LXDC2HN TypeF series

LXDC2HN TypeF series
Micro DC-DC converter
1. Features
2
 Low EMI noise and small footprint (5mm ) using inductor-embedded ferrite substrate
 High efficiency using synchronous rectifier technology at 3MHz operation
 PFM/PWM automatic mode switching function
 Smooth mode transient between PFM mode and PWM mode
with low-ripple-voltage PFM mode
 2% DC voltage accuracy over full load current range
 Wide input voltage range : 2.3~5.5V
 Maximum Load Current: 600mA (depends on output voltage)
 Fixed output voltage: 0.8V – 4V (factory setting, 50mV step)
 Internal soft start, overcurrent protection
 Better reliability at high temperature operation compared to typeA
2. Description
The LXDC2HN series is a low power step-down DC-DC converter, which is suitable for a space-limited or a
noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate
eliminates radiated EMI noise and conduction noise efficiently.
By just putting input/output capacitors, it can be used as a LDO replacement. Its low noise feature and easy to
assembly feature assures reliable power supply quality.
The device works in PFM mode at light load and it extends the battery life. At heavy load, its control mode
changes to PMW mode automatically and it keeps high efficiency using synchronous rectifying technology.
The device keeps good output voltage accuracy even in PFM mode. It keeps 2% DC voltage accuracy over full
current range (0-600mA), and shows very smooth mode transient between PFM mode and PWM mode.
LXDC2HN series has resin top coast to make it easy to be picked up in factory assembly.
TypeF uses MLCC of X6S/X6T temperature characteristics, so it is suitable for applications which need higher
reliability or higher operating temperature.
3. Typical Application Circuit
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
4. Mechanical details
4-1 Outline
Device &Trace
Code
Top View
W
1 pin Mark
Bottom View
a
X X
X X X
c
1
2
4
3
b
c
L
Resin
Side View
T
Substrate
Unit: mm
Mark
Dimension
L
2.5 +/- 0.2
W
2.0 +/- 0.2
T
1.3 MAX
a
0.85 +/- 0.1
b
0.60 +/- 0.1
c
0.15 +/- 0.15
4-2. Pin Function
Pin
1
Symbol
Vin
I/O
Input
2
EN
Input
3
Vout
Output
4
GND
-
Description
Vin pin supplies current to the LXDC2HN internal regulator.
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
Regulated voltage output pin.
Apply output load between this pin and GND.
Ground pin
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
4-3. Functional Block Diagram
5. Ordering Information
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC2HN10F-238
1.0V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN11F-313
1.1V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN12F-162
1.2V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN1CF-262
1.25V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN13F-237
1.3V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN1DF-242
1.35V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN15F-231
1.5V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN18F-163
1.8V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN23F-177
2.3V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN25F-164
2.5V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN28F-234
2.8V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN30F-239
3.0V
MLCC lifetime improved type
T/R, 2500pcs/R
LXDC2HN33F-175
3.3V
MLCC lifetime improved type
T/R, 2500pcs/R
# Output voltage can be set 50mV step from 0.8V to 4.0V.
Please ask Murata representative.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
6. Electrical Specification
6-1
Absolute maximum ratings
Parameter
Input voltage
Operating ambient temperature
symbol
rating
Vin, EN
6.3
Ta
Operating case temperature
TC
Storage temperature
TSTO
Unit
V
-40 to +85
o
-40 to +125
o
-40 to +85
o
C
C
C
6-2 Electrical characteristics (Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input voltage
Vin
2.3
3.6
5.5
V
UVLO voltage
UVLO
1.0
1.4
1.8
V
0
2
uA
LXDC2HN10F-238
LXDC2HN11F-313
LXDC2HN12F-162
LXDC2HN1CF-262
Vin=3.6V,
EN=0V
Input leak current
LXDC2HN13F-237
LXDC2HN1DF-242
LXDC2HN15F-231
lin-off
LXDC2HN18F-163
LXDC2HN23F-177
LXDC2HN25F-164
Vin=5.0V,
EN=0V
LXDC2HN28F-234
LXDC2HN30F-239
LXDC2HN33F-175
Vin-Vout>1V
Output voltage
accuracy
Vout
Vin-Vout>0.7V
Vin-Vout>0.5V
