ICs
IC Packages
A
ROHM Packages
QFP Packages
SON / QFN Packages
SOP Packages
HSOP Packages
Small Packages
Non-Lead Packages
Power Packages
BGA Packages
WL-CSP Packages
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A144
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A147
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A150
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A152
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A154
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A154
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A155
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A157
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A159
LAPIS Semiconductor Packages
SOP Packages
QFP Packages
QFN Packages
BGA Packages
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A161
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A164
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A166
・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
P. A169
＊Please check the dimensions of each products in detail.
LAPIS Semiconductor products and ROHM Semiconductor dimensions
products have different although they have a same package name.
www.rohm.com
IC Packages
CONTENTS
ICs
IC Packages (ROHM)
▶ Part No. Explanation
Please refer packages from page, A160 for LAPIS Semiconductor products.
Part No. Explanation
• When ordering, specify the part number.
B A 4 5 5 8 F − D X
• Check each code against the tables shown below.
E 2
• Fill in from the left,leaving any extra boxes empty
on the right.
Part No.
Ordering information
1. A packaging specification is not required for packaging other than taping.
(Ex.) BA4558F or BA4558F-DX
Custom Specification code
Alphabetical symbols specify
custom product.
Standard product has
no symbols.
2. A packaging specification is required for tape packaging.
(Ex.) Example of E2-oriented embossed taping: BA4558F-E2 or BA4558F-DXE2
Packaging and forming specification
E2
Embossed tape and reel
Pin 1 fed last
（E1）
Embossed tape and reel
Pin 1 fed first
TR
Embossed tape and reel
Pin 1 fed last
（TL）
Embossed tape and reel
Pin 1 fed first
For example
Reel
Reel
E2
→Leader(first)
←1pin
A
→Leader(first)
(E1)
TR
→Leader(first)
1pin→
*Take E2 as standard if no special request is made.
(TL)
*Take TR as standard if no special request is made.
IC Packages
A142
←1pin
Reel(last)
Reel(last)
→Leader(first)
1pin→
www.rohm.com
ICs
IC Packages (ROHM)
▶ Package Ordering Units ▶▶Embossed tape packaging <Package specification name : E2(E1)>
▶▶Tray packaging
Please refer packages from page, A160 for LAPIS Semiconductor products.
Package Ordering Units
●Embossed tape packaging <Package specification name : E2(E1)>
Package
ordering
unit quantity
Non - Lead
Gull Wing Packages
SOP Packages
Power Packages
QFP Packages
BGA / QFN
5,000
*SSON004X1216
SSON004X1010
-
-
-
-
4,000
USON016X3315,
WSON008X2120
-
-
-
-
-
-
3×3mm
-
-
4×4mm,
5×5mm
-
6×6mm
-
QFP32, VQFP48C, HTQFP48V
UQFP64,TQFP64U
7×7mm
-
QFP44, VQFP64, VQFP80,
UQFP100,TQFP64V
*SOP4, *SSOP5/6, *VSOF5,
*HVSOF5/6,*MSOP8, MSOP10,
*WSOF5/6/6I, *HSON8,
*VSON008V2030,
VSON008X2030,
VSON010X3020,
TSSOP-B8
VSON010X3030,
VSON010V3030,
USON014X3020,
VQFN016X3030,
VQFN016V3030,
WL-CSP (2.8mm□ and under)
3,000
2,000
VQFN040V6060,
UQFN044V6060,
UQFN046V4565,
UQFN048V6060
SOP18/20/22/24,
HTSSOP-B30,
SSOP-A20/24/32,
SSOP-B24/28/40,
HTSSOP-C48,HTSSOP-B24/40,
HSOP25, TSSOP-C44
1,500
VQFN048V7070,
UQFN048V7070,
UQFN056V7070
SOP28, SSOP-A44,
HTSSOP-A44/B54/A44R/B54R
HSOP28/M28/M36
1,000
VQFN056V8080,
UQFN064V8080,
UQFN068V8080,
UQFN088V0100
*HRP5/7, TO252S-3/5,
SOT223-4
-
-
500
1)
SOP8/14/16, SSOP-A16,
TSSOP-C10J, TSSOP-B14J
SSOP-B8/14/16/20, SOP-J8/14,
HTSSOP-B20/28, HTSOP-J8,
TSSOP-B8J, HTSSOP-B8J,
TSSOP-C30
TO220CP-3/V5,
TO263-3/5
-
A
IC Packages
2,500
VQFN020V4040,
VQFN024V4040,
VQFN028V5050,
VQFN032V5050,
UQFN036V5050,
UQFN040V5050,
WL-CSP (over 2.81mm□)
8×8mm, 9×9mm,
10×10mm
-
VQFP100
*:Package specification : TR(TL) 2) Specification differ by package size of WL-CSP 3) WL-CSP Package Specification : E2 (standard)
●Tray packaging
Pin pitch: 0.8 mm
Pin pitch: 0.65 mm
-
QFP32
Pin pitch: 0.5 mm
Pin pitch: 0.4 mm
-
VQFP48C
Dimensions Individual Tray
(mm) d X e package
quantity quantity
Package Tomson Case dimensions
ordering
(mm) A X B X C
unit quantity
175×166
100
10
1,000
60×200×200
QFP44
SQFP56,
SQFP-T52M, SQFP-T64
VQFP64, VQFP64M, VQFP80,
TQFP64V, TQFP80V,
HTQFP64V, TQFP48V
UQFP64M, UQFP80,
UQFP100, TQFP64U
216×116
50
20
1,000
70×130×510
QFP-A64, QFP80/T80
SQFP80, SQFP-T80C,
SQFP100/T100
VQFP100, VQFP128,
TQFP100V, HTQFP100V
UQFP120,
TQFP128U
256×166
50
10
500
75×200×290
QFP120
SQFP160C
VQFP208
-
322.6×135.9
24
10
240
75×140×338
VQFP176
-
322.6×135.9
40
10
400
75×140×338
TQFP176U
201.1×141.05
20
10
200
75×200×290
UQFP160/184
322.6×135.9
60
10
600
75×140×338
-
-
-
-
-
-
-
VQFP144 / T144
www.rohm.com
A143
ICs
▶ QFP Packages ▶▶QFP＜Pin Pitch：0.8mm＞
▶▶SQFP＜Pin Pitch：0.65mm＞
▶▶TQFPV＜Pin Pitch：0.5mm＞
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
QFP Packages (Unit: mm)
QFP <Pin Pitch : 0.8mm>
QFP32
QFP44
14.0±0.3
10.0±0.2
9.0±0.3
33
7.0±0.2
32
0.4
16
9
8
0.8
22
44
12
0.15±0.1
0.4±0.1
1
0.15
11
0.15±0.1
S
2.15±0.1
0.05
1
23
34
1.2
14.0±0.3
10.0±0.2
17
25
1.45±0.05
0.05
9.0±0.3
7.0±0.2
24
0.8
Tray：1,000pcs
Embossed carrier tape：1,500pcs
0.15 S
0.35±0.1
Tray：1,000pcs
Embossed carrier tape：1,000pcs
SQFP <Pin Pitch : 0.65mm>
SQFP-T52
SQFP-T64
SQFP160C
31.2±0.3
28.0±0.2
14.0±0.3
12.0±0.2
0.125±0.1
160
1.4±0.1
0.1±0.1
1.4±0.1
0.1±0.1
A
16
1
0.15
0.65 0.3±0.1
17
64
0.125±0.1
41
1
0.65±0.1
0.15
3.3±0.1
14
13
1
0.3±0.1
Tray：1,000pcs
Embossed carrier tape：1,000pcs
40
0.15±0.1
0.65
0.1
0.5
12.0±0.3
10.0±0.2
52
32
0.8
49
26
40
80
28.0±0.2
27
33
0.5
39
48
121
31.2±0.3
12.0±0.3
10.0±0.2
81
120
14.0±0.3
12.0±0.2
0.3±0.1
0.15
Tray：1,000pcs
Tray：240pcs
TQFP64V
TQFP80V
14.0±0.3
12.0±0.3
M
Tray：1,000pcs
Embossed carrier tape：1,500pcs
0.5
0.2±0.1
0.1
Tray：1,000pcs
Embossed carrier tape：1,000pcs
TQFP100V
16.0±0.3
14.0±0.2
51
75
50
100
26
A144
25
0.125±0.1
0.1±0.1
1.2Max.
1
0.5
14.0±0.2
16.0±0.3
76
0.5
0.2±0.1
0.1
Tray：500pcs
Embossed carrier tape：500pcs
www.rohm.com
14.0±0.3
12.0±0.2
21
1
0.1±0.1
0.08
0.125±0.1
1.0±0.1
+0.05
0.22 -0.04
40
80
16
1.2Max.
1.2Max.
