FSS 2015 - Technologiezentrum Halbleitermaterialien THM

INFORMATION
Further information regarding the symposium, hotels,
travel information and organisation can be found at:
www.thm.fraunhofer.de/de/FSS
FRAUNHOFER TECHNOLOGY CENTER
tu-freiberg.de/en/researchforum/organization
FOR SEMICONDUCTOR MATERIALS THM
„Neue Mensa“, Agricolastraße 10a,
B101
direction A4
„L
eip
D-09599 Freiberg
ge
rS
tra
zi
Preregistration:
FSS 2015
express2.converia.de/frontend/index.php?page_id=1028
parking
“
Registration on-site on June 18th at:
LOCATIONS
e
„Agricolastraß
REGISTRATION
1
Symposium
„Clemens-Winkler-Bau“
2
On-site Registration
„Neue Mensa“
ße
“
1
2
bach
s
email: [email protected]
tr
„Me
r
phone: +49 (0) 3731 393065
aß
e“
For questions regarding registration, please contact at:
Symposium fee:
e
„M
100€ per day (plus catering 20€ per day)
rR
ne
iss
“
ing
to B173
direction
Dresden
External students and PhD students - 50€ per day
No registration fee for first authors of oral contributions
SYMPOSIUM ADDRESS
SYMPOSIUM ORGANIZATION
„Clemens-Winkler-Bau“, Leipziger Straße 29,
Fraunhofer Technologiezentrum Halbleitermaterialien THM
D-09599 Freiberg
Dr. Sindy Würzner / Prof. Dr. Hans Joachim Möller
Am St.-Niclas-Schacht 13,
The symposium is held within the frame of the 66. Berg-
D-09599 Freiberg
und Hüttenmännischen Tag of the TU Bergakademie Freiberg.
email: [email protected]
[email protected]
2. Freiberg Sawing Symposium
June 18 th and 19 th 2015
SYMPOSIUM INVITATION
FSS 2015
FRAUNHOFER THM IN COOPERATION WITH
TE C H N I C A L U N I V E R S I T Y
2. Freiberg Sawing Symposium
BERGAKADEMIE FREIBERG
J U N E 1 8 TH A N D 1 9 TH
Wafer characterization, fundamentals, modeling
and other materials
14:00
Thursday, June 18
New developments in wire sawing of solar silicon
07:30
08:30
09:00
14:30
10:30
11:00
09:45
Wafer sawing as the first step for a successful
texturization; Acker, J. (FH Lausitz / BTU Cottbus,
Germany)
Mechanical strength of multicrystalline silicon
10:00
Cold split - A new technology for kerf-less
wafering of silicon; Beyer, C. (Siltectra GmbH,
Industrial sawing of multicrystalline silicon;
Dresden, Germany)
Naumann, O. (SolarWorld AG, Freiberg, Germany)
16:00
Impact of sawing parameters on the wafer
Industrial sawing with structured wires; Sunder, K.
A macroscopic model of the sawing of silicon by a
10:15
16:30
Germany)
processes; Schweckendiek, J. (RENA
Investigation of the scratching mechanism;
Technologies GmbH, Berg, Germany)
Würzner, S. (FhG THM, Freiberg, Germany)
17:00
SIREX – A new method to investigate surface
diamond electroplated wire; Ly, M.
damage of sawn wafers; Herms, M. (PVA Tepla,
(Thermocompact, Pringy, France)
Jena, Germany)
17:30
Current Si topics from the perspective of an
equipment manufacturer for wet chemical PV
surface quality; Buchwald, R. (FhG THM, Freiberg,
Diamond wire sawing of monocrystalline silicon;
10:30
Coffee break
Recycling of silicon from wafering fluids and new usage
11:00
Silicon recovery from wafer sawing process:
Influence of micromechanical sawing parameters:
challenges, solutions, and outlook; Luo, Y.
Surface finish and mechanical strength of
a 3D discrete element study; Nassauer, B. (TUBAF,
(PlusMat AG, Schüpfen, Switzerland)
diamond wire sawn wafers; Penot, J. D. (CEA-
Freiberg, Germany)
Coffee break
Impurities impact on diamond wire sawing;
11:30
Recycling of silicon kerf loss; Fillon, B. (CEAINES, Le Bourget-du-Lac, France)
Friday, June 19
Wet chemical etching and cleaning of silicon
12:00
Modern slurry recycling processes and cost
reduction; Mayer-Uhma, T. (SiC processing,
(session together with Freiberg Silicon Days)
Bautzen, Germany)
Extending the diamond wire sawing window for
PV wafer slicing; Jodlowski, T. (Applied Materials
12:30
Investigation of wafer saw damage; Wasmer, K.
Coffee break
Grillet, N. (CEA-INES, Le Bourget-du-Lac, France)
12:00
Germany)
Schönfelder, S. (FhG CSP, Halle, Germany)
INES, Le Bourget-du-Lac, France)
11:30
with acidic solutions; Stapf, A. (TUBAF, Freiberg,
Switzerland)
15:30
Registration at “Neue Mensa“
(PV Crystalox Solar, Erfurt, Germany)
10:00
Pyramidal texturing of monocrystalline Si-wafers
solution; Assi, F. (Meyer Burger, Thun,
wafer considering microstructural defects;
Retsch, S. (NorSun, Oslo, Norway)
09:30
GmbH, Freudenstadt, Germany)
09:30
(EMPA, Thun, Switzerland)
15:00
Cost efficient organic inline cleaning for all Si
wafer sawing processes; Sen, I. (Gebr. SCHMID
Sawing and characterizing hard and brittle
materials, from the concept to the competitive
PROGRAM
09:15
09:00
Influence of fluid flow and gas content on
HCT, Cheseaux, Switzerland)
megasonic cleaning of Si wafers; Reeske, G.
Lunch break
(Siltronic AG, Burghausen, Germany)
12:30
Si powder based concepts for advanced PV;
Ulyashin, A. (Sintef, Oslo, Norway)
13:00
Final remarks, end of symposium

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