Flexible Mehrlagen-Schaltungen in Dünnschichttechnik: Technologie-Plattform für Intelligente Implantate A. Kaiser, S. Löffler, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck Cicor Advanced Microelectronics & Substrates Session: Intelligente Implantate MicroTec Südwest Clusterkonferenz 2014, Freiburg MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 1 Solutions I I 2 Medical Devices Some Needed Properties Materials Form factor (SizeWeightandPower) BioCompatible Mechanical Medical Device • Active Implant BioStable • Diagnostic Instrument Passive Electrical BioChemical Active Electrical Interface MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 3 Materials Flexible Substrate materials for Thin Film Circuits Material Liquid Polyimide Type Thickness ranges Max Temp [°C] 350 °C Comments Liquid; SpinOn Polyimide 3 - 7 µm Polyimide Foil Polyimide 12.5 µm + higher LCP Foil Liquid Crystalline Polymer 25 µm + higher < 300 °C Solid; Foil material Liquid Silicone PDMS 30 µm + higher 200 °C Liquid; Spinon ~ 360 °C1 1depending Solid; Foil material on type of Material MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 4 Materials Typical Metal Systems in Thin Film Flex Metal Typical Use Thickness ranges TiW Adhesion Layer 20 – 200 nm Barrier Layer 50 nm – 300 nm 1 µm – 5 µm PVD electroplating Pd Ni Deposition Method PVD Cu Conductor 200 nm – 300 µm PVD and/or electroplating Ti Adhesion Layer 50 nm – 200 nm PVD Au Conductor 200 nm – 40 µm PVD or electroplating Pt Electrode 200 nm – 1 µm PVD or electroplating PVD = Physical Vapor Deposition MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 5 Form Factor SWaP Some Examples Form factor (SWaP) Form factor (S W a P ) ize eight nd ower MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 6 Thin Film Flexible Multi Layer Circuits Manufacturing Using Liqid Polyimide MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 7 Application Catheter for optical examinations in the heart MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 8 Thin Film Flexible Multi Layer: Build-Up using Liquid Polyimide Fabrication Steps via open window polyimide 3 metal 3 polyimde 2 metal 2 polyimide 1 metal 1 polyimide 0 substrate (temporary carrier) see also: A. Kaiser, et. al., "Technology for Medical Human Implants: Vision Chip on Thin Film Multilayer", Proceedings of the 2008 IMAPS Conference (IMAPS 2008), Providence, Rhode Island, USA, November 2-6, 2008 MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 9 Thin Film Flexible Multi Layer: Build-Up using Liquid Polyimide via open metal areas transparent circuit areas MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 10 Assembly on Flexible Multi Layer MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 11 Thin Film Flexible Multi Layer Circuits Manufacturing Using Flexible Foil MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 12 Thin Film Flexible Circuits Construction with Flexible Foils Process Flow functional area (e.g. Pt) flexible base (PI- or LCP-type) via metal metal MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 13 Mechanical Function Life time examination Mechanical Mechanical MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 14 Reliability Testing: Bending Test Polyimide Foils Results 100HN sample a+b: R0 = 30,82Ω Pyralux AP sample a: R0 = 30,32Ω Pyralux AP sample b: R0=30,26 Ω NO Change after 63k cycles 0° position: Au lines substrate 180° position: MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 15 Reliability Testing: Bending Test LCP Foils Results LCP 25µm sample a: R0 = 30,69Ω LCP 25µm sample b: R0 = 30,36Ω NO Change after 63k cycles LCP 50µm sample a: R0 = 29,27Ω LCP 50µm sample a: R0 = 29,15Ω MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 16 Bending Test under Current Load: LCP material 25µm and 50µm 25 µm base material ILoad = 200mA 200 mA: ~35 kA/cm² 50 µm base material ILoad = 200mA 25 µm base material ILoad = 100mA NO Change after 80k cycles 50 µm base material ILoad = 100mA cycles MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 17 Electrical Function Passive and Active, Added Functionality Electrical Electrical MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 18 Assembly Adding Functionality MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 19 Placement of Chips and Actuators View from Back Side IC surface Underfill Solder joints MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 20 Testing, Rolling, and Catheter Build Customer‘s Job MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 21 Interface Connecting with other „Worlds“ System Approach Interface Interface MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 22 System Approach Combination of Different Technologies MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 23 Migration from Thin Film to PCB Use of synergies and efficient manufacturing Heart Catheter Circuit MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 24 Summary and Conclusion CICOR provides solutions for various kind of medical applications on flexible circuits has the technology to use biocompatible materials only can also provide assembly on flexible circuits serves as your development and production partner for sophisticated medical circuits MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 25 CICOR Future Perspectives Healthy Man … Available at CICOR AMS Available at CICOR AMS Available at CICOR ES Available at CICOR AMS Possible at CICOR AMS Available at CICOR AMS Possible at CICOR AMS …and this is not the End ! MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 26 Thank You ! Cicor Advanced Microelectronics & Substrates Reinhardt Microtech GmbH Dr.-Ing. Alexander Kaiser Sedanstrasse 14 89077 Ulm / Germany Email: [email protected] Phone: +49 731 98588 425 www.cicor.com MicroTec Südwest Clusterkonferenz 2014, Freiburg I 30.04.2014 I 27
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