0.08 S
0.5
17
1
41
61
32
64
+0.05
0.145 -0.03
1PIN MARK
60
33
49
0.1±0.1
0.75
12
1.0±0.1
1
12.0±0.3
13
48
1.2MAX
1.0±0.05
0.1±0.05
0.5±0.15
1.0±0.2
24
48
10.0±0.2
25
0.75
9.0±0.2
7.0±0.1
36
4 +6
–4
0.5
9.0±0.2
7.0±0.1
37
12.0±0.2
10.0±0.2
0.5
TQFP48V
1.0±0.1
IC Packages
TQFPV <Pin Pitch : 0.5mm>
0.2±0.1
20
0.5
0.125±0.1
0.08
Tray：1,000pcs
ICs
IC Packages (ROHM)
▶ QFP Packages ▶▶VQFP＜Pin Pitch：0.5mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
QFP Packages
(Unit: mm)
VQFP <Pin Pitch : 0.5mm>
VQFP64
VQFP80
0.08 S
0.2+0.05
-0.04
0.08 M
VQFP100
1.25
12.0±0.1
14.0±0.2
1.25
Tray：1,000pcs
Embossed carrier tape：1,500pcs
1PIN MARK
40
21
80
16
1
20
1
+0.05
1.25
0.145 -0.03
4° +6°
–4°
0.08 S
0.08 M
0.2+0.05
-0.04
0.5 ±0.1
Tray：1,000pcs
Embossed carrier tape：1,000pcs
1PIN MARK
+0.05
0.145 -0.03
S
1.6MAX
1.4±0.05
0.1±0.05
4° +6°
–4°
0.5 ± 0.1
17
64
1.25
+0.05
0.145 -0.03
0.5±0.15
1.0±0.2
12
1PIN MARK
41
61
32
49
1.6MAX
1.4 ±0.05
0.1±0.05
1
12.0±0.2
10.0±0.1
13
48
0.75
1.6MAX
1.4±0.05
0.1±0.05
0.5±0.15
1.0±0.2
24
0.75
9.0±0.2
7.0±0.1
37
12.0±0.1
60
33
48
25
36
14.0±0.2
12.0± 0.2
10.0± 0.1
9.0±0.2
7.0±0.1
0.5±0.15
1.0±0.2
VQFP48C
4° +6°
–4°
0.2+0.05
-0.04
0.08 S
0.08 M
0.5 ± 0.1
Tray：1,000pcs
Embossed carrier tape：1,000pcs
VQFP-T144
VQFP144
22.0 ±0.2
M
Tray：500pcs
Embossed carrier tape：500pcs
0.5± 0.1
VQFP208
1.0 ±0.2
0.5 ±0.15
1.25
22.0±0.2
20.0±0.1
0.5 ±0.1
0.08 S
0.08 M
Tray：600pcs
M
Tray：400pcs
1PIN MARK
0.5±0.15
1.25
52
1.3± 0.2
28.0± 0.1
53
1
+0.05
0.17 -0.03
4° ±4°
0.1± 0.05
3.5MAX
0.08 S
0.08
30.6± 0.2
0.5± 0.15
1.0 ±0.2
1.25
3.5° +6.5°
–3.5°
104
208
+0.05
0.17 -0.03
3.3±0.05
44
1.25
26.0± 0.2
3.5° +6.5°
–3.5°
0.2 +0.05
-0.04
105
157
24.0±0.1
45
176
0.2 +0.05
-0.04
0.08 S
M
+0.05
0.17 -0.03
30.6 ± 0.2
156
89
88
0.5±0.1
2.5° +7.5°
–2.5°
0.5 ±0.1 0.2 +0.05
-0.04 0.08
1PIN MARK
28.0 ±0.1
133
1PIN MARK
1.25
+0.05
0.17 -0.03
Tray：600pcs
26.0 ± 0.2
24.0 ± 0.1
1
36
0.22 +0.05
-0.04
0.08
A
IC Packages
VQFP176
1PIN MARK
36
1
1.6MAX
0.08 S
1
37
144
1.4 ±0.05
0.1 ±0.05
1.25
4° +6°
–4°
0.08
0.5±0.15
1.0±0.2
20.0±0.1
2.2MAX
1.25
2.0±0.05
0.1±0.05
0.1±0.05
22.0±0.2
0.5±0.15
1.0±0.2
1.0
14.0±0.1
16.0±0.2
1.6MAX
1.4 ±0.05
1PIN MARK
+0.05
0.145 -0.03
132
37
144
25
+0.05
0.2 -0.04
72
109
26
1
73
108
50
100
1.6MAX
1.4±0.05
0.1± 0.05
20.0 ±0.1
72
109
51
76
1.25
73
108
14.0 ± 0.1
1.0
22.0 ±0.2
20.0±0.1
16.0 ± 0.2
75
0.08 S
M
0.5±0.1
www.rohm.com
Tray：240pcs
A145
ICs
▶ QFP Packages ▶▶UQFP＜Pin Pitch：0.4mm＞
▶▶TQFPU＜Pin Pitch：0.4mm＞
▶▶HTQFPV＜Pin Pitch：0.5mm＞
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
QFP Packages
(Unit: mm)
UQFP <Pin Pitch : 0.4mm>
UQFP64M
UQFP80
9.0± 0.2
12.0 ± 0.2
7.0± 0.1
10.0 ± 0.1
33
0.5
21
80
1
1.2
16
1
0.5
40
0.5 ± 0.15
1.0 ± 0.2
17
41
61
1.2
64
10.0 ± 0.1
32
0.6±0.15
1.0±0.2
49
12.0 ± 0.2
60
7.0±0.1
9.0±0.2
48
20
+0.05
0.145 -0.03
0.145 ±0.055
1PIN MARK
0.18±0.05
1.6Max.
0.08 S
0.4
4° +6°
–4°
0.4
1.4 ± 0.05
0.1 ± 0.05
4° +6°
–4°
1.4±0.05
0.1±0.05
1.6MAX
S
0.08 S
+0.05
0.17 -0.04
0.08
M
Tray：1,000pcs
Embossed carrier tape：1,500pcs
Tray：1,000pcs
Embossed carrier tape：1,000pcs
UQFP120
16.0 ± 0.2
14.0 ± 0.1
61
90
60
0.5 ± 0.15
1.0 ± 0.2
14.0 ± 0.1
31
120
1
1.2
30
1.2
16.0 ± 0.2
91
+0.05
0.145 -0.03
3.5° +6.5°
–3.5°
0.4
0.1 ± 0.05
IC Packages
1.6Max.
A
1.4 ± 0.05
1PIN MARK
0.08 S
+0.05
0.17 -0.04
0.08
M
Tray：500pcs
TQFPU <Pin Pitch : 0.4mm>
TQFP64U
TQFP128U
16.0 ± 0.2
14.0 ± 0.1
9.0 ± 0.3
96
7.0 ± 0.2
128
0.125 ± 0.1
0.15±0.1
0.1 ± 0.05
1.2Max.
0.08
1.0 ± 0.05
1.0±0.05
0.1±0.05
0.8
0.4
0.5 ± 0.15
1.0 ± 0.2
17
16
33
0.8
64
64
14.0 ± 0.1
32
1
1.2Max.
16.0 ± 0.2
49
65
97
33
0.5
9.0 ± 0.3
7.0 ± 0.2
48
32
1
+0.05
0.145 -0.03
3° +7°
–3°
0.4
+0.05
0.18 -0.04
0.08 S
0.08
M
Tray：1,000pcs
Embossed carrier tape：1,500pcs
Tray：500pcs
HTQFPV <Pin Pitch : 0.5mm>
HTQFP64V
Tray：1,000pcs
Embossed carrier tape：1,500pcs
A146
+0.05
0.145 -0.03
0.08 S
0.08
M
Tray：1,000pcs
Embossed carrier tape：1,000pcs
www.rohm.com
1.0
0.1 ± 0.05
S
4° +6°
–4°
+0.05
0.2 -0.04
26
100
16
1PIN MARK
0.5
50
14.0 ± 0.1
16.0 ± 0.2
1.0 ± 0.2
0.5 ± 0.15
1.25
17
1
51
76
32
1.0Max.
0.08 S
0.08 M
33
64
1.25
75
0.8 ± 0.05
0.5 0.2 +0.05
-0.04
S
+0.05
0.145 -0.03
12.0 ± 0.2
10.0 ± 0.1
17
12
1PIN MARK
48
49
1.0Max.
0.8 ± 0.05
0.1 ± 0.05
0.1 ± 0.05
1.0MAX
0.8 ± 0.05
0.5 ± 0.15
48
0.75 1
24
0.75
9.0 ± 0.2
7.0 ± 0.1
(4.4)
37
4° +6°
–4°
25
1.0 ± 0.2
36
16.0 ± 0.2
14.0 ± 0.1
12.0 ± 0.2
10.0 ± 0.1
1
0.5 ± 0.15
1.0 ± 0.2
9.0 ± 0.2
7.0 ± 0.1
(4.4)
HTQFP100V
1.0
HTQFP48V
25
+0.05
0.145 -0.03
1PIN MARK
4° +6°
–4°
0.5 ± 0.1
0.08 S
+0.05
0.2 -0.04
0.08
M
Tray：500pcs
ICs
▶ SON / QFN Packages ▶▶SSON-X＜Pin Pitch：0.65mm＞
▶▶VSON-V＜Pin Pitch：0.5mm＞
▶▶VSON-X＜Pin Pitch：0.5mm＞/ USON-X＜Pin Pitch：0.4mm＞
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
SON / QFN Packages
(Unit: mm)
SSON-X <Pin Pitch : 0.65mm>
SSON004X1010
VSON-V <Pin Pitch : 0.5mm>
SSON004X1216
VSON008V2030
VSON010V3030
2.0±0.1
1.6±0.1
1.0±0.1
1.2 ± 0.1
0.07±0.1
0.25±0.1
5
.0
±0
48
0.
0.25±0.05
4
5
2
3
10
0.75± 0.1
8
5
0.25
Embossed carrier tape：5,000pcs
0.5
1
1.4±0.1
3
2.0 ± 0.1
C0.25
4
0.3±0.1
4
1
0.8±0.1
R0.05
0.2±0.1
45°
0.08 S
0.5
1
+0.05
0.2 -0.04
0.02 +− 0.03
0.02
(0.22)
1.5±0.1
C0.25
0.65 ± 0.1
1.0MAX
1.0MAX
0.08 S
S
1.2 ± 0.1
3-C0.18
2
S
(0.22)
0.08 S
1PIN MARK
0.4 ± 0.1
1
S
(0.12)
(0.12)
0.02 +0.03
-0.02
0.
05
0.32±0.1
0.
48
±
0.65±0.05
0.6MAX
S
1PIN MARK
0.02 +0.03
-0.02
0.6MAX
1PIN MARK
+0.03
0.02 0.02
1PIN MARK
0.05 S
3.0 ± 0.1
3.0±0.1
1.0±0.1
3.0 ± 0.1
Embossed carrier tape：5,000pcs
+0.05
0.25 -0.04
6
0.25 +− 0.05
0.04
0.5
Embossed carrier tape：3,000pcs
Embossed carrier tape：3,000pcs
VSON-X <Pin Pitch : 0.5mm> / USON-X <Pin Pitch : 0.4mm>
VSON008X2030
VSON008X2020
VSON010X3020
2.0±0.1
A
3.0 ± 0.1
3.0±0.1
2.0 ± 0.1
IC Packages
2.0 ± 0.05
2.0 ± 0.05
1PIN MARK
1PIN MARK
0.5
1
2.0 ± 0.1
4
C0.2
0.5 ± 0.1
0.4 ± 0.1
0.3±0.1
0.3 ± 0.1
8
1.4±0.1
1
0.8 ± 0.1
4
5
0.25 +− 0.05
0.04
8
1.5 ± 0.1
5
0.25
Embossed carrier tape：4,000pcs
VSON010X3030
10
+0.05
0.25 -0.04
0.64 ± 0.1
C0.25
1.5 ± 0.1
1
0.05 S
1.5±0.1
0.5 ± 0.1
C0.25
0.02 +− 0.03
0.02
(0.12)
0.08 S
S
(0.12)
0.05 S
S
+0.03
0.02 0.02
0.03
0.02 +− 0.02
(0.12)
S
0.6MAX
0.6MAX
0.6MAX
1PIN MARK
5
6
0.25 +− 0.05
0.04
2.39 ± 0.1
Embossed carrier tape：3,000pcs
USON014X3020
Embossed carrier tape：3,000pcs
USON016X3315
3.0 ± 0.1
3.3 ± 0.1
1PIN MARK
C0.35
5
0.5
6
0.3
0.6MAX
0.05 S
2.8 ± 0.1
C0.25
7
1
0.8±0.1
14
10
2.5 ± 0.1
0.4
0.35 ± 0.1
0.4 ± 0.1
1.2 ± 0.1
1
0.03
0.02 +− 0.02
(0.12)
+ 0.03
S
S
8
0.21 +− 0.05
0.04
16
0.4 ± 0.1
0.2 +− 0.05
0.04
8
0.6 ± 0.1
0.5
1
0.08
S
0.25 ± 0.1
2.0 ± 0.1
C0.25
0.6MAX.
