New Application for Burn-in board テストトレー搭載型バーンインボード ・Utilize Customer Keeping Burn-in Tester and Board Handler 既存のバーンイン装置（同数のBIボード搭載）、ボードハンドラーを使用 ・Test Tray will be kept on Burn-In Board テストトレーはBIボード上に保持される ・Contact Force by Vacuum Pressure コンタクト圧は真空圧を使用 ( ~0.8kg/cm2 ) ・Cost Reduction, especially for Narrow Pitch Device 大きなコストダウン が実現（Socket , Assembly：挟ピッチデバイス対応時） Simple Socket , No Socket Soldering , etc., Basic Structure of Burn-in Board Basic Structure （１DUT構成事例） Prove-pin type Invisipin type Thin PCR with Bump / Wire type Burn-in Board Application （従来Boardと同程度厚） Small Size Large Size with Fin Prove-pin Contact Pusher & Thermal Plate BGA 0.4p ***p IC Socket Frame Contact Guide Tray Frame Prove-pin Contact Board Burn in Board Contactor Life is about 100k~500k Invisipin Contact * Invisipin produced by R&D Interconnect Solutions Pusher & Thermal Plate Socket Frame BGA 0.4p ***p IC Tray Frame Contact Guide & Compression Stopper *Invisipin contact *Invisipin Contact (Mounted by SMD mounter) Burn in Board Long life spec. Invisipin *20 g / pin : 100,000 mating cycles at 125 degree *Minimum pitch : 0.4mm ( *0.35mm ) Small size Burn-in Board (1 Tray ) Pusher & Thermal Plate Sealing Burn-In Board Test Tray *Test Tray is kept on Burn-In Board Contact board & Contact Pad Vacuum Coupler *BI Board thickness is about 20 ~ 25mm Socket density is influenced by contact force . * Expectable Vacuum Force is about 0.8 ~ 0.9kg / cm2 Big Size (450*570 ) Burn-In Board Pusher & Thermal Plate *without Thermal Fin Test Tray * Test Tray is kept on Burn-In Board Burn-In Board Contact Boaord & Contact Pad Vacuum Coupler *BI Board thickness is about 20~25mm Contact Guide Socket density is influenced by contact force . * Expectable Vacuum Force is about 0.8~0.9kg / cm2 5 Cross Section of Basic Structure *Prove-pin spec. Before Vacuum Macrograph Tray Frame Socket Frame BGA-0.4p ***p After Vacuum Contact Guide Prove pin Contact Board Burn in Board For Narrow Pitch Device : 0.3mm pitch FBGA PKG spec. : Ball diameter φ0.2 mm , Ball height 0.12 mm Prove-pin contact Ball height PCR contact Ball height For Narrow Pitch Device : less than 0.3mm pitch Prove-pin contact PCR contact with Bump ＊Apply WLBI technology (③*Patented by Elfinote. 配線基板) 真空加圧構造 * 0.17mm pitch (example) Use Same technology as 0.3pitch FBGA ② 小片プローブ貼付け構造 PCR ステージ(プローバ装置) ウェーハ シールリング 配線基板 メタルフレーム Metal frame 4.15 5.56 PCB 真空バルブ 異方性導電ゴム ① 導電電極構造 メンブレンバンプ メンブレン Membrane bump Membrane *Easy to apply to WLP-CSP more than 0.1pitch Most Important Subject is How to get Device Contact Positioning Accuracy .
© Copyright 2024 ExpyDoc