LXDC2HN10F-238
0.976
1.0
1.024
LXDC2HN11F-313
1.076
1.1
1.124
LXDC2HN12F-162
1.176
1.20
1.224
LXDC2HN1CF-262
1.225
1.25
1.275
LXDC2HN13F-237
1.27
1.30
1.33
LXDC2HN1DF-242
1.323
1.35
1.377
LXDC2HN15F-231
1.47
1.50
1.53
LXDC2HN18F-163
1.764
1.80
1.836
LXDC2HN23F-177
2.254
2.30
2.346
LXDC2HN25F-164
2.45
2.50
2.55
LXDC2HN28F-234
2.744
2.80
2.856
LXDC2HN30F-239
2.94
3.00
3.06
LXDC2HN33F-175
3.234
3.30
3.366
V
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
LXDC2HN10F-238
LXDC2HN11F-313
LXDC2HN12F-162
LXDC2HN1CF-262
LXDC2HN13F-237
0
600
LXDC2HN1DF-242
Load current range
Iout
mA
LXDC2HN15F-231
LXDC2HN18F-163
LXDC2HN23F-177
0
500
LXDC2HN28F-234
0
450
LXDC2HN30F-239
0
400
LXDC2HN33F-175
0
300
LXDC2HN25F-164
LXDC2HN10F-238
LXDC2HN11F-313
LXDC2HN12F-162
LXDC2HN1CF-262
Ripple voltage
Vrpl
Vin=3.6V,
Iout=300mA,
BW=100MHz
LXDC2HN13F-237
LXDC2HN1DF-242
15
LXDC2HN15F-231
30
mV
LXDC2HN18F-163
LXDC2HN23F-177
LXDC2HN25F-164
Vin=5V,
Iout=300mA,
BW=100MHz
Vin=3.6V,
Iout=150mA
Efficiency
EFF
Vin=5V,
Iout=150mA
LXDC2HN28F-234
LXDC2HN30F-239
LXDC2HN33F-175
LXDC2HN10F-238
73
78
LXDC2HN11F-313
75
79
LXDC2HN12F-162
75
80
LXDC2HN1CF-262
76
81
LXDC2HN13F-237
76
81
LXDC2HN1DF-242
77
82
LXDC2HN15F-231
78
83
LXDC2HN18F-163
81
85
LXDC2HN23F-177
83
87
LXDC2HN25F-164
84
88
LXDC2HN28F-234
82
86
LXDC2HN30F-239
83
87
LXDC2HN33F-175
84
88
%
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Parameter
EN control voltage
SW Frequency
Symbol
Condition
VENH
ON ; Enable
VENL
OFF ; Disable
Fosc
Min.
Typ.
Max.
Unit
1.4
Vin
V
0
0.25
V
MHz
2.5
3.0
3.5
600
900
1200
LXDC2HN10F-238
LXDC2HN11F-313
LXDC2HN12F-162
LXDC2HN1CF-262
LXDC2HN13F-237
LXDC2HN1DF-242
mA
LXDC2HN15F-231
OCP
Over current
protection
LXDC2HN18F-163
LXDC2HN23F-177
500
900
1200
LXDC2HN28F-234
500
900
1200
LXDC2HN30F-239
400
700
1200
LXDC2HN33F-175
300
700
1200
LXDC2HN25F-164
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN voltage or Vin voltage
Tlatch
Start-up time
Latch-up mask time
@Vout=0.8×Vnom
Ton
20
usec
0.9
msec
(*1) External capacitors (Cin:4.7uF,Cout:10uF) shall be placed near the module in order to proper operation.
(*2)The above characteristics are tested using the application circuit on section 8
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
6-3
Thermal and Current De-rating Information
The following figure shows the power dissipation and temperature rise characteristics example. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
Loss - ΔT Characteristics (Vin=3.6V, Vo=1.8V)
50
350
45
40
300
35
250
ΔT ( oC）
Power Dissipation (mW)
Io - Loss Characteristics (Vin=3.6V, Vo=1.8V)
400
200
150
30
25
20
15
100
10
50
5
0
0
0
100
200
300
400
500
600
Io (mA)
0
100
200
300
400
Power Dissipation (mW)
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
o
especially be taken in applications where the device temperature exceeds 85 C.
o
The case temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Capacitor B1 Life vs Capacitor Case temperature
1000000
Vin=5V
Vin=3.6V
)
s
r100000
u
o
H
d
n 10000
a
s
u
o
T
(
1000
fe
i
L
1
B
r
100
o
ti
c
a
p
a
C
10
Vin=3.3V
Vin=2.5V
1
20
40
60
80
100
120
Capacitor Case Temprature (o C )
The following steps should be taken before the design fix of user’s set for a reliable operation.
o
1. The ambient temperature of the device should be kept below 85 C
2. The case temperature should be measured on the worst condition of each application. The temperature must
o
be kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be considered as same as the case temperature. Considering the above
figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
7. Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic one switching pulse to keep high efficiency at light load.
The device uses constant on time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark threshold
is about 100-200mA
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when EN pin kept high. UVLO function keeps away of an unstable operation at low Vin range
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light
load but will not work at heavy load.
Pulling the EN pin to logic low forces the device shutdown. The device does not have a discharge function when it
turns off. If you prefer a discharge function, please contact Murata representative.
