Reliability of the cohesiveness of diverse connection

Reliability of the cohesiveness of diverse
connection technologies
J. Karlsson
S. El Nadeim
Seite 1
What will be talked about…
 Microdul AG
 Assembly Techniques - Introduction
 Conductive gluing vs. soldering
 Adherence of different termination materials (conductive gluing)
 Influence of aging (life tests) on reliability of connection joints
Seite 2
Microdul AG
Seite 3
Business areas
Module
Page 4
Thick film
Semiconductors
Our competencies
Miniaturisation of micro electronics
Supplier of turnkey solutions from prototype development
to mass production
Quality certifications:
 ISO 9001: 2008
 ISO 13485: 2003 (medical products)
Page 5
Assembly Techniques
Seite 6
Introduction –
assembly techniques
Electrically conducting
Electrically insulating
(e.g. SMDs, Chips)
Conductive glue
(e.g. Chips)
Soldering
Non-conductive glue
Reliable
connection
Seite 7
Introduction –
assembly techniques
 Reliable…what does it mean?





Seite 8
Fulfillment of all requirements
Operating temperature/environment taken into consideration
Environment protection
Biocompatibility
…
Conductive Gluing
vs. Soldering
Seite 9
Conductive Gluing
vs. Soldering
 All shear tests according to MIL-STD-883H
 Comparison of…




AgPd soldered & glued
Sn soldered
Si glued
Au glued
… on the same substrate
 Shear strength spread
 Different bonding areas
Seite 10
MIL-STD-883H
 Few facts about this norm:
 Department of Defense (USA)
 Test Method Standard – Microcircuits
 Method 2019.8
Seite 11
Conductive Gluing
vs. Soldering
So what did we actually test…
Diodes (bare die)
SMD
Seite 12
Conductive Gluing vs. Soldering
 Shear strength depending on assembly technique
Seite 13
Surface:
1) SMD:
- 0201 – 0.08 mm2
- 0402 – 0.18 mm2
- 0603 – 0.53 mm2
- 0805 – 0.80 mm2
- 1206 – 1.52 mm2
2) Chips:
- 0.15 mm2
- 0.34 mm2
Conductive Gluing
 Shear strength depending on assembly technique
Seite 14
Surface:
1) SMD:
- 0201 – 0.08 mm2
- 0402 – 0.18 mm2
- 0603 – 0.53 mm2
- 0805 – 0.80 mm2
- 1206 – 1.52 mm2
2) Chips:
- 0.15 mm2
- 0.34 mm2
Conductive Gluing –
Components with different metallization
 It is known that some materials are more suitable for conductive
gluing while others – for soldering. A comparison of shear strength
of glued SMDs with AgPd and Au connectors.
6000
Shear stength [g]
5000
4000
0805 AgPd
3000
0805 Au
1x
2000
2x
1000
12.4
0
0
10
20
30
40
Surface
12.4*10-4 in2 = 0.8 mm2
Seite 15
50
[10-4
in2]
60
70
80
90
Soldering
 Shear strength depending on assembly technique
Seite 16
Surface:
1) SMD:
- 0201 – 0.08 mm2
- 0402 – 0.18 mm2
- 0603 – 0.53 mm2
- 0805 – 0.80 mm2
- 1206 – 1.52 mm2
2) Chips:
- 0.15 mm2
- 0.34 mm2
Conductive Gluing
vs. Soldering - Summary




Larger bonding area means stronger bond
Larger bonding area tends to cause wider bond strength spread
Soldering generally better than gluing
Termination material aspect has an influence
Seite 17
Gluing & Aging
Seite 18
Gluing & Aging
 Aging effect (accelerated lifetime test)
Seite 19
Gluing & Aging - Summary
 No considerable influence within tested life span
Seite 20
Thanks for your attention
Any questions?
Seite 21

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