BF-3Si In-Line 3D Solder Paste Inspection System BF-3Si Compatibility with Saki BF-2 AOI Systems T h e us e r- f r i e n d l y S a k i 's B F2 o p e r at i n g sy ste m a l l ow s n et wo r k compatibility with all Saki BF2 AOI series. Solder Paste Inspectiion based on 3D data Advanced analysis capabilit y is achieved by integrating original, st ate - of - t h e - ar t S ak i 3 D m e asur em ent te c hn o l o gy. T his all ows the system to easily rotate, enlarge, and reduce images. Insufficient solder Smearing Swelling High Speed and Precision Inspection System The newly developed Phase Measurement Prophilometer Technology w i t h LC O S ( L i q u i d C r y s t a l O n S i l i c o n) e n s u r e s h i g h i n s p e c t i o n repeatability. The height and volume inspection repeatability is rated +/- 3µm, with a Gauge Repeatability and Reproducibility(GR&R) of less than 10%. BF-3Si is one of the world's fastest solder paste inspection systems in 2 projection solder paste inspection systems. Closed Loop Function Not only measuring the shape solder paste, BF-3Si enables to feed back inspection data to front-end process which extremely minimize solder defects to the post-process. BF-SPIder-L Bridge Excess solder No solder Data Analysis Process-control chart can be shown in real time, and past data can be shown by the hour. 2D and 3D Inspection B F- 3 Si inspec t s PC B wit h a c ombinat ion of 2D images and 3 D i m a g e s. T h e c o o r di nate s a d j ust m e nt i s c o r r e c te d by d ete c t in g fiducial mark from 2D images and the height information is accurately calculated by zero point adjustment of each PAD from 3D images. Black & White Image Color Image PAT.P BF-3Si External View Product Specifications S 1040 mm (1100 mm) ■ Side View 2000 mm 1470 mm ■ Front View Model Name BF-3Si Horizontal Resolution 18 μm Vertical Resolution 0.33μm Repeatability 2 μm （3 σ） or less PCB Size 50 x 60 - 460 x 510 mm PCB Thickness 0.6 - 3.2 mm PCB Warp +/- 2 mm PCB Clearance Top ： 40 mm Bottom ： 40 mm Inspection Categories Height, Volume, Area, Bridge, Shift, Form Camera(Image capture) CMOS Area Camera Lighting 2-way Projection System with Multistage Ring Light FOV Size 36 mm × 36 mm Inspection Speed 33.75 cm2/s PCB Load/Unload Time Approx. 5 sec. Conveyor Method Flat Belt Transfer Conveyor Height 900 +/-20 mm Width Adjustment Automatic Operating System Windows 7 English Version 900 mm System Requirements Electric Power Single Phase ～ 200 to 240V +/-10%, 50/60Hz Power Consumption 1.3kVA Air Requirement 0.5 MPa, 5 L/min (ANR) Usage Environment 15°C (59°F) to 30°C (86°F) / 15 to 80% RH (Non-condensing) Dimensions WxDxH 1040 x 1440 x 1470 mm (40.94 x 56.69 x 57.87 in.) Weight Approx. 870 kg (1,918 lbs) Optional Systems BF2-Editor BF2-Monitor (766 mm) 470 mm 1440 mm Saki Corporation Headquarters Ogawa Building, 4-14-7, Nakanobu, Shinagawa-ku, Tokyo, Japan, 142-0053 TEL: +81-3-5788-6280 FAX: +81-3-5788-6295 E-mail:[email protected] Global Network http://www.sakicorp.com This brochure was made out in May 2014. SJ264DCF1-02E © 2014 Saki Corporation. All Rights Reserved. Specifications contained in this brochure are subject to change without notice.
© Copyright 2020 ExpyDoc