CTS Heat Sink Selector Guide for Xilinx All

CTS Heat Sink Selector Guide for Xilinx
All-Programmable FPGAs, 3D ICs and SoCs
Many common electronic devices rely on heat sinks to dissipate heat. They are simple to use, have an easy
to understand principle and are cost effective. Mounted correctly, they function virtually failure-free for the
lifetime of the application. Heat sinks cool by convection as the heat from the component is exchanged with
the cooler ambient air temperature, either by natural convection or enhanced by the use of forced air, generally measured in linear feet
per minute (LFM). A heat sink is physically designed to maximize the surface area in contact with the air.
While it takes many years to become a thermal design expert, Avnet Electronics Marketing and CTS have developed the tools to enable
the quick identification of heat sink solutions for commonly-used Xilinx All Programmable FPGAs, 3D ICs and SoCs.
XILINX
PACKAGE
IC SIZE*
NOMINAL IC
THICKNESS*
BDN Series
FGG484
23 x 23
1.70
BDN09-3CB/A01
FGG676
27 x 27
1.73
FFG1156
35 x 35
2.40
FFG676
27 x 27
2.67
FFG900/1
31 x 31
2.65
BDN12-3CB/A01
FFG1156
35 x 35
2.65
BDN14-3CB/A01
AER35-35-12CB/A01
APR35-35-12CB/A01
FxG115x
35 x 35
2.65
BDN14-3CB/A01
AER35-35-12CB/A01
APR35-35-12CB/A01
FFG1761
42.5 x 42.5
2.80
BDN17-3CB/A01
AER43-43-12CB/A01
APR43-43-12CB/A01
FxG19xx
45 x 45
2.95/3.00
BDN18-3CB/A01
AER45-45-12CB/A01
APF Series
AER Series
APR Series
Clip
Option
Artix®-7
AER23-23-12CB/A01
AER27-27-12CB/A01
BDN14-3CB/A01
M
APR27-27-12CB/A01
M
AER35-35-12CB/A01
Kintex®-7
AER27-27-12CB/A01
APF30-30-06CB/A01
APR27-27-12CB/A01
AER31-31-12CB/A01
Virtex®-7
T
T
Zynq®-7000 All Programmable SoC
19 x 19
1.07
AER19-19-12CB/A01
APR19-19-12CB/A01
27 x 27
2.44
AER27-27-12CB/A01
APR27-27-12CB/A01
27 x 27
2.67
AER27-27-12CB/A01
APR27-27-12CB/A01
FFG900
31 x 31
2.65
BDN12-3CB/A01 APF30-30-06CB/A01 AER31-31-12CB/A01
FFG1156
35 x 35
2.65
BDN14-3CB/A01
CSG484
19 x 19
TQG144
CLG484/5
FFG676
(XC7Z030)
FFG676
(XC7Z045)
APF19-19-06CB/A01
BDN09-3CB/A01
S
AER35-35-12CB/A01
APR35-35-12CB/A01
1.30
APF19-19-06CB/A01 AER19-19-12CB/A01
APR19-19-12CB/A01
M
20 x 20
1.55
APF19-19-06CB/A01 AER19-19-12CB/A01
APR19-19-12CB/A01
N/A
FG(G)484
23 x 23
1.7
FG(G)676
27 x 27
1.73
AER27-27-12CB/A01
FG(G)900
31 x 31
1.75
BDN12-3CB/A01 APF30-30-06CB/A01 AER31-31-12CB/A01
Spartan®-6
BDN09-3CB/A01
*Per Xilinx package specifications. All measurements in mm.
AER23-23-12CB/A01
M
APR27-27-12CB/A01
M
M
CTS is a leading designer and manufacturer of electronic components and sensors for the automotive,
communications, medical, defense and aerospace, industrial and computer markets. CTS offers a wide
array of heat sinks used to dissipate heat in Xilinx All Programmable FPGAs, 3D ICs and SoCs.
