Nse Lead Free Solder

NS Product Data Sheet
Halogen-Free
Lead-Free Solder Paste
SN100C P604 D4
Features
◎ Halogen free.
◎ Excellent wetting on lead terminals.
◎ Reduced beading
Excellent Wetting on Lead Terminals
Test conditions
Board
：SOT23
Stencil thickness ：120μm
Peak temperature
：240℃
Time above liquidus ：40sec.(Above 227℃)
Number of tested terminals ：78
Results
100%
80%
Perform visual inspection to see whether the terminals
have been wetted enough. The following image shows the
criteria of judging the wetting.
60%
40%
NG
20%
The tip of the lead
terminal is exposed.
OK
The tip of the
lead terminal
cannot be seen.
0%
SN100C P604 D4
Conventional Product with Halogen
Reduced Beading
Test Board
Results
120%
100%
80%
60%
発生率（％）
40%
20%
1x0.5
0%
R1005
R1608
P604
R2125
C1608
Pad size (mm)
1.6x0.8
2.1x2.5
C2125
Conventional product with halogen
The ratio of beading was calculated by fixing the amount of
beading by the conventional product with halogen as 100.
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Test Conditions
Stencil Thickness
：120μm
Peek Temperature
：240℃
Time above liquidus ：40sec.(227℃以上)
TDS-SPSN100CP604D4-121127
Optimized and stable viscosity for consistent printing
Test conditions
Printer
DEK ELA
Results
2h
300
8h
4h
12h
Board
Stencil thickness
squeegee
Printing
Squeegee pressure
250
200
）
：0.4mm pitch QFP
：130μm
：Metal
：30mm/sec.
：4.0kg/cm2
s
・
150
Viscometer: Malcom PCU-205
Pa
100
粘度（
50
0
0
500
1000
1500
2000
Number of boards consistently printed
0h
1 board
st
2h
350 board
th
4h
700 board
th
8h
1500 board
th
12h
2200th board
Good printability maintained during continuous printing of 2,200 boards (12 hours).
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TDS-SPSN100CP604D4-121127
1.Properties
Properties
SN100C P604 D4
Test Method
Alloy Composition
Sn-0.7Cu-0.05Ni+Ge
-
Melting Point （℃）
227
-
Particle Size (μm)
20～38/TYPE4
Flux Category *1
ROL0
Halogen Content *2
None
Halide Content （mass％）
0
Copper plate corrosion test
Non corrosive
Flux Content （mass％）
12.5±0.5
Viscosity (Pa.s)
180±10
Thixotropic Index
0.62±0.02
Surface Insulation Resistance （Ω）
≧1.0×1010
ANSI/IPC J-STD-005
ANSI/IPC J-STD-004A
JIS-Z-3197 8.1.4.2.1
IPC-TM-650 2.3.35
JIS-Z-3197 8.4.1
JIS-Z-3197 8.1.2
JIS-Z-3284 Appendix 6
IPC-TM-650 2.4.34.3
JIS-Z-3284 Appendix 6
JIS-Z-3197 8.5.3
CombⅡ 85℃85％RH 168hr
Flux Content （mass％）
96h
4.8×10
Viscosity (Pa.s)
168h
5.5×109
9
Electromigration
Pass
Expansion ration（%）
≧70
Shelf life
3 months
IPC-TM-650 2.6.3.3B
PASS ≧1.0×108
85℃85％RH 168hr
JIS-Z-3197 8.5.4
CombⅡ 85℃85％RH 1000hr
JIS-Z-3197 8.3.1.1
0～10℃ (Refrigerator)
※1 ：Flux category (activity level)：Rosin Type L０
※2 ：Halogen Elements： F, Cl, Br, I.
2. Packaging
500g jars, 10 jars to a carton (5kg)
3. Recommended Reflow Methods
① Linear ramp reflow profile as indicated below
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TDS-SPSN100CP604D4-121127
4. Application Notes
② Before opening jars that have been in refrigerated storage hold them under ambient conditions for 1
-2 hours or until the contents have reached room temperature。
③ The viscosity of solder paste varies depending on factors such as temperature and model of agitator.
Please make sure to test the paste and find its optimized condition before starting production.
④ If not all the contents of a jar are used reseal and return to refrigerated storage (0-10°C)
5. Precaution for Handing
①
②
③
④
When handling and using solder paste wear protective gloves and safety glasses.
Make sure the room for production can be well-ventilated area
Wash hands before eating and on completion of work.
For your safety and the safety of others please read the Material Safety Data Sheet (MSDS) before
using solder paste.
All the statement, technical information and recommendations contained herein are based on the data or other information available to us that we believe to be
reliable but the accuracy and completeness of which we can not guarantee. Descriptions including specifications are subject to change without prior
notification for the purpose of improvement in quality, etc. By using, check the conformity and MSDS for handling, managing and destroy appropriately.
NIHON SUPERIOR CO., LTD.
Head Office
Tokyo Branch
Nagoya Branch
[URL] http://www.nihonsuperior.co.jp
NS Bldg., 1-16-15, Esaka-cho, Suita 564-0063 Japan
Dai-ichi Bldg., Annex 4F, 2-7-15,Kiba, Koto-ku, Tokyo 135-0042 Japan
2-5-4-802, Fukue, Showa-Ku, Nagoya, 466-0059 Japan
[email protected]
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TEL：+81-(0)6-6380-1121 FAX：+81-(0)6-6380-1262
TEL：+81-(0)3-3642-5234 FAX：+81-（0）3-3642-5257
TEL：+81-（0）52-882-6011 FAX：+81-（0）52-871-2434
TDS-SPSN100CP604D4-121127

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