National Aeronautics and" Space Administration" Low Mass/Power Avionics Technology for Outer Planet Missions: Advanced Power Management and Extreme Temperature Electronics Y. He, K. Bruvold, N. Lay, W. Whitaker Jet Propulsion Laboratory California Institute of Technology, Pasadena CA Email: [email protected] Background Hot/Cold-Capable Avionics-on-chip • Future outer planet missions demands low power/mass spacecra3 with long opera6on 6me to achieve scien6fic explora6on objec6ves • Advanced hot/cold capable avionics-‐on-‐a-‐chip technology will enable a plethora of outer planet missions with significantly reduced mass, power and more capable payload by integra6ng three key technologies o Fine-‐grained dynamic power management (FDPM) Outer Planet Spacecraft Avionics Fine-Grained Dynamic Power Management Extreme Environment Electronics Output Planet Payload Electronics Integrated Wireless/Wired Interconnect Dynamically adap6ve with the opera6on profile at mW granularity o Extreme Temperature Electronics (ETE) ² Operate +/-‐200 °C outer planet temperature without heater or warm box o Integrated wireless/wired interconnect (IWWI) ² Unified spacecra3 interconnect up to 10 Gbits/second data rate ² Hot/Cold-‐capable electronics, fine-‐grained power management, and interconnect technologies together will lead to significant reduc6ons in mass/power for outer planet missions Benefits to Outer Planet Missions • Allow more outer space science per mission and more science mission at given budget by significant reduc6on in complexity of spacecra3 electronics systems: o Up to 20% power/mass reduc6on at both system and subsystem level o More compu6ng power for science and autonomy per volume and waX o Longer mission life with higher reliability electronics in extreme temperature environment o Wider range of viable mission concepts for outer planet missions (flyby, orbiter, probe, lander, and rover) Fine-Grained Dynamic Power Management (FDPM) Extreme Temperature Electronics (ETE) Current TRL: 2 Current TRL: 3 • Hot/Cold capable at -‐200 °C to +200 °C outer planet temperature range without heater or warm box • Provide 20% power/mass reduc6on • Simplify or poten6ally eliminate thermal control • Dynamic power control at mW granularity • Smart scheduling for on-‐demand power consump6on 6ghtly coupled with expected mission opera6on scenarios • Capable of 40% power reduc6on Klystron Test Bed PEAC Always-On • Timer-Triggered • µW • Highly Reliable PEAC-Runtime At-Time-Changed • Profile-Driven • 100mW ~ 1W • Changed Time Subsystem Clock Subsystem Maturity Roadmap • Con6nuous 3-‐year technology development and risk reduc6on to get it ready for future outer planet missions Hot/cold-capable avioncs-on-chip ready for outer planet mission PDR ETE FDPM TRL 6 5 4 3 2 1 1 2 3 4 5 Year National Aeronautics and Space Administration! Jet Propulsion Laboratory" California Institute of Technology" Pasadena, California" www.nasa.gov! Tech Example: Distributed Motor Control (DMC) • Enables low mass/power motor control for rovers, robo6c arm landers, deployables • Operate at -‐135°C to +185°C (Mars) • Flight motor control board is no bigger than a credit-‐card 17:1 board reduc-on in Warm Box 65% total mass reduc-on of Motor Control Electronics Copyright 2014. All rights reserved.! Cold-capable electronic PWB in the Lab ! CL#14-2891!
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