Access to the talk

Silicon Photomultiplier
- characteristics and applications Nicoleta Dinu
Laboratory of Linear Accelerator, IN2P3, CNRS, Orsay, France
Seminar at Geneva University, DPNC, 21.05.2014
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OUTLINE

PART A:
◦ Silicon Photomultiplier (SiPM)





Introduction on solid state photon detectors
SiPM design and physics principle
SiPM electrical and optical characteristics
SiPM arrays
PART B:
◦ SiPM applications
 Intra-operative probes for tumors localization during cancer
surgery
 Compact imaging gamma camera (SIPMED)
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PART A:
Silicon Photomultiplier
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Review of solid-state photon detectors (1)
GM-APD
APD
P+ - Type
N – Type Silicon
~ 4 µm
PN or PIN
+
p+ n
high electric field
multiplication region
-epilayer
eh+
p+-type silicon (substrate)
p-n junction,
reversed Vbias – 0-3 V
Gain = 1
p-n junction,
reversed Vbias < VBD
p-n junction,
reversed Vbias > VBD
Gain = M (~ 50-500)
Gain → infinite
- linear mode operation-
-Geiger-mode operation-4
Review of solid-state photon detectors (2)

p-n junction working in reverse bias mode
Absolute reverse voltage
Absolute reverse voltage
• 0 < Vbias < VAPD (few volts)
• G=1
• Operate at high light level
(few hundreds of photons)
GM-APD or SPAD
APD
Photodiode
•
•
•
•
VAPD < Vbias < VBD
G = M (50 - 500)
Linear-mode operation
Operate at medium light
level (tens of photons)
•
•
•
•
Vbias > VBD (Vbias-VBD ~ few volts)
G 
Geiger-mode operation
Can operate at single photon level
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Geiger-Mode Avalanche Photodiode
The first single photon detectors operated in Geiger-mode
R.H. Haitz
J. Appl. Phys.,
Vol. 36, No. 10 (1965) 3123
J.R. McIntire
IEEE Trans. Elec. Dev.
ED-13 (1966) 164
Rs=50
h
GM-APD
output
GM-APD
Rq
n+ (K)
p++ (A)
-Vbias
Passive quenching circuit
Active resistor made of MOS transistor
controlled by a fast electronics
Active quenching circuit
S. Cova & al., Appl. Opt., Vol. 35, No 12 (1996) 1956
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SiPM cell – design & physics principle


GM-APD (p-n junction) connected in series with quenching resistance RQ
GM-APD and RQ – on the same substrate
C. Piemonte, …, N. Dinu…, IEEE TNS, Vol. 54, Issue 1, 2007
Digital device
Voltage (a.u.)
Time (a.u.)
Q = Q1 = Q2 = …= Qn
Standard output signal
No information on light
intensity
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SiPM – design & physics principle
Parallel array of -cells on the same substrate
◦ Each -cell: GM-APD in series with RQ
E
Metal grid
Rquench
10-100µ
depth
1 mm
OUT
SiPM / FBK
1 mm
2-4µ
300µ
epi layer
SiPM / Hamamatsu
E
Si substrate
SiO2 + Si3N4
VBIAS
’90s by V.M.Golovin & Z.Sadygov, Russian patents
1 mm
depth
pn junctions
Geiger-Mode
1 mm

1 pixel fired
2 pixels fired
3 pixels fired
Analog device
Qtot = Q1 + Q2 + …= nQ1
Output signal  number of fired
cells that is the number of
photons (if efficiency = 1) 8
SiPM – few examples of design & packages
Hamamatsu HPK (http://jp.hamamatsu.com/)
10x10, 15x15 , 25x25, 50x50, 100x100µm2 cell size
1x1mm2
SensL (http://sensl.com/)
20x20, 35x35,
50x50, 100x100µm2 cell size
1x1 and 3x3 mm2
3x3mm2
FBK-IRST (http://advansid.com/home)
50x50µm2 pixel size
KETEK (http://www.ketek.net/)
25x25, 50x50, 100x100µm2 cell size
1.2x1.2 mm2
3x3 mm2
6x6 mm2
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SiPM characteristics:
•
DC measurements in the dark & room temperature
•
•
•
•
Reverse and forward IV characteristics
AC measurements in the dark & room temperature
•
Signal shape
•
Gain
•
Dark count rate
Optical measurements at room temperature
•
Photon detection efficiency
•
Timing resolution
Temperature dependence
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DC characteristics @ 25°C
N. Dinu et al., NIM A, 610, 2009
Overvoltage: V = VBIAS - VBD
•
Technical team: V. Chaumat, JF. Vagnucci
•
Lab course @ EDIT & MC-PAD schools at CERN, 2011
N. Dinu et al., NIM A, 610, 2009
Recovery time: cell  RQCdiode
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SIGNAL SHAPE @ 25°C
Keithley
Multimeter 2000
Vcc
Pt100
Keithley 2611
Vbias & PicoA
0.01500MHz
TDS 5054
500MHz, 5GS/s
SiPM
metallic box
Climatic chamber ±0.1°C
GPIB
LabView
Technical team: V. Chaumat, JF. Vagnucci, Z. Amara, C. Bazin
rise  RD(CD+CQ)
fall slow  RQ (CD+CQ)
fall fast  Rload (Ctot+Cg)
N. Dinu et al., NIM A, 610, 2009
N. Dinu et al., NIM A, 610, 2009
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GAIN @ 25°C

