SEMICONDUCTOR TECHNOLOGY -CMOSFire Tom Wada 2015/10/1 1 What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails. Currently, 1000M transistors can be integrated. 1000 times integration comparing to 20 yrs ago. The cost of the chip is roughly same. All electronic equipments are powered by LSIs. PCs, Cellular phones, 3D graphics, Internet. 2015/10/1 2 PC mother board Large Scale Integration 2015/10/1 3 SONY PLAYSTATION 2 MAINBOARD Rendering LSI Graphics LSI High Speed Memory Direct RDRAM 2015/10/1 4 Mobile Phone Mainboard Memory, Logic, Analog 2015/10/1 5 Key device is LSI INTEL Pentium III module 2015/10/1 6 This is a packaged LSI -Pentium III 300MHz Cache LSI20 mm 15 mm 2015/10/1 7 Si chip is molded in the package. 2 million transistor Chip is connected to the pins thru wires. 2015/10/1 8 6 inches Si wafer 2015/10/1 9 8 inches Si wafer Hundreds of Chips on a Si Wafer 2015/10/1 10 Several hundreds of chips are fabricated on a wafer simultaneously. 2015/10/1 11 Chip photo - Motion Estimation Chip for HDTV camera 9.1 mm 8.6 mm 2015/10/1 Your small finger’s nail size. 200M transistors. 12 Scanning Electron Microscope photo - Cross-section of the LSI - 2015/10/1 0.5 micron 13 Structure Of CMOS LSI Isolation Si Substrate Bulk, epitaxial , SOI Well Structure 2015/10/1 N-type well in P-type Substrate Latch Up PN-Isolation, Local oxidation PNP Bipolar Transistor and NPN Bipolar Transistor Fabrication Process Technology 14 Cross-section of the LSI Metal wiring Poly-silicon N+ Poly-silicon N+ N-type MOS transistor P+ P+ P-type MOS transistor N-type well P-type Si substrate Si wafer 2015/10/1 15 Advanced Process Development Transistor module （FEP) SiGe/Metal gate High κ Gate insulator Low Resistance Ultra shallow junction Low stress Shallow Trench Isolation 2015/10/1 65nm Lithography(VUV, EPL) Mask Multi-level Metalization Module （BEP) Fine Cu interconnect Low κ interdielectric CMPplanarization Low Resistance Contact with High Aspect ratio 16 LSI integration trend - Moore’s law 10B Number of transistors on a chip DVD-RAM DVD player 1B Digital HDTV receiver DVD recorder DVD-ROM 100M 10M The number of transistors are increasing by 58% per year. Wide-TV, PHS phone 1M - Moore’s Law - 100K 0.8 10K Source: SEMATEC 1K 81 2015/10/1 0.5 0.3 0.18 0.13 CHANNEL LENGTH (MICRON) 83 85 87 89 91 93 95 97 99 01 03 05 07 09 17 Communications and Consumer Products Drive Semiconductor 45% Cellular Phones Digital Camera 40% 30% CAGR % (1997-2002) 25% 20% 15% Smart Cards/Kiosks Advanced Desktop PC and Workstation Automotive Applications/GPS Video Camera 10% Switching & LAN Smart Appliance-Phone Multimedia PC Portable Computing HDTV Color TV 1st Generation 2nd Generation 3rd Generation 0% 5% Semiconductor Industry 10% 15% Sources: Applied Materials Corporate Marketing estimates, Dataquest 2015/10/1 Internet Game Consoles Car Radio 5% 0% DVD Player Application Market Growth 35% Set-Top Box 20% 25% 30% 35% 40% 45% 50% 55% SC Content (As % of Equipment Cost) 18 FABRICATION PROCESS ISSUES 2015/10/1 19 Ultra Clean Room 2015/10/1 20 Basic LSI process Layer Deposition SEM photo of Logic LSIs M7 lithography M6 M5 M4 etching M3 M2 M1 cleaning 2015/10/1 21 Light Source Lens Mask A Lens Si Wafer AAAAAAAAAAAAAA AAAAAAAAAAAAAA AAAAAAAAAAA Stage Y X Projection 2015/10/1 22 Packaging & Test Remove Process defect Chips Functional Test，DC Test Wafer Test Wafer Final Test I scribing Testing Pre Test Functional Test，DC/AC Test Chips Assembly Flow Burn-In Mounting Bonding Final Test II Shipping Test Functional Test(at Speed)，DC/AC Test Enclosing marking 2015/10/1 Ex.)Vcc:7V，Temp.:125℃, 24～42hrs Sample 23 Large Scale Integration NMOS , PMOS and Wiring 2015/10/1 All Logic Function can be made Memory Element Can be made Billions of Transistors and wiring make LSI! 24 CMOS NOT (Inverter) 2015/10/1 25 CMOS NAND と NOR 2015/10/1 A B f 0 0 1 0 1 1 1 0 1 1 1 0 A B f 0 0 1 0 1 0 1 0 0 1 1 0 26 Classification Of LSI 3. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory) Analog LSI: ADC, DAC, Filter, Amplifier Micro Processor (PC’s central processing Unit) 1. 2. Memory LSI: Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 years Static Random Access Memory : work memory for mobile equipments Flash Memory : Nonvolatile memory , Digital Camera Storage Analog LSI: 2015/10/1 Perform Digital computation according to the program in Memory Integration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion 27 Analog to Digital Conversion Analog to Digital Sample the analog wave Convert to Digital format in Binary Same as f(t) to An Continuous time ADC LSI Discrete time 2015/10/1 28 Chip photo 1 SoC 2015/10/1 Flash Memory 29 Chip photo 2 Mobile Digital TV receiver 2015/10/1 30
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