y. Wu , Ratkovich
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Anthony , Kahaian Don , W. Butterbaugh Jeffery , M. Lauerhaas Jeffrey
1
United Microelectronic Corporation, Taiwan
TEL FSI, United States of America
2
17:45 - 19:15
EXHIBITOR RECEPTION - POSTER SESSION
UCPSS 2014 Programme - version 1 September 2014 – page 1

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