0.02 +− 0.03
0.02
(0.12)
S
1PIN MARK
0.02 − 0.02
(0.12)
0.6MAX
1PIN MARK
0.08 S
1.5 ± 0.1
2.0 ± 0.1
3.0 ± 0.1
3.0 ± 0.1
9
2.9 ± 0.1
0.25 +− 0.05
0.04
Embossed carrier tape：3,000pcs
Embossed carrier tape：3,000pcs
www.rohm.com
Embossed carrier tape：4,000pcs
A147
ICs
IC Packages (ROHM)
▶ SON / QFN Packages ▶▶VQFN-X＜Pin Pitch：0.5mm＞
▶▶VQFN-V＜Pin Pitch：0.5mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
SON / QFN Packages
(Unit: mm)
VQFN-X <Pin Pitch : 0.5mm>
VQFN016X3030
3.0 ± 0.1
3.0 ± 0.1
0.6MAX
1PIN MARK
+0.03
0.02 -0.02
(0.12)
S
0.08 S
1.4 ± 0.1
0.5
1
4
5
16
13
1.4 ± 0.1
0.4 ± 0.1
R0.2
8
9
+0.05
0.25 -0.04
12
0.75
Embossed carrier tape：3,000pcs
VQFN-V <Pin Pitch : 0.5mm>
VQFN016V3030
VQFN024V4040
4.0 ± 0.1
5.0 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
IC Packages
3.0 ± 0.1
3.0 ± 0.1
VQFN028V5050
1PIN MARK
5.0 ± 0.1
A
VQFN020V4040
1PIN MARK
1PIN MARK
24
0.5
16
17
+0.05
0.25 -0.04
21
+0.05
0.25 -0.04
Embossed carrier tape：2,500pcs
Embossed carrier tape：2,000pcs
(0.22)
+0.03
0.02 -0.02
1.0MAX.
2.7 ± 0.1
0.4 ± 0.1
8.0 ± 0.1
24
36
0.75
A148
+0.03
0.02-0.02
(0.22)
37
0.5
25
+0.05
0.25 -0.04
Embossed carrier tape：1,500pcs
www.rohm.com
1
5.7 ± 0.1
56
13
(0.22)
(0.22)
+0.03
0.02-0.02
0.5
+0.03
0.02 -0.02
1.0MAX
20
30
0.08 S
12
48
S
C0.2
4.7 ± 0.1
1
11
31
0.75
0.08 S
C0.2
10
1PIN MARK
S
4.7 ± 0.1
3.4 ± 0.1
25
0.75
3.7 ± 0.1
1
40
9
32
0.4 ± 0.1
C0.2
8
3.7 ± 0.1
3.4 ± 0.1
(0.22)
+0.03
0.02 -0.02
1
0.08 S
0.4 ± 0.1
C0.2
8.0 ± 0.1
7.0 ± 0.1
6.0 ± 0.1
5.0 ± 0.1
1.0MAX
0.08 S
VQFN056V8080
1PIN MARK
S
15
+0.05
0.25 -0.04
Embossed carrier tape：2,500pcs
7.0 ± 0.1
1PIN MARK
S
14
21
1.0 0.5
Embossed carrier tape：2,500pcs
6.0 ± 0.1
1PIN MARK
22
+0.05
0.25 -0.04
VQFN048V7070
VQFN040V6060
5.0 ± 0.1
12
13
+0.03
0.02 -0.02
Embossed carrier tape：2,500pcs
8
14
15
5.7 ± 0.1
VQFN032V5050
19
0.75 18
0.5
+0.05
0.25 -0.04
7
1.0MAX
1.0
0.5
Embossed carrier tape：3,000pcs
1.0MAX
10
11
15
2.7 ± 0.1
1
28
7
24
0.4 ± 0.1
16
6
(0.22)
8
9
+0.05
0.25 -0.04
6
20
1
S
C0.2
2.4 ± 0.1
C0.2
1.0MAX
12
0.75
2.1 ± 0.1
5
0.4 ± 0.1
13
0.4 ± 0.1
5
1
S
0.08
2.4 ± 0.1
C0.2
S
0.08 S
0.4 ± 0.1
1.4 ± 0.1
0.5
1
4
16
+0.03
0.02 -0.02
(0.22)
0.08 S
1.4 ± 0.1
C0.2
S
2.1 ± 0.1
+0.03
0.02 -0.02
(0.22)
S
0.08 S
0.4 ± 0.1
1.0MAX
1.0MAX
1PIN MARK
43
28
42
0.75
0.5
29
+0.05
0.25-0.04
Under Development
Embossed carrier tape：1,000pcs
ICs
IC Packages (ROHM)
▶ SON / QFN Packages ▶▶UQFN-V＜Pin Pitch：0.4mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
SON / QFN Packages
(Unit: mm)
UQFN-V <Pin Pitch : 0.4mm>
0.4
20
21
+0.05
0.2 -0.04
30
0.7
Embossed carrier tape：2,500pcs
UQFN046V4565
0.4
6.0 ± 0.1
22
36
0.8
UQFN056V7070
0.4
(0.22)
24
25
+0.05
0.2 -0.04
Embossed carrier tape：2,000pcs
UQFN064V8080
8.0 ± 0.1
7.0 ± 0.1
8.0 ± 0.1
7.0 ± 0.1
46
32
33 0.65
0.4
+0.05
24
37
1.3
UQFN068V8080
36
0.4
25
+0.05
0.2 -0.04
28
0.9
Embossed carrier tape：1,500pcs
1.0MAX
0.4
29
+0.05
0.2 -0.04
Embossed carrier tape：1,500pcs
1
5.7 ± 0.1
(0.22)
+0.03
0.02 -0.02
0.08 S
14
16
17
64
5.7 ± 0.1
4.7 ± 0.1
43
42
0.2 -0.04
Embossed carrier tape：2,000pcs
1.0MAX
13
4.7 ± 0.1
1
0.5 ± 0.1
3.1 ± 0.1
48
S
C0.2
15
56
0.5 ± 0.1
24
12
1
4.7 ± 0.1
0.5 ± 0.1
1
23
(0.22)
(0.22)
+0.03
10
9
+0.03
0.02 -0.02
4.7 ± 0.1
C0.2
5.1 ± 0.1
0.08 S
C0.2
(0.22)
1.0MAX.
1.0MAX
0.02 -0.02
S
1PIN MARK
S
+0.03
0.02 -0.02
4.5 ± 0.1
7.0 ± 0.1
1PIN MARK
S
0.08
A
49
32
48
1.0
33
0.4
+0.05
0.2 -0.04
Embossed carrier tape：1,000pcs
UQFN088V0100
10.0 ± 0.1
8.0 ± 0.1
10.0 ± 0.1
8.0 ± 0.1
1PIN MARK
1
18
6.0 ± 0.1
88
0.8
35
0.4
+0.05
0.2 -0.04
6.0 ± 0.1
0.4 ± 0.1
34
51
67
44
66
0.8
Embossed carrier tape：1,000pcs
22
23
4.3 ± 0.1
52
(0.22)
0.08 S
C0.2
17
1
68
0.4 ± 0.1
S
+0.03
0.02 -0.02
4.3 ± 0.1
(0.22)
+0.03
0.02 -0.02
0.08 S
C0.2
1.0MAX
1.0MAX
1PIN MARK
S
0.4
45
+0.05
0.2 -0.04
Under Development
Embossed carrier tape：1,000pcs
www.rohm.com
A149
IC Packages
S
0.08 S
0.65
37
23
+0.05
0.2 -0.04
Embossed carrier tape：2,000pcs
1PIN MARK
0.4 ± 0.1
13
6.5 ± 0.1
1PIN MARK
0.355 ± 0.1
0.4
12
4.4 ± 0.1
3.7 ± 0.1
34
7.0 ± 0.1
C0.2
1
48
12
1.0
UQFN048V7070
4.4 ± 0.1
C0.2
11
33
Embossed carrier tape：2,500pcs
1.0MAX.
+0.03
0.02 -0.02
(0.22)
+0.03
0.02 -0.02
31
19
+0.05
0.2 -0.04
S
S
0.45 ± 0.1
18
27
0.9
3.3 ± 0.1
0.4 ± 0.1
2.7 ± 0.1
28
1
44
11
0.08
3.7 ± 0.1
C0.2
10
40
10
0.08 S
3.3 ± 0.1
1
9
S
0.5 ± 0.1
1
36
0.5 ± 0.1
(0.22)
+0.03
0.02 -0.02
C0.2
2.7 ± 0.1
C0.2
S
0.08 S
1PIN MARK
1PIN MARK
1.0MAX
1.0MAX
1.0MAX
0.08 S
6.0 ± 0.1
6.0 ± 0.1
5.0 ± 0.1
1PIN MARK
1PIN MARK
S
UQFN048V6060
6.0 ± 0.1
5.0 ± 0.1
5.0 ± 0.1
5.0 ± 0.1
UQFN044V6060
+0.03
0.02 -0.02
UQFN040V5050
(0.22)
UQFN036V5050
ICs
IC Packages (ROHM)
▶ SOP Packages ▶▶SOP＜Pin Pitch：1.27mm＞
▶▶SSOP-A＜Pin Pitch：0.8mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
SOP Packages
(Unit: mm)
SOP <Pin Pitch : 1.27mm>
SOP14
1 2 3 4
9
1
7
1
8
0.1 S
SOP18
Embossed carrier tape：2,500pcs
SOP20
0.1
SOP22
0.1
11
0.15±0.1
1.8± 0.1
0.11
1.8± 0.1
0.11
1
0.15 ±0.1
0.15± 0.1
1.27
12
0.3MIN
10
22
5.4±0.2
1
7.8±0.3
0.3MIN
11
0.3MIN
9
(MAX 13.95 include BURR)
20
5.4±0.2
1
7.8±0.3
10
5.4±0.2
18
13.6± 0.2
(MAX 12.85 include BURR)
(MAX 11.55 include BURR)
1.8± 0.1
0.4 ±0.1
Embossed carrier tape：2,500pcs
12.5± 0.2
11.2±0.2
0.4±0.1
1.27
0.1
0.4± 0.1
1.27
0.1
0.4±0.1
Embossed carrier tape：2,000pcs
A
Embossed carrier tape：2,000pcs
Embossed carrier tape：2,000pcs
SOP28
18.5± 0.2
(MAX 18.85 include BURR)
15.0±0.2
12
0.3MIN
15
0.15± 0.1
1
14
0.3MIN
1
28
7.5± 0.2
13
5.4± 0.2
24
9.9± 0.3
(MAX 15.35 include BURR)
2.2 ±0.1
0.4±0.1
1.27
0.1
0.11
0.11
1.8± 0.1
0.15±0.1
0.4± 0.1
1.27
Embossed carrier tape：2,000pcs
0.1
Embossed carrier tape：1,500pcs
SSOP-A <Pin Pitch : 0.8mm>
SSOP-A20
SSOP-A24
1 2 3 4 5 6 7 8
0.15± 0.1
0.36 ± 0.1
0.8
24
13
1
10
1
12
0.8
0.15± 0.1
0.36±0.1
0.1
0.1
Embossed carrier tape：2,500pcs
SSOP-A32
Embossed carrier tape：2,000pcs
SSOP-A44
18.5 ± 0.2
(MAX 18.85 include BURR)
13.6±0.2
0.36±0.1
0.1
0.3Min.