PART NUMBER DECODER
Part Number
Series
Dimensions in mm
(L x W x H)
Commercial Black
Anodize
Mounting
Options
AER
19-19-12
CB
/A01
Clip Mount (only)
Thermal Tape (only)
Code
Specifications
Code
Specifications
/Tape code/Clip code
/S
Short
/A01
CTS Double-sided Kapton®
Example:
/M
Medium
/T410 /T411
or /T412
Chomerics Thermattach®
/T
Tall
/A21
3M™ 8815
Both (Thermal Tape and Clip Mount Options)
The above heat sink with A01 tape and tall
clip is AER19-19-12CB/A01/T
EXTRUDED HEAT SINKS – Convenient Attachment Method and Excellent Mechanical Bond
•Pre-applied adhesive − just peel off the release liner
and press onto the component
•Reduces assembly costs − no more messy adhesives
BDN Series
or greases required
•Excellent mechanical bond
•Thermally optimized pin fin
•Omnidirectional
•Thermal resistance as lows as 2.2 °C/W at 400 LFM
•Adhesive shear strength at 100 °C is 36 psi
•Applicable for BGA, PGA, PLCC and QFP packages
Part Number
L x W X H (mm)
Thermal Resistance (°C/W)
BDN09-3CB/A01
23.1 x 23.1 x 9
26.91 / 9.62
BDN12-3CB/A01
30.7 x 30.7 x 9
19.61 / 6.82
BDN14-3CB/A01
35.8 x 35.8 x 9
16.21 / 5.62
BDN17-3CB/A01
43.4 x 43.4 x 9
11.51 / 3.82
BDN18-3CB/A01
46 x 46 x 9
10.81 / 3.52
1
Measured at 0 LFM
2
Measured at 400 LFM
FORGED HEAT SINKS – High Aspect Ratio Low Thermal Resistance
Plate Fins (AER and APF series)
•Precision forging technology for high power applications
•Low profile thin fins (APF Series)
AER Series
•Designed for BGA and other surface mount packages
APF Series
•Various mounting methods available
•Select from multiple fin heights
•Improved thermal performance over conventional heat sinks
•No special tools needed for assembly
•No additional holes required on the PCB
•Special clip easily snaps on and self-aligns
•Thermal resistance as lows as 1.2 °C/W at 200 LFM
•Adhesive shear strength at 100 °C is 15-70 psi
AER/APF SERIES
Part Number
L x W X H (mm)
Thermal Resistance (°C/W)
AER19-19-12CB
18.6 x 18.6 x 11.6
14.51 / 6.42
AER23-23-12CB
22.6 x 22.6 x 11.6
11.61 / 3.52
AER27-27-12CB
26.6 x 26.6 x 11.6
11.61 / 3.92
AER31-31-12CB
30.6 x 30.6 x 11.6
14.51 / 6.42
AER35-35-12CB
34.6 x 34.6 x 11.6
10.61 / 3.32
AER43-43-12CB
42.1 x 42.1 x 11.6
9.71 / 3.02
AER45-45-12CB
44.6 x 44.6 x 11.6
9.31 / 2.82
APF19-19-06CB
19 x 19 x 6.3
17.01 / 7.12
APF30-30-06CB
30 x 30 x 6.3
13.91 / 4.42
1
Measured at 0 LFM
2
Measured at 200 LFM
Pin Fins (APR Series)
•Precision forging technology for high power applications
APR Series
•Omni-directional pins
•Designed for BGA and other surface mount packages
•Various mounting methods available
•Select from multiple fin heights
•No special tools needed for assembly
•No additional holes required on the PCB
•Special clip easily snaps on and self-aligns
Part Number
L x W X H (mm)
Thermal Resistance (°C/W)
APR19-19-12CB
18.6 x 18.6 x 11.6
14.31 / 6.92
APR27-27-12CB
26.6 x 26.6 x 11.6
12.51 / 5.02
APR35-35-12CB
34.7 x 34.7 x 11.6
10.51 / 3.22
42.1 x 42.1 x 11.6
8.71 / 3.02
APR43-43-12CB
1
Measure at 0 LFM
2
Measured at 200 LFM
Avnet’s Thermal Management Physical Value Add
In addition to heat sinks, Avnet offers custom assembly and modification for cooling fans and heat sinks. In fact, Avnet is one
of the world’s largest producers of thermal management products, shipping millions of cooling fans, blowers and heat sinks each year
through the Avnet Logistics Solution Center (LSC).