100% Duty Cycle Operation
The device can operate 100% duty cycle mode, in which high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout becomes close and the duty gets close to 100%, the switching pulse will skip the nominal
switching period and the output voltage ripple may be larger than other condition. It should be noted that this
condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.
After it is shut down, it can be restarted by toggling the Vin or EN voltage.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
8. Test Circuit
LXDC2HN
Cin :
4.7uF/6.3V
(GRM188B30J475K)
Cout :
10uF/6.3V
(GRM188B30J106M)
9. Reference Land Pattern
Unit: mm
Mark
Dimension
a
0.85
b
0.60
c
0.5
d
0.2
Notes: this land layout is for reference purpose only.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
10. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0244)
Measurement setup
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external
voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable
switch should not to be set to the middle position.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Efficiency
・Vin=3.6V, Vout=1.0V
・Vin=3.6V, Vout=1.2V
Efficiency
85
75
80
EFF [%]
EFF [%]
Efficiency
80
70
65
75
70
60
65
1
10
100
1000
1
10
Iout [mA]
100
1000
100
1000
・Vin=3.6V, Vout=1.5V
Efficiency
Efficiency
85
85
80
80
EFF [%]
EFF [%]
1000
Iout [mA]
・Vin=3.6V, Vout=1.35V
75
70
75
70
65
65
1
10
100
1000
1
10
Iout [mA]
Iout [mA]
・Vin=3.6V, Vout=1.8V
・Vin=3.6V, Vout=2.5V
Efficiency
Efficiency
90
95
85
90
EFF [%]
EFF [%]
100
80
75
85
80
70
75
1
10
100
1000
1
Iout [mA]
10
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=5.0V, Vout=3.0V
・Vin=5.0V, Vout=3.3V
Efficiency
95
90
90
EFF [%]
EFF [%]
Efficiency
95
85
80
85
80
75
75
1
10
100
1000
1
Iout [mA]
10
100
1000
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Load Regulation
・Vin=3.6V, Vout=1.0V
Load Regulation
1.024
Load Regulation
1.224
1.012
Vout [V]
Vout [V]
・Vin=3.6V, Vout=1.2V
1.000
0.988
1.212
1.200
1.188
0
100
200
300
400
500
600
0
100
200
Iout [mA]
Load Regulation
600
500
600
500
600
Load Regulation
1.530
1.515
Vout [V]
Vout [V]
500
・Vin=3.6V, Vout=1.5V
1.364
1.350
1.500
1.485
1.337
1.470
1.323
0
100
200
300
400
500
0
600
100
200
・Vin=3.6V, Vout=1.8V
400
・Vin=3.6V, Vout=2.5V
Load Regulation
1.836
300
Iout [mA]
Iout [mA]
Load Regulation
2.550
2.525
Vout [V]
1.818
Vout [V]
400
Iout [mA]
・Vin=3.6V, Vout=1.35V
1.377
300
1.800
1.782
2.500
2.475
1.764
2.450
0
100
200
300
400
500
600
0
Iout [mA]
100
200
300
400
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=5.0V, Vout=3.0V
・Vin=5.0V, Vout=3.3V
Load Regulation
3.060
3.333
Vout [V]
3.030
Vout [V]
Load Regulation
3.366
3.000
3.300
2.970
3.267
2.940
3.234
0
100
200
300
400
500
0
600
100
200
300
400
500
600
Iout [mA]
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
Output Ripple-Noise
・Vin=3.6V, Vout=1.0V, BW : 150MHz
・Vin=3.6V, Vout=1.2V, BW: 150MHz
Output Ripple Noise
Vrpl [mV]
Vrpl [mV]
Output Ripple Noise
50
45
40
35
30
25
20
15
10
5
0
0
100
200
300
400
500
50
45
40
35
30
25
20
15
10
5
0
600
0
100
200
Iout [mA]
300
400
500
600
0
100
200
600
500
600
Output Ripple Noise
Vrpl [mV]
Vrpl [mV]
Output Ripple Noise
300
400
・Vin=3.6V, Vout=2.5V, BW: 150MHz
50
45
40
35
30
25
20
15
10
5
0
200
300
Iout [mA]
・Vin=3.6V, Vout=1.8V, BW: 150MHz
100
500
50
45
40
35
30
25
20
15
10
5
0
Iout [mA]
0
600
Output Ripple Noise
Vrpl [mV]
Vrpl [mV]
Output Ripple Noise
200
500
・Vin=3.6V, Vout=1.5V, BW: 150MHz
50
45
40
35
30
25
20
15
10
5
0
100
400
Iout [mA]
・Vin=3.6V, Vout=1.35V, BW: 150MHz
0
300
400
500
600
50
45
40
35
30
25
20
15
10
5
0
0
Iout [mA]
100
200
300
400
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=5.0V, Vout=3.0V, BW: 150MHz
・Vin=5.0V, Vout=3.3V, BW: 150MHz
Output Ripple Noise
Vrpl [mV]
Vrpl [mV]
Output Ripple Noise
50
45
40
35
30
25
20
15
10
5
0
0
100
200
300
400
500
50
45
40
35
30
25
20
15
10
5
0
0
600
100
200
300
400
500
600
Iout [mA]
Iout [mA]
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
Load Transient Response
・Vin=3.6V, Vout=1.0V
100mV/div
58mV
-88mV
ΔIo=600mA
・Vin=3.6V, Vout=1.2V
58mV
100mV/div
-80mV
ΔIo=600mA
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=3.6V, Vout=1.35V
66mV
100mV/div
-86mV
ΔIo=600mA
・Vin=3.6V, Vout=1.5V
66mV
100mV/div
-86mV
ΔIo=600mA
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=3.6V, Vout=1.8V
100mV/div
76mV
-108mV
ΔIo=600mA
・Vin=3.6V, Vout=2.5V
100mV/div
114mV
-140mV
ΔIo=500mA
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
・Vin=5.0V, Vout=3.0V
100mV/div
106mV
-128mV
ΔIo=400mA
Vin=5.0V, Vout=3.3V
100mV/div
106mV
-112mV
ΔIo=300mA
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
8.Reliability Tests
Result
Items
No.