7.5 ± 0.2
0.3MIN
0.8
9.5 ± 0.3
16
1
1.7 ± 0.1
1
23
22
0.15 ± 0.1
0.1
17
5.4±0.2
32
44
0.15± 0.1
0.11
7.8±0.3
(MAX 13.95 include BURR)
0.8
Embossed carrier tape：2,000pcs
A150
0.36 ± 0.1
0.1
Embossed carrier tape：1,500pcs
www.rohm.com
4° +6°
–4°
0.5±0.2
1.2±0.15
5.4 ± 0.2
11
7.8 ± 0.3
10 ± 0.2
(MAX 10.35 include BURR)
20
5.4±0.2
1.8±0.1
0.11
1.5± 0.1
0.11
7.8±0.3
0.3MIN
6.2±0.3
4.4±0.2
16 15 14 13 12 11 10 9
8.7± 0.2
(MAX 9.05 include BURR)
1.8 ± 0.1
0.1 ± 0.1
6.6±0.2
(MAX 6.95 include BURR)
0.3MIN
SSOP-A16
1.8±0.1
IC Packages
SOP24
7.8± 0.3
1.27
0.15 ±0.1
1.27 0.42± 0.1
Embossed carrier tape：2,500pcs
7.8±0.3
0.1
0.4 ±0.1
0.3MIN
0.3MIN
1.27
0.15 ±0.1
0.11
1.5± 0.1
16
1.5±0.1
0.11
+0.1
0.17 -0.05
S
0.11
10 ±0.2
(MAX 10.35 include BURR)
8
6.2±0.3
4.4±0.2
0.3MIN
0.9±0.15
6.2±0.3
4.4 ±0.2
0.595
8.7± 0.2
(MAX 9.05 include BURR)
14
4.4±0.2
4° +6°
–4°
8 7 6 5
6.2±0.3
5.0±0.2
(MAX 5.35 include BURR)
SOP16
1.5±0.1
0.11
SOP8
0.8
+0.1
0.17 -0.05
0.38 ± 0.1
0.1
Embossed carrier tape：2,000pcs
ICs
IC Packages (ROHM)
▶ SOP Packages ▶▶SSOP-B＜Pin Pitch：0.65mm＞
▶▶JEDEC＜Pin Pitch：1.27mm/0.65mm/0.5mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
SOP Packages
(Unit: mm)
SSOP-B <Pin Pitch : 0.65mm>
SSOP-B14
Embossed carrier tape：2,500pcs
28
15
1
12
1
14
1.15 ± 0.1
0.3Min.
0.15 ± 0.1
0.1
0.3Min.
0.1
1.15 ± 0.1
0.3Min.
4.4 ± 0.2
0.1
0.22 ± 0.1
Embossed carrier tape：2,500pcs
13.6 ± 0.2
7.8 ± 0.3
13
0.1
0.65
(MAX 13.95 include BURR)
5.6 ± 0.2
24
7.6 ± 0.3
10 ± 0.2
(MAX 10.35 include BURR)
0.65
10
SSOP-B40
7.8 ± 0.2
(MAX 8.15 include BURR)
5.6 ± 0.2
7.6 ± 0.3
SSOP-B28
0.15 ± 0.1
1.15 ± 0.1
0.1
0.65
0.22 ± 0.1
Embossed carrier tape：2,500pcs
SSOP-B24
1
0.65
0.1
40
21
1
20
0.5 ± 0.2
Embossed carrier tape：2,500pcs
6.4 ± 0.3
0.3Min.
0.1
0.65
0.22 ± 0.1
M
11
0.15 ± 0.1
0.1± 0.1
0.08
8
20
0.15 ± 0.1
1.15 ± 0.1
0.10
0.1 S
+0.06
0.22 -0.04
1
0.15 ± 0.1
0.10
1.15 ± 0.1
(0.52)
9
0.3Min.
7
6.5 ± 0.2
16
4.4 ± 0.2
1
4.4 ± 0.2
8
6.4 ± 0.3
5.0 ± 0.2
14
0.15 ± 0.1
S
SSOP-B20
5.4 ± 0.2
1234
1.15±0.1
0.1
6.4 ± 0.3
0.3MIN
4.4±0.2
6.4±0.3
8765
0.65
SSOP-B16
5.0 ± 0.2
1.8 ± 0.1
3.0 ±0.2
(MAX 3.35 include BURR)
0.15 ± 0.1
0.1
SSOP-B8
0.22 ± 0.1
0.65
0.22 ± 0.1
0.22 ± 0.1
Embossed carrier tape：2,000pcs
Embossed carrier tape：2,000pcs
0.08
0.1 S
M
Embossed carrier tape：2,000pcs
SOP-J14
TSSOP-B8
+0.05
0.42 -0.04
0.08 S
0.65
0.32 +0.05
-0.04
0.08
M
TSSOP-C30
+0.05
0.245 -0.04
0.08
M
Embossed carrier tape：3,000pcs
4° +6°
–4°
14
0.45 ± 0.15
0.95 ± 0.2
1 2345
0.145 +0.05
-0.03
1PIN MARK
0.55
S
0.08 S
0.5
Embossed carrier tape：2,500pcs
0.22 +0.05
-0.04
0.08
M
Embossed carrier tape：2,500pcs
4°± 4°
8
1
7
+0.05
0.145 -0.03
1PIN MARK
S
0.08 S
0.65
0.245 +0.05
-0.04
0.08
M
Embossed carrier tape：2,500pcs
TSSOP-C44
7.8±0.1
(MAX 8.15 include BURR)
11.3±0.1
(MAX 11.65 include BURR)
+6°
4゜
-4°
44
15
+0.05
1PIN MARK
0.5
0.08
0.4
0.145 -0.03
+0.05
0.22 -0.04
0.08
M
Embossed carrier tape：2,500pcs
1.2MAX
1.0±0.05
0.1±0.05
1
0.5±0.15
1.0±0.2
0.5±0.15
1.0±0.2
0.4
4° +6°
-4°
23
6.4±0.2
4.4±0.1
16
6.4±0.2
4.4±0.1
30
0.1±0.05
M
1.2MAX
1.1MAX
0.85 ± 0.05
0.1 ± 0.05
S
0.08 S
0.65
5.0±0.1
(Max 5.35 include BURR)
3.0 ± 0.1
4.9 ± 0.2
0.45±0.15
0.95±0.2
3.0±0.1
4.9±0.2
1.1MAX
0.85±0.05
0.1±0.05
0.5
+0.05
0.145 -0.03
1PIN MARK
S
TSSOP-B14J
10 9 8 7 6
1 2 34
0.525
0.145 +0.05
-0.03
1PIN MARK
Embossed carrier tape：2,500pcs
3.0 ± 0.1
(Max 3.35 include BURR)
4°± 4°
8765
1.0±0.05
0.08
TSSOP-C10J
3.0± 0.1
(MAX 3.35 include BURR)
1.2MAX
6.4± 0.2
4.4± 0.1
0.08 S
6.4±0.2
TSSOP-B8J
S
1.27
1 234
0.525
1.0±0.2
Embossed carrier tape：2,500pcs
+0.05
0.22 -0.03
0.5±0.15
0.42±0.1
7
1PIN MARK
4.4±0.1
0.1 S
1.65MAX
1.375± 0.075
0.175
1.375±0.1
1.27
1
0.515
0.2±0.1
S
4°± 4°
8765
1.0±0.05
0.1±0.05
4
0.45Min.
0.545
3.0 ± 0.1
(MAX 3.35 include BURR)
4° +6°
–4°
8
0.65± 0.15
3
14
6.0± 0.2
1 2
4 -4
3.9± 0.1
5
0.175± 0.075
6
3.9±0.2
6.0±0.3
7
0.5 ±0.15
1.0±0.2
8.65 ±0.1
(Max 9.0 include BURR)
+6
8
1.2MAX
1.0± 0.05
0.1± 0.05
4.9±0.2
(MAX 5.25 include BURR)
1.05± 0.2
SOP-J8
IC Packages
JEDEC <Pin Pitch : 1.27mm/0.65mm/0.5mm>
1
1PIN MARK
0.5
0.08
22
+0.05
0.22 -0.04
+0.05
0.17 -0.03
0.08
M
Embossed carrier tape：2,000pcs
www.rohm.com
A
A151
▶ HSOP Packages ▶▶HSOP＜Pin Pitch：0.8mm＞
▶▶HTSOP-J＜Pin Pitch：1.27mm＞
▶▶HTSSOP-C＜Pin Pitch：0.5mm＞
▶▶HTSSOP-A＜Pin Pitch：0.8mm＞
ICs
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
HSOP Packages
(Unit: mm)
HSOP <Pin Pitch : 0.8mm>
HSOP25
HSOP28
13.6 ± 0.2
18.5 ±0.2
(MAX 13.95 include BURR)
(MAX 18.85 include BURR)
+6°
4°–4°
14
1
1.95 ± 0.1
13
0.3Min.
0.25 ± 0.1
0.5±0.2
1.2±0.15
25
15
9.9±0.3
7.5±0.2
28
5.4 ± 0.2
7.8 ± 0.3
2.75 ± 0.1
1
1.25
14
5.15± 0.1
+0.1
0.27 −0.05
2.2±0.1
0.36 ± 0.1
0.8
0.1 S
12.0 ± 0.2
S
0.11
0.11
1.9 ± 0.1
S
0.8
0.37± 0.1
0.1 S
Embossed carrier tape：2,000pcs
Embossed carrier tape：1,500pcs
HSOP-M36
18.5± 0.2
(MAX 18.85 include BURR)
14
5.15±0.1
+6°
4°–4°
27
19
10
9
1PIN MARK
18
0.5 ±0.15
7.5± 0.1
9.9± 0.2
0.5± 0.2
1.2± 0.15
1
1.25
28
36
15
9.9±0.3
7.5±0.2
28
18.5 ± 0.1
(MAX 18.75 include BURR)
2.77±0.1
+6°
4°–4°
0.85
1
+0.055
0.27 −0.045
0.37±0.1
0.8
0.1 S
0.08 S
+0.05
0.37 −0.04
0.8
0.08
M
Embossed carrier tape：1,500pcs
Embossed carrier tape：1,500pcs
HTSSOP-C <Pin Pitch : 0.5mm>
HTSOP-J <Pin Pitch : 1.27mm>
HTSSOP-C48
HTSOP-J8
12.5± 0.1
(MAX 12.85 include BURR)
(5.0)
4° +6°
–4°
1
2 3 4
0.545
(4.2)
8.1±0.2
+0.05
0.17 -0.03
1PIN MARK
4° +6°
–4°
25
6.1±0.1
0.65±0.15
1.05± 0.2
(2.4)
3.9±0.1
6.0± 0.2
8 7 6 5
48
0.5
1
0.5±0.15
(3.2)
24
1PIN MARK
+0.05
0.42 -0.04
0.08
M
0.08 S
0.08±0.08
1.0MAX
+0.05
0.17 -0.03
S
0.85±0.05
1.0MAX
0.85±0.05
0.08±0.08
S
1.27
1.0±0.2
4.9± 0.1
(MAX 5.25 include BURR)
+0.05
0.22-0.04
0.5
0.08
M
0.08 S
Embossed carrier tape：2,500pcs
Embossed carrier tape：2,000pcs
HTSSOP-A <Pin Pitch : 0.8mm>
+0.05
0.17 −0.03
0.85
0.08 S
0.08
M
22
+0.05
1PIN MARK
0.17 −0.03
A152
1
6.0± 0.2
27
0.15± 0.1
S
2.2±0.1
1.0MAX
Embossed carrier tape：1,500pcs
1.0MAX
0.85 ± 0.05
0.08 ± 0.05
+0.05
0.37 −0.04
+6°
4°–4°
28
4.0±0.2
(5.0)
1
S
0.8
54
23
9.5 ± 0.2
7.5 ± 0.1
0.5±0.15
22
1PIN MARK
1.0±0.2
44
+6°
4°–4°
13.4±0.3
11.4±0.2
23
(5.0)
1
22.0± 0.2
(MAX 22.35 include BURR)
18.5 ± 0.1
(MAX 18.85 include BURR)
(6.0)
+6°
4°–4°
0.3MIN
0.85
HSSOP-A54
0.5 ± 0.15
1.0 ± 0.2
18.5±0.1
(MAX 18.85 include BURR)
(6.0)
7.5±0.1
9.5±0.2
44
HTSSOP-A44R
0.8
0.08 S
+0.05
0.37 −0.04
0.08
M
Embossed carrier tape：1,500pcs
www.rohm.com
0.1±0.1
HTSSOP-A44
0.85±0.05
0.08±0.05
IC Packages
2.4MAX
2.2 ±0.05
2.2±0.1
S
0.11
A
0.1 ±0.05
+0.1
0.27 −0.05
1.2 ±0.2
HSOP-M28
0.8
0.36± 0.1
0.1
ICs
IC Packages (ROHM)
▶ HSOP Packages ▶▶HTSSOP-B＜Pin Pitch：0.65mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
HSOP Packages
(Unit: mm)
HTSSOP-B <Pin Pitch : 0.65mm>
HTSSOP-B24
6.5±0.1
(MAX 6.85 include BURR)
(1.8)
(4.0)
M
Embossed carrier tape：2,500pcs
HTSSOP-B28
4° +6°
–4°
16
13.6±0.1
(MAX 13.95 include BURR)
+6°
4°–4°
+0.05
0.24 -0.04
S
0.08 S
0.08
M
Embossed carrier tape：2,000pcs
0.5 ± 0.15
(3.2)
5.4±0.1
0.625
1.0Max.
