Memory - Columbia University

Memory
Prof. Stephen A. Edwards
[email protected]
Columbia University
Spring 2011
Memory – p.
Early Memories
Williams Tube CRT-based random access
memory, 1946. Used on the Manchester Mark I.
2048 bits.
Memory – p.
Early Memories
Mercury acoustic
delay line.
Used in the EDASC,
1947.
32 × 17 bits
Memory – p.
Early Memories
Magnetic core memory, 1952. IBM.
Memory – p.
Early Memories
Magnetic drum memory. 1950s & 60s.
Secondary storage.
Memory – p.
Modern Memory Choices
Family
Programmed Persistence
Mask ROM at fabrication
∞
PROM
once
∞
EPROM
1000s, UV
10 years
FLASH
1000s, block
10 years
EEPROM
1000s, byte
10 years
NVRAM
∞
5 years
SRAM
∞
while powered
DRAM
∞
64 ms
Memory – p.
ROMs
Memory – p.
EPROMs
Memory – p.
EEPROM and FLASH
Slow write
Oxide
floating gate Word Line
Source
Drain
Channel (bit line)
FowlerNordheim
Tunneling
EEPROM: bit
at a time
FLASH: block
at a time
Source: SST
Memory – p.
Static RAM Cell
Word
Bit
Bit
Memory – p. 1
Standard SRAM: 6264
19–15,13–11
D[7:0]
10–2,25–23,21
22
27
20
26
Addr[12:0]
OE
WE
CS1
CS2
8K × 8
Can be very fast:
Cypress sells a 55ns
version
Simple, asynchronous
interface
Memory – p. 1
Standard SRAM: 6264
CS1
ÀÀÀ ÄÄÄÄÄ¡ÀÀÀ ÄÄÄÄÄ¡ÀÀÀ
CS2
ÄÄÄ¡ÀÀÀÀÀ ÄÄÄ¡ÀÀÀÀÀ ÄÄÄ
WE
ÀÀÀÀ ÄÄÄ¡ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ
OE
ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ ÄÄ¡ÀÀÀÀ
Addr
ÍͧÎÎÎÎÎÎΦÍÍͧÎÎÎΦÍÍÍ
Data
¢ÎÎÎÎÎÎÎΣ
¢ÎΣ
Memory – p. 1
byanacti LOW
(CE anactiveHIGH
enab
and
LOW output e able (
)a
e drivers.
d vices h ve an a omatic power-down f ure (
cing
p
b
Standard SRAM: 6264
Theinpu /outputpinsremai ahigh-i
ec
s
outputs are ena
GH. Adie coat is
k
Co
I/O0
INPUTBUFFER
A1
A2
A3
A4
A5
A6
A7
A8
I/O1
I/O2
I/O3
256x32x8
ARRAY
GN
I/O4
I/O5
I/O6
CE1
CE2
WE
COLUMNDECODER
POWER
DOWN
I/O7
OE
CY6264-1
Memory – p. 1
Toshiba TC55V16256J 256K × 16
38–35,32–29,16–13,10–7
D[15:0]
23,22,18–21,24–27,42–44,1–5
40
39
41
17
6
Addr[17:0]
UB
LB
OE
WE
CE
12 or 15 ns access time
Asynchronous interface
UB, LB select bytes
Memory – p. 1
Toshiba TC55V16256J 256K × 16
Memory – p. 1
Dynamic RAM Cell
Row
Column
Basic problem: Leakage
Solution: Refresh
Memory – p. 1
Ancient DRAM: 4164
64K × 1
Apple IIe vintage
9,13,10–12,6,7,5
2
3
15
4
Addr[7:0]
14
DIN DOUT
WE
CAS
RAS
Memory – p. 1
Basic DRAM read and write cycles
RAS
ÀÀ ÄÄÄÄÄÄÄÄÄ¡ÀÀ ÄÄÄÄÄÄ¡ÀÀ
CAS
ÀÀÀÀÀÀ ÄÄÄÄÄ¡ÀÀÀÀÀÀ ÄÄ¡ÀÀ
Addr
§ÎάÎΦÍÍÍÍͧÎάÎΦÍÍÍÍ
WE
Din
Dout
Row
Row
Col
ÆÀÀ¯
Col
­ÄÄ
ÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍͧÎΦÍÍÍ
¢ÎÎΣ
Memory – p. 1
Page mode read cycle
RAS
ÀÀ ÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄÄ¡À
CAS
ÀÀÀÀÀÀ ÄÄÄ¡À ÄÄÄ¡À ÄÄ¡À
Addr
§ÎάÎΦÍÍͧÎΦͧÎΦÍÍÍ
WE
Din
Dout
Row
Col
Col
Col
ÆÀÀÀ¯ ÆÀÀÀ¯ÆÀÀÀÀ¯
ÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍ
¢ÎÎΣ ¢ÎÎΣ ¢ÎÎÎ
Memory – p. 1
Samsung 8M × 16 SDRAM
21,20
39
15
3
15
15
37
38
BA[1:0]
Addr[11:0]
DQ[15:0]
UDQM
LDQM
WE
CAS
RAS
CKE
CLK
Bank address
Address (multiplexed)
Data I/O
Upper byte enable
Lower byte enable
Write enable
Column Address Strobe
Row Address Strobe
Clock Enable
Clock
Synchronous interface
Designed for burst-mode operation
Four separate banks; pipelined operation
Memory – p. 2
Samsung 8M × 16 SDRAM
I/O Control
Data Input Register
LWE
LDQM
Bank Select
8M x 4 / 4M x 8 / 2M x 16
8M x 4 / 4M x 8 / 2M x 16
Output Buffer
8M x 4 / 4M x 8 / 2M x 16
Sense AMP
Row Decoder
ADD
Row Buffer
Refresh Counter
DQi
Column Decoder
Col. Buffer
LCBR
LRAS
Address Register
CLK
8M x 4 / 4M x 8 / 2M x 16
Latency & Burst Length
LCKE
Programming Register
LRAS
LCBR
LWE
LCAS
LWCBR
LDQM
Timing Register
CLK
CKE
CS
RAS
CAS
WE
L(U)DQM
Memory – p. 2
SDRAM: Control Signals
RAS CAS WE action
1
1
1 NOP
0
0
0 Load mode register
0
1
1 Active (select row)
1
0
1 Read (select column, start burst)
1
0
0 Write (select column, start burst)
1
1
0 Terminate Burst
0
1
0 Precharge (deselect row)
0
0
1 Auto Refresh
Mode register: selects 1/2/4/8-word bursts, CAS
latency, burst on write
Memory – p. 2
SDRAM: Timing with 2-word bursts
Load
Active
Write
Read
Refresh
Clk
Ä¡ ¡ ¡ ¡ ¡ ¡ ¡ ¡ ¡ ¡ ¡ RAS
¡ÀÀÀÀ ¡ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ ¡À
CAS
¡ÀÀÀÀÀÀÀÀÀÀÀÀ ¡ÀÀÀÀ ¡ÀÀÀÀÀÀÀÀÀÀÀÀ ¡À
WE
¡ÀÀÀÀÀÀÀÀÀÀÀÀ ¡ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ
Addr
§¦ÍÍÍͧ¦ÍÍÍͧ¦ÍÍÍͧ¦ÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍ
BA
ÍÍÍÍÍÍÍͧ¦ÍÍÍͧ¦ÍÍÍͧ¦ÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍ
DQ
Op
R
B
C
C
B
B
¢¦§£
W
W
¢£¢£
R
R
Memory – p. 2