Avnet has the inventory, technical expertise and service offerings to meet an array of customer needs with either off-the-shelf or custom
solutions. Add a well-deserved reputation for quality and customer service, and it’s easy to see why Avnet adds value to hundreds of
customers each day.
Services
•Custom cable harness modification –
adding connectors and contacts
•Custom hardware mounting (PEM nuts,
studs, threaded inserts, brackets)
Thermal management-related services are performed
at the Avnet Logistics Solution Center (LSC).
•Located in Nogales, Mexico
•125,000 square foot assembly center
•Finger guard installation
•Staffed by more than 300 employees
•Custom length lead wire assembly
•Certification and compliance credentials:
•Standard and custom fan tray assembly
-- ISO-9001-2000
-- C-TPAT
•Custom sheet metal fabrication
-- ISO-14001 (Green)
-- IPC J-STD-001 and IPC/WHMA-A-620
•Heat sink modification
-- AS9100C
-- UL and CSA
-- MIL-I-45208
-- British Standards Institute (BSI)
-- International Traffic in
Arms Regulations (ITAR)
BRANCH LOCATIONS
UNITED STATES
Atlanta770-281-8870
Atlanta (ElectroAir)
770-799-4900
Austin512-219-3700
Baltimore410-423-8800
Boston978-898-4400
Chicago847-396-7300
Cleveland440-349-7600
Columbus614-865-1400
Connecticut203-284-5700
Dallas800-231-0253
Denver303-790-1662
Detroit734-416-5800
Houston281-243-7330
Huntsville256-774-2600
Indianapolis317-575-3500
Irvine949-789-4100
Kansas City
913-663-7900
Long Island
631-582-7700
Los Angeles
818-594-8200
Milwaukee262-513-1500
Minneapolis952-346-3000
North Jersey
973-515-1641
CANADA
Orlando407-657-3300
Phoenix480-643-2000
Pittsburgh724-934-6700
Portland503-452-6900
Raleigh919-859-9159
Rio Grande
956-631-1610
Rochester585-486-8300
Sacramento916-632-4500
Salt Lake City
801-365-3800
San Diego
858-385-7500
San Jose
408-435-3500
Seattle425-882-7000
South Jersey
856-355-7400
St. Louis
314-770-6300
Tampa813-281-4654
Calgary403-291-5510
Montreal514-335-1000
Ottawa613-226-1700
Toronto905-812-4400
Vancouver604-444-3810
MEXICO
Chihuahua656-640-3230
Jalisco5233-3134-2300
ARGENTINA
Buenos Aires
BRAZIL
Sao Paulo
Avnet Electronics Marketing
+1-800-585-1602
Avnet – North America
2211 South 47th Street
Phoenix, Arizona 85034
United States of America
www.em.avnet.com
Copyright © 2014 Avnet, Inc. AVNET and the AV logo are registered trademarks of Avnet, Inc.
All other brands are the property of their respective owners. LIT # AEM-CTS-HEAT-SINKS-v1-0414
55-11-5079-2150
COLOMBIA
Bogota57-1-256-7766
PUERTO RICO
Puerto Rico
For more information about pricing, availability and technical information on all of these thermal management solutions,
please visit www.em.avnet.com/ctsheatsinks.
54-11-4781-6702
787-706-1888

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