0.65
7.8±0.2
(3.7)
+0.05
0.17 -0.03
1PIN MARK
21
1
20
1PIN MARK
+0.05
0.17 −0.03
S
+0.05
0.24 −0.04
0.08
M
0.65
A
0.08 S
Embossed carrier tape：2,000pcs
HTSSOP-B54
0.8
27
1PIN MARK
1.0±0.2
0.5±0.15
(5.0)
1
+0.05
0.17 −0.03
S
0.85±0.05
0.08±0.05
1.0Max.
+6°
4°–4°
28
7.5±0.1
9.5±0.2
54
18.5±0.1
(MAX 18.85 include BURR)
(6.0)
0.08 S
0.65
+0.05
0.22 −0.04
0.08
M
Embossed carrier tape：1,500pcs
www.rohm.com
A153
IC Packages
Embossed carrier tape：2,500pcs
0.5±0.15
1.0±0.2
7.6±0.2
M
15
1
40
1.2 ± 0.2
(5.8)
0.08±0.05
0.08
0.08±0.05
1.0MAX
0.85±0.05
0.08 S
+0.05
HTSSOP-B40
5.6±0.1
0.45
0.17 +0.05
-0.03
S
0.24-0.04
M
Embossed carrier tape：2,000pcs
0.85±0.05
14
1PIN MARK
0.65
0.08
(8.4)
0.5±0.15
1.0±0.2
(2.9)
6.4±0.2
4.4±0.1
30
4° +6°
–4°
15
1
0.625
+0.05
0.24-0.04
10.0±0.1
(MAX 10.35 include BURR)
(5.5)
28
0.85±0.05
0.08±0.05
1.0MAX
HTSSOP-B30
+0.05
0.17 -0.03
0.08 S
0.65
Embossed carrier tape：2,500pcs
9.7±0.1
(MAX 10.05 include BURR)
1.0MAX
0.08 S
+0.05
0.24-0.04
0.65
12
1PIN MARK
S
0.85± 0.05
1.0MAX
0.85± 0.05
0.08
0.08±0.05
0.1 ± 0.05
1.1MAX
0.85 ± 0.05
0.65
0.325
S
0.08 S
+0.05
0.32 -0.04
1
0.17 +0.05
-0.03
S
0.53±0.15
10
(2.4)
0.325
13
(3.4)
1
24
7.6±0.2
5.6±0.1
0.45 ± 0.15
0.95 ± 0.2
+0.05
0.145 -0.03
11
6.4±0.2
4.4±0.1
(1.8)
4.9 ± 0.2
3.0 ± 0.1
1PIN MARK
1 2 34
0.525
4° +6°
–4°
(5.0)
20
0.5±0.15
1.0±0.2
4° +6°
–4°
8765
7.8 ±0.1
(MAX 8.15 include BURR)
1.0±0.2
HTSSOP-B20
3.0±0.1
(MAX 3.35 include BURR)
0.08± 0.05
HTSSOP-B8J
ICs
IC Packages (ROHM)
▶ Small Packages ▶▶SOP Type
▶ Non-Lead Packages ▶▶Non-Lead
Please refer packages from page, A160 for LAPIS Semiconductor products.
Small Packages
(Unit: mm)
SOP Type
SOP4
SSOP3
SSOP5
2.9±0.2
1
+0.05
0.2Min.
+0.2
1
+0.05
2
+0.05
0.13 −0.03
S
1.1±0.05
0.05±0.05
1.1±0.05
0.1 S
+0.05
0.42 +0.05
−0.04
0.1 S
0.42 −0.04
0.05±0.05
1.25Max.
+0.05
0.42 −0.04
0.95
0.1
Embossed carrier tape：3,000pcs
SSOP6
Embossed carrier tape：3,000pcs
MSOP8
MSOP10
2.9±0.1
(MAX 3.25 include BURR)
2.9±0.2
4° +6°
–4°
+0.05
0.13 −0.03
1 2
0.475
+0.05
0.9MAX
0.75±0.05
0.75±0.05
0.1 S
0.22 −0.04
0.65
0.08 S
Embossed carrier tape：3,000pcs
0.29± 0.15
2 3 4 5
1
0.45
0.145 −0.03
+0.05
0.145 −0.03
1PIN MARK
S
+0.05
0.08±0.05
+0.05
0.42 −0.04
0.95
2.8± 0.1
4
1PIN MARK
S
0.08±0.05
3
10 9 8 7 6
4.0± 0.2
5
0.9MAX
4.0 ±0.2
1.6 +0.2
−0.1
6
0.6± 0.2
3
7
0.29± 0.15
2
8
2.8± 0.1
1
4° +6°
–4°
0.2Min.
4
1.1±0.05
2.8±0.2
5
0.05±0.05
1.25Max.
IC Packages
6
2.9±0.1
(MAX 3.25 include BURR)
4° +6°
–4°
+0.05
Embossed carrier tape：3,000pcs
S
0.08 S
0.22 −0.04
0.5
0.6± 0.2
0.05±0.05
1.25Max.
S
0.32 +0.05
−0.04
A
3
0.13 −0.03
1.9
0.13 −0.03
0.9±0.05
2
0.95
4
1.6 −0.1
0.2Min.
2
2.8±0.2
1
5
1.6 +0.2
−0.1
3
2.1±0.2
4
4° +6°
–4°
3
0.27±0.15
4° +6°
–4°
1.3
0.05
1.05Max.
4° +6°
–4°
2.9±0.2
2.8±0.2
1.25 +0.2
−0.1
2.0±0.2
0.08
M
Embossed carrier tape：3,000pcs
Non-Lead Packages
(Unit: mm)
Non-Lead
VSOF5
HVSOF5
HVSOF6
HSON8
2.9± 0.1
(MAX 3.1 include BURR)
0.475
3
5
3.0± 0.2
(1.2)
0.1 S
0.65
0.32±0.1
(2.2)
0.08 M
(0.05)
1
2
3
4
8
7
6
5
4
(0.8)
A154
+0.1
0.13 -0.05
S
3
(0.3)
Embossed carrier tape：3,000pcs
4
(1.4)
(0.45)
(0.41)
2
0.22±0.05
2
3
(0.15)
1
1
(0.91)
0.1 S
0.5
0.08 M
0.145±0.05
S
2
5
(0.3)
0.1 S
0.22 ±0.05
3
1
6
(0.45)
3.0±0.1
2.6±0.1
S
0.5
2
6
Embossed carrier tape：3,000pcs
5
4
Embossed carrier tape：3,000pcs
www.rohm.com
(0.2)
0.22±0.05
1
(1.5)
0.5
0.13± 0.05
7
1PIN MARK
+0.03
0.02 -0.02
3
0.6MAX
2
4
0.75Max.
1
0.13± 0.05
0.2MAX
(0.05)
4
(0.15)
3
5
5
(MAX 2.8 include BURR)
2
1.2±0.05
1.6±0.05
1
(MAX 1.28 include BURR)
0.2MAX
4
+0.03
0.02 -0.02
1.2±0.05
5
0.6MAX
1.6±0.05
(MAX 1.28 include BURR)
6
8
2.8± 0.1
(MAX 1.8 include BURR)
1.6±0.1
(0.2)
1.0 ± 0.05
(1.8)
1.6 ± 0.05
1.0±0.05
0.6MAX
1.6±0.05
Embossed carrier tape：3,000pcs
ICs
▶ Non-Lead Packages ▶▶Optical Non-Lead
▶ Power Packages ▶▶POWER-3PIN
▶▶POWER-4PIN
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
Non-Lead Packages
(Unit: mm)
Optical Non-Lead
WSOF6 (Clear Type)
WSOF6I
0.5 0.5
1.0±0.05
0.02 -0.02
+0.03
0.1 S
2
2
0.145±0.05
S
1
3
0.22±0.05
2
2.1±0.1
0.145±0.05
0.08 S
0.22±0.05
0.275
1
3
(0.45)
(0.3)
0.08 M
0.05
C0.25
(1.2)
1
1.5±0.1
0.5
4
8
5
0.25
(0.8)
6
Embossed carrier tape：3,000pcs
5
0.3 6
4
Embossed carrier tape：3,000pcs
5
4
S
S
0.3
2 3
(0.15)
(1.5)
4
0.5
S
0.08 M
(1.2)
(0.45)
(0.41)
5
1PIN MARK
0.27±0.05
0.08 S
0.5
3
0.525
3
1PIN MARK
0.08 M
2
+0.03
0.02 -0.02
(0.12)
1
(0.15)
1
(0.91)
0.22±0.05
0.5
3.0±0.1
0.3
1
2.0±0.1
2.6±0.1
(MAX2.8 include BURR)
3.0±0.1
2.6±0.1
0.13± 0.05
S
4
0.75±0.1
3
5
(1.5)
2
6
0.75MAX
1
4
(MAX2.8 include BURR)
0.2MAX
(0.05)
4
5
0.75MAX
1.2±0.05
(MAX 1.28 include BURR)
5
0.6MAX
1.6±0.05
6
0.60MAX.