Number of charge carriers developed during avalanche discharge
Q C D  CQ V C D  CQ VBIAS  VBD 
G


qe
qe
qe

G increases linearly with V = VBIAS – VBD

the slope of linear fit of G vs. V  Ccell = CD + CQ

G and Ccell increase with cell geometrical
dimensions
N. Dinu et al., NIM A, 610, 2009
N. Dinu et al., NIM A, 610, 2009
C   S i 0
A
d
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Dark count rate @ 25°C
• The number of pulses/s registered by the SiPM in the absence of the light
• It limits the SiPM performances (e.g. single photon detection)
• Three main contributions:
• Thermal/tunneling – thermal/ tunneling carrier generation in the depleted region
 looks the same as a photon pulse
• After-pulses
– carriers trapped during the avalanche discharging and then released triggering a
new avalanche after the breakdown
• Optical cross-talk
– 105 carriers in an avalanche breakdown emit in average 3 photons with an energy
higher than 1.14 eV (A. Lacaita et al. IEEE TED 1993)
– these photons can trigger an avalanche in an adjacent µcell
th=0.5pe
th=0.5pe
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Dark count rate @ 25°C
N. Dinu et al., NIM A, 610, 2009
N. Dinu et al., NIM A, 610, 2009
DCR – linear dependence due to triggering probability  V
- non-linear at high V due to cross-talk and after-pulses  V2


DCR scales with active surface

Critical issues:


Quality of epitaxial layer
Gettering techniques
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Photon Detection Efficiency (1)
PDE  N pulses N photons  QE  P01   geom
QE
P01
geom
Technical team: V. Chaumat, JF. Vagnucci, C. Bazin
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Photon Detection Efficiency @ 25°C (2)
Hamamatsu cell
SiPM’s from 2007 productions, 1x1 mm2
• p+n
GM-APD on n-type substrate
• Peak
of PDE optimized for blue light
(420 nm)
N. Dinu et al., NIM A, 610, 2009
FBK & SensL cell
• n+p
GM-APD on p-type substrate
• Peak of PDE optimized for green
light (500-600nm)
•PDE is depending on the SiPM cell structure
• p+/n cell is more blue sensitive than n+/p
• electron triggering probability is higher than hole triggering
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Single photon timing resolution @ 25°C
Two components :
SPT
• fast component of gaussian shape with σ O(100ps)
R
• due to photons absorbed in the depletion region
• its width depends on the statistical fluctuations of the
avalanche build-up time
(e.g. photon impact position  cell size)
• slow component: minor non gaussian tail with
time scale of O(ns)
• due to minority carriers, photo-generated in the neutral
beneath
the depletion layer G.
that
reach the junction by
FBK-irst
SiPMregions
single
photon
timing
resolution
Courtesy
of G. Collazuol
(not published)
Collazuol et al., NIM A, 581, 2007
diffusion
MePhI/Pulsar
Poisson
statistics:
σ ∝ 1/√Npe
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Thermal effects
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
Gain vs. bias voltage vs. temperature
N. Dinu, A. Nagai, A. Para, not published
T=-175°C
T=+55°C
T=-175°C
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007

Breakdown voltage vs temperature
T=+55°C
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
C.R.Crowell and S.M.Sze
Appl. Phys. Letters 9, 6(1966)
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007
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
Gain vs. overvoltage vs temperature
N. Dinu, A. Nagai, A. Para, not published
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007
8%
5%
Slope → Cµcell=125±10fF

Slope → Cµcell=90±5fF
Capacitance & quenching resistance vs. temperature
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
38 m
42 m
50 m
C   S i 0
A
d
50 m
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007
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Signal shape vs. temperature