Condition
Number
(Fail)
1
Vibration Resistance
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period
: 2.5h on each
2
Shock
Acceleration : 980m/s2
Period
: 6 ms.
Cycle
: 6direction
x 3 times
18
G
(0)
18
G
(0)
18
G
(0)
18
G
(0)
18
G
(0)
Solder specimens on the testing jig (glass epoxy boards) shown
in appended below figure.
No damage with 1.6mm deflection
3
Deflection
Solder specimens onto test jig shown below. Apply pushing
force at 10N until electrode pads are peeled off or ceramics are
broken. Pushing force is applied to longitudinal direction.
4
Pushing Direction
Soldering strength
(Push Strength)
Specimen
Jig
75% of the terminations is to be soldered evenly and
continuously.
5
Solderability of Termination
6
Heat Shock
Temperature: -40°C 30min , 85°C 30min
Period
:30min on each
Cycle
:100 times
18
G
(0)
7
High Temp Exposure
Temperature:85°C
Period
:1000h
18
G
（0）
8
Low Temp Exposure
Temperature:-40°C
Period
:1000h
18
G
（0）
9
Humidity（Steady State）
Temperature:85°C
Humidity:85%RH
Period :1000h
18
G
(0)
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
No
10
11
12
Number
Result
(Fail)
C：200pF、R：0Ω
TEST Voltage ：+/-200V
18
G
(0)
ESD(Human Body Model)
C：100pF、R：1500Ω
TEST Voltage ：+/-2000V
18
G
(0)
ESD(Charged Machine Model)
Confirming to JEITA4701 300-2
TEST Voltage ：+/-500V
18
G
(0)
Items
ESD(Machine Model)
Condition
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
9. Tape and Reel Packing
1）Dimensions of Tape (Plastic tape)
Unit: mm
Φ1.5+0.1
0
(0.25)
1.75±0.1
(3.5)
8.0±0.2
(2.3)
(2.8)
4.0±0.1
2.0±0.05
(1.5)
4.0±0.1
Feeding direction
2） Dimensions of Reel
Unit: mm
2±0.5
Φ60
Φ13±0.2
Φ180
(9.0)
13.0±1.4
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
3）Taping Diagrams
[1] Feeding Hole
:
[2] Hole for chip
:
As specified in (1)
[3] Cover tape
:
50um in thickness
[4] Base tape
:
As specified in (1)
[3]
[3]
As specified in (1)
[1]
[1]
[2]
[2]
[3]
[3]
[4]
[4]
Feeding Hole
Feeding Direction
Chip
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
4）Leader and Tail tape
A
B
Components
部品収納部
Symbol
C
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
5）The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
6）Packaging unit: 2,500 pcs./ reel
7） Material： Base Tape
Reel
… Plastic
… Plastic
Antistatic coating for both base tape and reel
8）Peeling of force
0.7 N max.
0.1~1.0N
165 to 180 °
Cover
Tape
カバーテープ
ベーステープ
Base
Tape
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
NOTICE
1. Storage Conditions:
・The product shall be stored without opening the packing under the ambient temperature from 5 to 35
deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)
・The product left more than 6 months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object
and dropping the product, shall not be applied in order not to damage the packing materials.
・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be
used within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before
soldering.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
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LXDC2HN TypeF series
Micro DC-DC converter
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating ：△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure.
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range .
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Oct 2014
LXDC2HN TypeF series
Micro DC-DC converter
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above
! Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
30
Oct 2014

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