1.6±0.05
WSON008X2120 (Clear Type)
(MAX1.8 include BURR)
1.6±0.1
(MAX1.8 include BURR)
1.6±0.1
0.35±0.1
WSOF5(Clear Type)
+0.05
0.2 -0.04
0.3
Embossed carrier tape：3,000pcs
Embossed carrier tape：4,000pcs
Power Packages
(Unit: mm)
POWER-3PIN
TO252S-3
2
3
(0.585)
0.82 ± 0.1
1.3
2.54
2.46
0.42 ± 0.1
2.85
Embossed carrier tape：500pcs
0.6±0.2
3
2.3± 0.2 2.3±0.2
0.5± 0.1
1.0± 0.2
S
9.15±0.1
7°±2°
2.69±0.1
7°± 2°
1 2 3 0.835±0.065
1.295±0.065
2.54BSC
+0.15
0.1 –0.1
3°±2°
15.10±0.4
2
0.65
1.27±0.05
2.30±0.3
1
0.65
0.75
1.5
2.5 9.5± 0.5
4° +6°
–4°
FIN
+0.13
4.57 –0.17
10.16±1.0
2.0REF
5.5±0.2 1.5± 0.2
9.5 ±0.3
1.0± 0.2
3
0.27±0.1
0.35 ±0.1
1
1
2.3±0.2
0.5± 0.1
+0.2
5.1-0.1
0.8
0.95
6.5± 0.2
C0.5
FIN
+0.13
1.27 –0.1
0.27±0.1
C0.5
0.8
5.5±0.2 1.5± 0.2
8.0 ± 0.2
15.2 +0.4
-0.2
12.0 ± 0.2
1.2± 0.1
+0.2
5.1-0.1
2
1.0 ± 0.2
5.61 ± 0.2
6.5± 0.2
+0.2
2.8 -0.1
A
TO263-3
4°± 4°
0.25BSC
3°± 2°
0.08 S
2.3
0.65±0.1
0.08 M
Embossed carrier tape：2,000pcs
Embossed carrier tape：2,000pcs
Embossed carrier tape：500pcs
POWER-4PIN
SOT223-4
1.0±0.2
1.78
3.43±0.1
7.0±0.2
6.53±0.05
3.025±0.065
1.8MAX.
1
2
3
+4.0°
4° -4.0°
0.325±0.025
0.06±0.04
1.6 ± 0.1
S
0.08 S
2.3±0.05
4.6±0.1
0.71±0.05
0.10
Embossed carrier tape：2,000pcs
www.rohm.com
A155
IC Packages
4.5 ± 0.1
10.0 +0.3
-0.1
φ 3.2 ± 0.1
TO252-3
2.5± 0.15
TO220CP-3
ICs
IC Packages (ROHM)
▶ Power Packages ▶▶POWER-5PIN
▶▶POWER-7PIN
Please refer packages from page, A160 for LAPIS Semiconductor products.
Power Packages
(Unit: mm)
POWER-5PIN
TO220FP-5
TO252S-5
+0.3
10.0 -0.1
0.42 ± 0.1
0.82±0.1
+0.2
6.5±0.2
2.8 -0.1
1.2±0.1
FIN
1.0±0.2
0.8
5.5±0.2 1.5±0.2
0.7
8.0±0.2
0.27±0.1
C0.5
3
0.85±0.2
+0.4
17.0 -0.2
12.0±0.2
13.60
16.92
13.5MIN
1.778
4.5 -0.1
+0.2
5.1 −0.1
(1.0)
8.0±0.2
1.0±0.2
12
0.71
1.2
4° +6°
–4°
4 5
0.27±0.1
0.6
0.6±0.2
S
1.58
0.92
(2.85)
1.444
0.35±0.1
+0.4
15.2 -0.2
12.0±0.2
2.8+0.2
-0.1
+0.3
φ 3.2± 0.1
7.0 +0.3
-0.1
2.5±0.15
4.5±0.1
10.0 +0.3
-0.1
4.92±0.2
1.8±0.2
φ 3.2 ±0.1
9.5±0.3
TO220CP-V5
0.5±0.1
1.778
4.12
2.85
0.08 S
0.27±0.1
1.27
0.08 M
1 2 3 4 5
Embossed carrier tape：500pcs
TO252-5
Contaner tube：500pcs
HRP5
Embossed carrier tape：2,000pcs
TO263-5
TO252-J5
0.8
3
1.2575
0.5
4.5° +5.5°
–4.5°
0.5± 0.1
1.0± 0.2
1.27
1 23 4 5
0.27 +0.1
−0.05
0.835 ± 0.065
1.70BSC
4°± 4°
0.25BSC
5°±2°
45
1.14±0.1
10.10±0.3
0.53±0.03
5°±2°
+0.20
1.5 –0.10
3
0.635±0.065 1 2
3°
S
+0.08
2.30 –0.10
2.9
1.075±0.175
FIN
1.8REF
15.10 ± 0.4
9.15 ± 0.1
2.0REF
10.54 ± 0.13
7°±2° 3°±2°
0.1+0.15
–0.1
1.2±0.3 6.1±0.1
1 2 3 4 5
7°±2°
2.69 ± 0.1
6.6±0.1
5.33+0.11
–0.10
0.8±0.20
45
+0.13
4.57 –0.17
1.27±0.5
2.30 ± 0.3
1.5
1 2
10.16 ± 1.0
1.523 ± 0.15
0.5± 0.1
FIN
(7.49)
8.0 ± 0.13
5.1+0.2
-0.1
2.5
IC Packages
5.5±0.2 1.5±0.2
2.3±0.2
9.5±0.5
A
6.5±0.2
1.905 ± 0.1
(6.5)
0.835 ± 0.2
C0.5
8.82 ± 0.1
1.27 +0.13
–0.1
1.017 ± 0.2
9.395 ± 0.125
(MAX 9.745 include BURR)
4°±4°
0.53±0.03
0.08 ± 0.05
3°±2°
0.73 ± 0.1
1.72
0.08 S
Embossed carrier tape：2,600pcs
Embossed carrier tape：2,000pcs
Embossed carrier tape：500pcs
POWER-7PIN
HRP7
TO252S-7+
C0.5
1.905 ± 0.1
6.5±0.2
1 234567
+5.5°
4.5° −4.5°
0.8875
0.85 1234567
0.73 ± 0.1
1.27
0.08 S
Embossed carrier tape：2,000pcs
2.5±0.15
°
4°+6
−4°
0.27±0.1
0.6±0.2
S
0.27±0.1
0.8
9.5±0.3
FIN
0.35± 0.1
S
0.08 ± 0.05
1.2±0.1
0.27±0.1
5.1 +0.2
-0.1
+0.1
0.27 −0.05
A156
5.5±0.2 1.5±0.2
1.523 ± 0.15
10.54 ± 0.13
(7.49)
0.835 ± 0.2
(6.5)
1.0±0.2
8.82 ± 0.1
8.0 ± 0.13
1.017 ± 0.2
9.395 ± 0.125
(MAX 9.745 include BURR)
0.08 M
0.08 S
Embossed carrier tape：2,000pcs
www.rohm.com
Embossed carrier tape：2,000pcs
ICs
▶ BGA Packages ▶▶VBGA-T＜Pin Pitch：0.5mm＞
▶▶VBGA-B＜Pin Pitch：0.5mm＞
▶▶UBGA-W＜Pin Pitch：0.4mm＞
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
BGA Packages
(Unit: mm)
VBGA-T <Pin Pitch : 0.5mm>
0.23
0.75±0.1 1.2MAX
1.2MAX
0.23
1.2MAX
7.0±0.1
1 2 3 4 5 6 7 8 9 10 11 12
1.2MAX
0.05
B
1 3 5 7 9 11
2 4 6 8 10 12
0.75±0.1
161-φ0.3±0.05
φ 0.05 M S AB
143−φ0.3±0.05
M
S AB
P=0.5X13
A
P
N
M
L
K
J
H
G
F
E
D
C
B
A
S
0.75±0.1
A
P=0.5x11
0.5
0.75±0.1
B
0.5
M
L
K
J
H
G
F
E
D
C
B
A
P=0.5X11
0.5±0.1
131-φ0.3±0.05
φ 0.05 M S AB
0.08 S
A
B
1 2 3 4 5 6 78 910111213 14
0.5
VBGA256T100
VBGA195T080
10.0±0.1
1PIN MARK
1.2MAX
P=0.5 x13
0.75±0.1
P=0.5X17
B
S AB
0.75 ± 0.1
1 3 5 7 9 11 13
2 4 6 8 10 12 14
M
P=0.5x13
0.05
P
N
M
L
K
J
H
G
F
E
D
C
B
A
V
T
P
M
K
H
F
D
B
φ 0.05
U
R
N
L
J
G
E
C
A
S AB
B
1 3 5 7 9 11131517
2 4 6 8 10121416 18
0.5
UBGA-W <Pin Pitch : 0.4mm>
VBGA-B <Pin Pitch : 0.5mm>
UBGA035W030
7.0±0.1
1Pin MARK
M
P=0.5X17
0.5
256-φ0.3±0.05
A
195-φ0.3±0.05
3.0±0.1
3.0±0.1
7.0±0.1
1Pin MARK
S
A
0.1
0.9MAX
1.0MAX
0.5±0.1 P=0.4x5
0.4
A
35−φ0.2±0.05
N
M
L
K
J
H
G
F
E
D
C
B
A
0.5±0.1
S AB
φ0.05 A B
F
E
D
C
B
A
B
M
B
P=0.5x12
0.05
P=0.5x12
S
0.08 S
0.4
0.5±0.1
145−φ0.3±0.05
0.5±0.1 0.23
0.08 S
P=0.4x5
A
S
0.08 S
0.75±0.1
0.23 ± 0.1
0.23
S
0.08 S
1.2MAX
10.0±0.1
8.0 ± 0.1
8.0 ±0.1
123456
Embossed carrier tape：3,000pcs
1 2 3 4 5 6 7 8 9 1011 1213
www.rohm.com
A157
IC Packages
P=0.5X10
B
M
L
K
J
H
G
F
E
D
C
B
A
P=0.5x11
0.23
0.08 S
0.75±0.1
P=0.5X11
0.5
A
0.75±0.1
8.0±0.1
1PIN MARK
S
S
0.08 S
P=0.5X10
A
7.0±0.1
0.75±0.1
0.23
1.2MAX
1.2MAX
6.0±0.1
0.23
S
1 2 3 4 5 6 7 8 9 10 11
VBGA145B070
1 3 5 7 9
2 4 6 8 10
VBGA161T080
7.0±0.1
1Pin MARK
0.5
K
J
H
G
F
E
D
C
B
A
Embossed carrier tape：2,000pcs
VBGA143T070
7.0±0.1
1PIN MARK
6.0±0.1
K
J
H
G
F
E
D
C
B
A
0.75±0.1
0.05 M S AB
8.0±0.1
VBGA131T070
0.08 S
1PIN MARK
99−φ0.3±0.05
Embossed carrier tape：2,500pcs
VBGA120T060
0.5±0.1
120-φ0.295±0.05
φ 0.05 M S AB L
0.23
1 2 3 4 56 78
1234 56 7 8
1 2 3 4 56
1PIN MARK
A
B
0.05 M S AB
P=0.5x9
0.75±0.1
A
H
G
F
E
D
C
B
A
B
B
6.0±0.1
5.0±0.1
5.0±0.1
0.23
0.75±0.1
H
G
F
E
D
C
B
A
P=0.5 x7
0.5
63-φ0.3±0.05
P=0.5X13
B
F
E
D
C
B
A
P=0.5x5
φ0.05 M S AB
0.08 S
S
0.5
0.5
35−φ0.3±0.05
0.08 S
P=0.5X7
0.23
A
48-φ0.3±0.05
φ 0.05 M S AB
P=0.5X7
A
0.5
S
S
0.75 ± 0.1
0.08 S
0.75±0.1
0.75±0.1
P=0.5x5
0.75±0.1
1.2MAX
4.0±0.1
1.2MAX
S
0.08 S
6.0±0.1
1Pin MARK
P=0.5x9
1PIN MARK
5.0±0.1
1PIN MARK
VBGA099T060
5.0±0.1
P=0.5 x7
4.0±0.1
1Pin MARK
VBGA063T050
0.5
VBGA048T050
0.75±0.1
VBGA035T040
ICs
IC Packages (ROHM)
▶ BGA Packages ▶▶VBGA-W＜Pin Pitch：0.5mm＞
▶▶SBGA-T＜Pin Pitch：0.65mm＞
Please refer packages from page, A160 for LAPIS Semiconductor products.