N. Dinu, A. Nagai, A. Para, not published
T=+55°C
T=+55°C
T=-175°C
T=-175°C
fall slow  40ns@+55°C250ns@-175°C
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007

fall slow  80ns@+55°C200ns@-175°C
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
Dark count rate vs. temperature
T=+55°C
T=+55°C
T=-25°C
T=-25°C
SiPM Hamamatsu
1x1 mm2, 50x50m2
Production 2007
T=-100°C
SiPM Hamamatsu
3x3 mm2, 50x50m2
Production 2011
T=-100°C
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Arrays of SiPM - monolithic
Nicoleta Dinu
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Arrays of SiPM - discrete
Nicoleta Dinu
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PART B:
SiPM applications – medical imaging
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Techniques of nuclear imaging
• Principle
Marking
Detection
Techniques of nuclear imaging
Pharmaceutical product:
• organic molecules + radioactive isotope •  camera, topographies
• Radioactive isotopes
• 99mTc, 123I, 201Tl, 18F, 11C
• Emitters ,  + or  -
• Techniques
Cancer diagnostic (homographs)
TEMP
Cancer therapy
Per-operative detection systems
TEP
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SIPMED project
High resolution hand-held radiation detector for therapeutic purposes
SIPMED imaging camera
Radio-guided surgery

collimator
LaBr3(Ce) scintillator
5.5 cm
16 (4x4) SiPM arrays
field of view:  30 cm2
6 cm

256 readout channels (ASIC) on
miniaturized electronics boards
Collaboration IMNC, LAL, Hôpital Lariboisière
Detection system requirements in surgical conditions
• reduced size and weight
• versatility of readout electronics
• adapted for sterile environment
S11828-3344M Hamamatsu HPK
• 4x4 monolithic SiPM array
• mounted on a SMD package
• Each SiPM = one readout channel:
•3x3 mm2, 3600 cells, each cell - 50x50 m2
IV of monolithic SiPM arrays from HPK
Keithley 2611
Hi
Lo
23 arrays (368 IV’s)
1.5V VBD range
256 IV’s
16 over 23 arrays
selected for SIPMED
0.8V VBD range
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Characteristics uniformity
Plots by: A. Nagai
VBD SIPMED camera
Board SiPM 3
Board SiPM 4 Board SiPM 3
Board SiPM 4
Board SiPM 2
Board SiPM1
Board SiPM 2 Board SiPM 1
Idark @ VBIAS =72.5V
Idark @ overvoltage =1V
Board SiPM 3
Board SiPM 3
Board SiPM 4
Board SiPM 4
Board SiPM 1
Board SiPM 2
Ipost-BD  qGDCR
Board SiPM 1
Board SiPM 2
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Elementary module of SIPMED camera
USB interface
T. Ait Imando et al., PoS 2012
Front side
Elementary module
Field of view:  8 cm2
28.6 mm
Back side
Board 1:
4 (2x2) SiPM arrays
64 readout channels
Board 2:
2 EASIROC chips
64 readout channels
2 ADC 12 bits
Board 3:
FPGA
FTDI & USB
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SIPMED camera
256 SiPM’s = 256 readout channels
• Optical and electrical tests under progress
SIPMED camera
Weight: 1.2 kg
Pictures by courtesy of L. Menard
TRECaM camera based on MAPMT
Weight: 2.2 kg
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Preliminary characteristics of SIPMED camera
SIPMED energy resolution:10.5% @ 122 keV
Good linearity
TRECaM energy resolution:12.9% @ 122 keV
SIPMED spatial resolution:1.23 mm@ 122 keV
TRECaM spatial resolution:1.36 mm @ 122 keV
Plots by courtesy of L. Menard
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Conclusions and perspectives

Detector point of view: understanding of device fundamentals
 Detailed physical models of avalanche multiplication, triggering
probability
 Reducing DCR and afterpulsing contributions
 Improvement in fast timing applications
 Temperature dependence of different parameters for stable operation
 PDE improvements in UV & IR regions
.

Applications point of view
 Build large detection area
 Uniform electrical and optical characteristics
 Low dead area (3D interconnection - cost)
 Development of dedicated ASIC’s involving multichannel readout
electronics
 Studies of radiation hardness for application in high energy physics
experiments
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Additional slides
34
Read-out electronics of SIPMED
Board SIPMED2
Front side
Back side
•2 EASIROC chips/ elementary module
• two-channels externals ADC 12-bit,
2MSPS
• EASIROC chip
• 32 channels
• 8-bit input DAC, 0-2.5V range
• Low and high voltage pre-amplifiers, adjustable gain
• charge measured at maximum amplitude of slow shapers (50 to 175 ns peaking time) by two Track and
Hold blocks
• fast trigger line, made of a fast shaper and a discriminator, provides the hold signal
Board SIPMED3
Front side
Back side
• ALTERA ciclone III FPGA
• FTDI FT2232H (USB protocol 2.0 Hi-speed, 440MBit/s)
•USB mini-connector for power supply and PC
communication
•DC/DC converter for SiPM bias
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Radiation damage
• Radiation damage effects on SiPM:
• increase of dark count rate due to introduction of generation centers
• increase of after-pulse rate due to introduction of trapping centers
• may change VBD, leakage current, noise, PDE….
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