BGA Packages
(Unit: mm)
VBGA-W <Pin Pitch : 0.5mm>
VBGA099W060
B
H
G
F
E
D
C
B
A
5.0± 0.1
0.75±0.1
A
A
0.05 M S AB
1 3 5 7
2 4 6 8
Embossed carrier tape：2,500pcs
7.0 ± 0.1
S
0.9MAX
A
0.10
0.1
0.9MAX
7.0± 0.1
6.0± 0.1
1PIN MARK
S
0.5
143-φ0.285± 0.05
φ0.05 M S AB
M
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9
2 4 6 8 10
B
B
K
J
H
G
F
E
D
C
B
A
P=0.5x11
0.5 A
0.75± 0.1
0.5
A
1 3 5 7 9 11
2 4 6 8 10 12
0.75± 0.1
0.5
P=0.5 x11
0.75± 0.1
P=0.5x9
P=0.5 x9
0.75±0.1
99-φ0.295±0.05
Embossed carrier tape：2,000pcs
SBGA-T <Pin Pitch : 0.65mm>
SBGA063T060
SBGA099T070
SBGA120T080
1PIN MARK
A158
1.2MAX
0.23
0.65
www.rohm.com
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11
2 4 6 8 10
0.75±0.1
1 2 3 4 5 6 7 8 910
0.65
P=0.65x9
K
J
H
G
F
E
D
C
B
A
P=0.65x10
A
φ0.08 M S AB
0.575±0.1
12345678
φ0.08 M S AB
0.75±0.1
P=0.65x10
120−φ0.33±0.05
A
B
B
H
G
F
E
D
C
B
A
0.65
A
P=0.65x7
0.08 M S AB
0.575±0.1
0.65
B
P=0.65x9
99−φ0.33±0.05
S
0.65
0.725±0.1
0.65
8.0±0.1
S
0.10 S
0.10 S
0.10 S
63−φ0.33±0.05
0.23
7.0±0.1
S
1.2MAX
7.0±0.1
1.2MAX
6.0±0.1
0.23
6.0±0.1
P=0.65x7
8.0±0.1
1Pin MARK
1Pin MARK
0.725±0.1
IC Packages
0.08 S
0.08 S
0.5
J
H
G
F
E
D
C
B
A
1 3 5 7 9
2 4 6 8
VBGA143W070
6.0±0.1
P=0.5 x8
80-φ0.295± 0.05
B
φ0.05 M S AB
Embossed carrier tape：2,500pcs
0.9MAX
5.0±0.1
0.1
5.0±0.1
0.1
0.9MAX
0.5
1 3 5 7
2 4 6
Embossed carrier tape：2,500pcs
P=0.5x7
0.75±0.1
0.5
G
F
E
D
C
B
A
S
0.08 S
63-φ0.295±0.05
P=0.5 x6
0.05 M S AB
1 3 5
2 4 6
1PIN MARK
0.5
B
B
A
0.5
F
E
D
C
B
A
P=0.5 x6
0.5 ± 0.1
48-φ0.295 ± 0.05
0.5
A
S
0.08 S
0.5±0.1
0.75±0.1
P=0.5x5
0.5
P=0.5x5
φ0.05 A B
0.05 M S AB
S
0.08 S
0.75 ±0.1
5.0± 0.1
1PIN MARK
4.0±0.1
0.10
4.0±0.1
0.9MAX
0.1
S
0.08 S
35 - φ 0.295±0.05
5.0±0.1
1PIN MARK
5.0±0.1
4.0 ± 0.1
1PIN MARK
VBGA080W050
0.9MAX
4.0±0.1
1PIN MARK
VBGA063W050
P=0.5 x8
VBGA048W040
P=0.5x7
VBGA035W040
Embossed carrier tape：2,500pcs
ICs
▶ BGA Packages ▶▶SBGA-W＜Pin Pitch：0.65mm＞
▶ WL-CSP Packages ▶▶VCSP＜Pin Pitch：0.5mm＞
▶▶UCSP＜Pin Pitch：0.4mm＞
IC Packages (ROHM)
Please refer packages from page, A160 for LAPIS Semiconductor products.
BGA Packages
(Unit: mm)
SBGA-W <Pin Pitch : 0.65mm>
SBGA099W070
SBGA120W080
1PIN MARK
1 3 5 7
2 4 6 8
φ0.08 M S AB
B
1 3 5 7 9
2 4 6 8 10
0.08
120-φ0.33±0.05
φ0.05 M S AB
0.9MAX
8.0±0.1
99-φ0.33±0.05
A
A
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11
2 4 6 8 10
WL-CSP Packages
P=0.65x10
12345
0.65
K
J
H
G
F
E
D
C
B
A
S
0.75±0.1
P=0.65x10
0.65
B
B
H
G
F
E
D
C
B
A
B
E
D
C
B
A
P=0.65x9
0.575±0.1
A
0.65
A
P=0.65x4
0.7±0.1
0.65
24-φ0.33±0.05
0.10 S
0.725±0.1
0.65
63-φ0.33±0.05
φ0.08 M S AB
S
0.10 S
P=0.65x7
0.65
P=0.65x7
0.725±0.1
0.7 ±0.1
0.65
0.08
0.9MAX
S
0.10 S
P=0.65 x4
φ0.08 M AB
0.9MAX
6.0±0.1
0.08
0.9MAX
0.08
S
0.08 S
8.0±0.1
7.0±0.1
7.0±0.1
1PIN MARK
4.0± 0.1
1PIN MARK
6.0±0.1
1PIN MARK
P=0.65x9
0.575±0.1
4.0± 0.1
0.75±0.1
SBGA063W060
0.65
SBGA024W040
(Unit: mm)
VCSP <Pin Pitch : 0.5mm>
~
6×6
1×1
3×3
1×1
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
3×3
0.35
~
0.1
0.5
~
0.5
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
0.1
~
~
0.25
~
0.5
~
0.30
1×1
A
VCSP30L
0.50
6×6
0.85
~
VCSP35L
0.5
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
UCSP <Pin Pitch : 0.4mm>
~
0.8×0.8
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
0.4
0.1
0.4
0.8×0.8
~
~
~
3×3
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
~
3×3
~
0.4
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
www.rohm.com
0.30
6×6
0.4
0.08
~
0.35
0.8×0.8
UCSP30L
0.50
6×6
UCSP35L
0.75
~
0.15
0.8×0.8
UCSP50L
0.1
UCSP75M
2.8mm□ and under：3,000pcs
Over 2.8mm□：2,500pcs
A159
IC Packages
1×1
VCSP50L
0.08
VCSP85H
ICs
LAPIS Semiconductor LSI Packages
▶ LAPIS Semiconductor LSI package list
▶ LAPIS Semiconductor LSI Part No. Explanation
These package size are an example. For details, please inquire to the sales.
LAPIS Semiconductor LSI package list
No
1
A
PKG type
SOP
SOP8
Title
TRAY
T&R
2500
TUBE
No
36
PKG type
QFP
QFP208
2
SOP
SOP16
1600
1000
3
SOP
SOP24
1280
1000
3000
4
SOP
SOP44
400
600
1700
5
SSOP
SSOP16
4760
6
SSOP
SSOP20
3600
7
SSOP
SSOP30-56-0.65
2000
2000
8
SSOP
SSOP32
1280
1000
37
QFP
LQFP144
38
QFP
LQFP176
400
39
QFP
TQFP44
1600
2500
40
QFP
TQFP52
1600
2500
41
QFP
TQFP80-1414-0.65
900
42
QFP
TQFP100
900
43
QFP
TQFP120
9
SSOP
SSOP60
600
750
600
44
QFP
TQFP128
10
SSOP
SSOP70
630
900
1500
600
45
QFN
WQFN12
6240
11
SSOP
TSSOP20
1000
4160
46
QFN
WQFN16-0303-0.50
6240
12
TSOP
1000
TSOP（Ⅰ）28
1950
47
QFN
WQFN16-0404-0.50
4900
13
1000
TSOP
TSOP（Ⅰ）32
800
1000
48
QFN
WQFN20
4900
1000
14
TSOP
TSOP（Ⅰ）48
960
1000
49
QFN
WQFN24
4900
1000
15
TSOP
TSOP（Ⅰ）56
960
1000
50
QFN
WQFN28-0404-0.40
4900
1000
16
TSOP
TSOP（Ⅱ）26/20
1600
1600
51
QFN
WQFN28-0404-0.50
4900
1000
17
TSOP
TSOP（Ⅱ）26/24
1600
1000
52
QFN
WQFN32-0505-0.50
4030
1000
18
TSOP
TSOP（Ⅱ）28
800
1000
53
QFN
WQFN36
4900
2000
19
TSOP
TSOP（Ⅱ）44/40
1350
1000
54
QFN
WQFN40-0505-0.40
4030
1000
3000
Title
TRAY
240
T&R
TUBE
600
1000
20
TSOP
TSOP（Ⅱ）44
1350
1000
55
QFN
WQFN40-0606-0.50
4900
2500
21
TSOP
TSOP（Ⅱ）50/44
1170
1000
56
QFN
WQFN48
2500
2000
22
TSOP
TSOP（Ⅱ）50
1170
1000
57
QFN
WQFN52
2500
2000
23
TSOP
TSOP（Ⅱ）54
1080
1000
58
QFN
WQFN64
2600
3000
24
TSOP
TSOP（Ⅱ）70
1350
1000
59
QFN
WQFN80
2600
3000
25
TSOP
TSOP（Ⅱ）86
1080
1000
60
QFN
C-TQFN18
4030
1000
26
QFP
QFP44
1440
1000
61
BGA
LFBGA48
4160
1440
1000
IC Packages
27
QFP
QFP56
62
BGA
LFBGA84
2600
28
QFP
QFP64-1420-1.00
600
63
BGA
LFBGA144
1760
29
QFP
QFP64-1414-0.80
840
64
BGA
LFBGA324
840
30
QFP
P-QFP80-1414-0.65
840
65
BGA
TFBGA60
3360
31
QFP
QFP80-1420-0.80
600
66
BGA
TFBGA64
4160
32
QFP
QFP100-1420-0.65
600
67
BGA
TFBGA90
1710
33
QFP
QFP100-1414-0.50
750
68
BGA
P-TFBGA144
1760
34
QFP
QFP128-1420-0.50
420
69
BGA
TFBGA208-0909-0.50
2600
35
QFP
QFP128-2828-0.80
240
70
BGA
TFBGA208-1212-0.65
1680
＊Regarding an unstated package, please inquire to the sales.
LAPIS Semiconductor LSI Part No. Explanation
Product names are assigned to our semiconductor devices using the following convention, starting with the character "M".
M
− 0 0 0
0 0 0 0 0 0 0 0 0
Device function
Character symbol
Package symbol
The device functions are classified as follows:
The character symbol is
added to indicate the
modification of an existing
product, to emphasize a
specification that differs
from the standard
specification of an existing
product, or to indicate a
design standard.
The package symbol
expresses the type and lead
bending profile of a package
in two digits.
MD
DRAM
MR
P2ROMTM , OTPROM
MS
SRAM
MG
Gate array, standard cell
ML
Logic
MK
Module, chip set
MT
Driver
Device code
The device code
expresses a function
specific to a device using
a combination of numbers
and alphanumeric
characters.
・The actual package profile is not shown here.
M S M 6 6 5 0 7
Process classification
Circuit category
A
Analog
L
Bipolar logic
C
Bi-CMOS, multi-chip product
M
MOS
J S
Package profile
www.rohm.com
Option classification symbol
The option classification symbol is used
to distinguish between the option symbol
and the package symbol.
Derived code
Option code
The derived code indicates the speed
ranking for DRAM products and is used
as a derived code for logic products.
The option code indicates a
symbol that identifies the
specification of a product with an
option.
The following shows the convention of item name assignment for conventional products.
A160
Z
ICs
LAPIS Semiconductor LSI Packages
▶ SOP Packages ▶▶SOP
▶▶SSOP
These package size are an example. For details, please inquire to the sales.
SOP Packages
(Unit: mm)
SOP
SOP8
SOP16
SOP24
SOP44
7.50±0.10
2.50±0.15
0.25
0.88±0.15
0.17±0.
05
SSOP
SSOP16
SSOP20
P-SSOP30-56-0.65-ZK
A
IC Packages
P-SSOP30-56-0.65-Z6K
P-SSOP30-56-0.65-K6
www.rohm.com
SSOP32
A161
ICs
LAPIS Semiconductor LSI Packages
▶ SOP Packages ▶▶SSOP
▶▶TSOP
（TypeⅠ）
▶▶TSOP
（TypeⅡ）
These package size are an example. For details, please inquire to the sales.
SOP Packages
(Unit: mm)
SSOP
SSOP60
SSOP70
TSSOP20
TSOP(TypeⅠ)
TSOP(Ⅰ)28
TSOP(Ⅰ)32
TSOP(Ⅰ)48
TSOP(Ⅰ)56
A
IC Packages
TSOP(TypeⅡ)
TSOP(Ⅱ)26/20
A162
TSOP(Ⅱ)26/24
www.rohm.com
TSOP(Ⅱ)28
ICs
LAPIS Semiconductor LSI Packages
▶ SOP Packages ▶▶TSOP
（TypeⅡ）
These package size are an example. For details, please inquire to the sales.
TSOP Packages
(Unit: mm)
TSOP(TypeⅡ)
TSOP(Ⅱ)44/40
TSOP(Ⅱ)44
TSOP(Ⅱ)50/44
TSOP(Ⅱ)50
TSOP(Ⅱ)54
TSOP(Ⅱ)66
A
IC Packages
TSOP(Ⅱ)70
TSOP(Ⅱ)86
www.rohm.com
A163
ICs
LAPIS Semiconductor LSI Packages
▶ QFP Packages ▶▶QFP
These package size are an example. For details, please inquire to the sales.
QFP Packages
(Unit: mm)
QFP
QFP44
QFP56
QFP64-P-1420-1.00
P-QFP64-1414-0.80
0.10
0.10
0.13
0.16
P-QFP80-1414-0.65
QFP80-P-1420-0.80
P-QFP100-1420-0.65-TK
QFP100-P-1420-0.65-BK
P-QFP100-1414-0.50-K
P-QFP128-1420-0.50
QFP128-P-2828-0.80
QFP208
A
IC Packages
A164
www.rohm.com
ICs
LAPIS Semiconductor LSI Packages
▶ QFP Packages ▶▶LQFP
▶▶TQFP
These package size are an example. For details, please inquire to the sales.
ＱＦP Packages
(Unit: mm)
LQFP
LQFP144
LQFP176
TQFP
TQFP44
TQFP48
TQFP52
TQFP64
A
IC Packages
P-TQFP80-1010-0.40
P-TQFP80-1212-0.50
P-TQFP-80-1414-0.65
www.rohm.com
TQFP100
A165
ICs
LAPIS Semiconductor LSI Packages
▶ QFP Packages ▶▶TQFP
▶ QFN Packages ▶▶VQFN
▶▶WQFN
These package size are an example. For details, please inquire to the sales.
ＱＦP Packages
(Unit: mm)
TQFP
TQFP120
TQFP128
QFN Packages
(Unit: mm)
VQFN
A
VQFN28
VQFN48
WQFN16-0303-0.50
WQFN16-0404-0.50
IC Packages
VQFN32
WQFN
WQFN12
16
16
A166
www.rohm.com
ICs
LAPIS Semiconductor LSI Packages
▶ QFN Packages ▶▶WQFN
These package size are an example. For details, please inquire to the sales.
QFN Packages
(Unit: mm)
WQFN
WQFN20
WQFN24
P-WQFN28-0404-0.40-63
P-WQFN28-0404-0.50-63
P-WQFN32-0505-0.50-63
P-WQFN32-0505-0.50-A63
A
IC Packages
WQFN36
P-WQFN40-0505-0.40
www.rohm.com
P-WQFN40-0606-0.50
A167
ICs
LAPIS Semiconductor LSI Packages
▶ QFN Packages ▶▶WQFN
▶▶C-TQFN
These package size are an example. For details, please inquire to the sales.
QFN Packages
(Unit: mm)
WQFN
WQFN56
1
1.10
0.75
0.20±0.05
0.05Ⓜ
1.10
0.75
6.40TYP
0.16±0.05
0.05Ⓜ
DETAIL A
0.05
SEATING PLANE
IC Packages
0.05
0.23±0.05
0.20
8.00±0.05
1PIN INDEX MARK
1
0.4＋0.10
−0.15
7.50TYP
0.23±0.05
DETAIL B
0.05Ⓜ
SEATING PLANE
6.80TYP
0.50＋0.10
−0.15
6.80TYP
DETAIL B
80
0.7
0.75
6.80TYP
0.50
0.75
(0.04)
(0.30)
0.50＋0.10
−0.15
(0.50∼0.55)
1
INDEX MARK
1
0.20
80
0.80MAX
1
9.00
0.80MAX
(0.50∼0.55)
9.00
1PIN INDEX
(Marking)
0.20
64
DETAIL A
9.00
1PIN INDEX
(Marking)
64
0.05Ⓜ
WQFN80
9.00
A
0.25±0.05
0.50
0.75
0.40
WQFN64
1PIN INDEX MARK
0.40±0.10
56
5.60TYP
5.60TYP
0.35＋0.10
−0.15
0.50
0.35＋0.10
−0.15
52
5.60TYP
5.60TYP
1
6.40TYP
1PIN INDEX MARK
48
0.80MAX
SEATING PLANE
0.05
0.05
1PIN INDEX MARK
0.05
1
1
0.80MAX
SEATING PLANE
SEATING PLANE
56
1
0.80MAX
0.75
1
1PIN INDEX
(Marking)
52
0.20
48
1PIN INDEX
(Marking)
8.00±0.05
0.20
7.00
1PIN INDEX
(Marking)
7.00
(0.50∼0.55)
7.00
7.00
(0.50∼0.55)
WQFN52
0.50±0.10
WQFN48
0.4
0.2±0.05
0.05Ⓜ
0.7
C-TQFN
8
3
9
2
10
4−R0.15
4−0.50
11 12
1.12±0.05
121110 9
13
14
15
16
17
1
INDEX
(No plating)
8
7
6
5
4
18 1 2 3
(0.175)
0.18±0.03
INDEX
SEATING PLANE
0.05
www.rohm.com
13
14
15
16
17
3 2 1 18
1.300
1.05
0.05
A168
Au plating
0.94±0.05
9 101112
8
7
6
5
4
0.80
0.80
5.00±0.15
4
0.900
5
1.20±0.15
6
4.60
4−0.35
2.84
3.70±0.15
7
INDEX
(No plating)
12−□0.40
(Au plating)
4−1.00P×3±0.05
5.00±0.15
0.73±0.07
3.40
1.05
4.00±0.15
4−R0.20
17−0.70±0.15
C-TQFN18
C-TQFN12
18−0.45±0.05
(Unit: mm)
BGA Packages
INDEX MARK
S
INDEX MARK
S
11.0
0.20 S
9.0
0.20 S
7.0
0.20 S
×4
0.15
0.15 S B
0.20 S A
0.10 S
×4
0.15
0.10 S
0.20 S B
×4
0.15
B
A
0.9
10
9
8
7
6
5
4
3
2
1
13
12
11
10
9
8
7
6
5
4
3
2
1
φ 0.10Ⓜ S AB
φ 0.10Ⓜ S AB
INDEX MARK
φ 0.10Ⓜ S AB
NM L K J HG F E DCBA
INDEX MARK
0.50±0.10
A
8
7
6
5
4
3
2
1
0.8
K J HG F E DCBA
φ 0.50±0.1
0.8
B
(0.7)
B
HG F E DCBA
φ 0.50±0.1
19.0
0.10 S
INDEX MARK
S
×4
0.10
0.15 S
(1.10)
IC Packages
0.15 S A
B
0.80
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
INDEX MARK
φ 0.15Ⓜ S AB
ABAA Y W VUT R PNM L K J HG F E DCBA
A
φ 0.46±0.05
A169
www.rohm.com
0.15 S A
11.0
INDEX MARK
S
0.10 S
A
0.38±0.05
1.50MAX.
TFBGA84
TFBGA64
TFBGA60
0.80
(1.10)
0.15 S B
19.0
LFBGA324
(0.70)
A
0.4±0.1
1.5MAX.
0.80
0.9
(0.7)
0.20 S B
9.0
0.20 S B
7.0
LFBGA144
LFBGA84
LFBGA48
0.4±0.1
1.5MAX.
0.4±0.1
1.5MAX
LAPIS Semiconductor LSI Packages
▶ BGA Packages ▶▶LFBGA
▶▶TFBGA
ICs
These package size are an example. For details, please inquire to the sales.
LFBGA
TFBGA
ICs
LAPIS Semiconductor LSI Packages
▶ BGA Packages ▶▶TFBGA
These package size are an example. For details, please inquire to the sales.
BGA Packages
(Unit: mm)
TFBGA
A
TFBGA90
P-TFBGA144
TFBGA176
P-TFBGA208-0909-0.50
P-TFBGA208-1212-0.65
IC Packages
1 3 5 7 9 11 13 15 17
2 4 6 8 10 12 14 16
1 3 5 7 9 11131517
2 4 6 8 10121416
A170
www.rohm.com

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ストロボ用昇圧トランス Step Up DC/DC Converter Transformers for

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