STYCAST 1090 SI (BE) - HITEK Electronic Materials Ltd

STYCAST 1090 SI (BE)
Two Component, Low Density,
Epoxy Encapsulant
(BE, Manufactured in Belgium)
Product Description :
STYCAST 1090 SI has lower density (0,65) and
higher compressive strength than STYCAST 1090.
Because STYCAST 1090 SI has a low dielectric
constant, it will have a minimum effect on electronic
circuit operation. The filler will tend to float during
storage. Premixing before use is required.
Applications :
STYCAST 1090 SI is recommended for applications
where high compressive stress is applied to
encapsulated circuitry - as in deep ocean work.
STYCAST 1090 SI shows negligible deformation and
water absorption in these applications. It should be
considered where the ultimate in performance is
demanded.
Instructions For Use :
1.Mixed with CATALYST 24 LV :
1.1. Mix STYCAST 1090 SI thoroughly in the can in
which it is received.
1.2. Weigh out the quantity required. Add 23 parts of
CATALYST 24 LV per 100 parts of STYCAST
1090 SI by weight. Mix thoroughly. Liquid
diluents can be supplied to lower viscosity at
some sacrifice in properties. Pot life of the
catalysed resin at room temperature is about 30
minutes.
1.3. Pour into mould or cavity. MOULD RELEASE
122 S will prevent adhesion. (Evacuation may be
necessary to remove trapped air and is
recommended for high quality embedments. It is
often convenient to remove the trapped air from
the resin prior to pouring into mould, and then
again evacuate briefly when the mould is filled).
1.4. Allow to stand at room temperature for about 4
hours. Remove from the mould is possible prior
to that time if the casting is hard. Cure is fully
completed at room temperature within 24 hours.
2. Mixed with CATALYST 9 :
2.1. Mix STYCAST 1090 SI thoroughly in the can in
which it is received.
2.2. Weigh out the quantity required. Add 11 parts of
CATALYST 9 per 100 parts of STYCAST
1090 SI by weight. Mix thoroughly. Liquid
diluents can be supplied to lower viscosity at
some sacrifice in properties. Pot life of the
catalyzed resin at room temperature is about 30
minutes.
2.3. Pour into mold or cavity. MOULD RELEASE
122 S will prevent adhesion. (Evacuation may be
necessary to remove trapped air and is
recommended for high quality embedments. It is
often convenient to remove the trapped air from
the resin prior to pouring into mould, and then
again evacuate briefly when the mould is filled).
2.4. Allow to stand at room temperature for about 4
hours. Remove from the mould is possible prior
tothat time if the casting is hard. Cure is fully
completed at room temperature within 24 hours.
A post cure of 4 hours at 60 - 100°C will improve
the end properties of the resin.
Note :
If smallest dimension of casting is more than 5 cm,
use CATALYST 11 instead of CATALYST 24 LV. Use
12 parts CATALYST 11 per 100 parts STYCAST 1090
SI. Cure for 16 hours at 80°C.
PROTECTING YOUR ELECTRONICS.
Properties Of Material As Supplied :
Property
Test Method
Unit
STYCAST
1090 SI
Chemistry
Appearance
Density
Viscosity at 25°C
Visual
ASTM-D-792
ASTM-D-2393
g/cm3
Pa.s
0,60 - 0,70
30 - 50
Value
With CATALYST
24 LV
epoxy
black
2,0 - 3,5
With CATALYST
9
0,70 - 0,80
5- 10
Cure Schedule :
Please refer to the instructions for use above.
Properties Of Material After Application :
Property
Test Method
Unit
STYCAST
1090 SI
Hardness
Glass Transition
Temperature
Compressive
Strength
Elastic Modulus,
Compressive
Flexural Strength
Tensile Strength
Thermal
Conductivity
Coefficient Of
Linear Thermal
Expansion
Volume Resistivity
Value
With
CATALYST
24 LV
Shore D
°C
With
CATALYST
9
75 minimum
50 - 60
ASTM-D-695
MPa
65 minimum
ASTM-D-695
ASTM-D-790
ASTM-D-638
MPa
MPa
MPa
28 minimum
15 minimum
20 minimum
ASTM-D-2214
W/m.K
0,17
0,13 - 0,18
ASTM-D-3386
10-6 K-1
5,4
50 - 65
ASTM-D-257
Ohm.cm
1013 minimum
1013 minimum
ASTM-D-2240
ASTM-D-3386
2000 minimum
The information given and the recommendations made herein are based on our research and are believed to be accurate but no guarantee of their accuracy is made. In every case we urge and recommend that purchasers before using any product in full scale
production make their own tests to determine to their own satisfaction whether the product is of acceptable quality and is suitable for their particular purposes under their own operating conditions. THE PRODUCTS DISCUSSED HEREIN ARE
SOLD WITHOUT ANY WARRANTY AS TO MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER WARRANTY, EXPRESSED OR IMPLIED . No representative of ours has any authority
to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs and to the circumstances prevailing in their business. Nothing contained herein shall be
construed to imply the non-existence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent.
© 1997 Henkel
STYCAST 1090 SI
Two Component, Low Density,
Epoxy Encapsulant
Properties Material After Application (Continued) :
Property
Test Method
Unit
STYCAST
1090 SI
Dielectric Constant
Dissipation Factor
Dielectric Strength
Moisture
Absorption In 24 h
Service
Temperature
Value
With
CATALYST
24 LV
With
CATALYST
9
3,7
3,1
2,3
2,9
2,7
2,3
0,025
0,02
0,03
ASTM-D-150
at 60 Hz
at 1 KHz
at 1 MHz
ASTM-D-150
at 60 Hz
at 1 KHz
at 1 MHz
ASTM-D-149
kV/mm
0,02
0,01
0,01
14,7 minimum
ASTM-D-570
%
0,4 maximum
ASTM-D-794
°C
-70 to +100
-70 to +125
Storage And Handling :
Store STYCAST 1090 SI in sealed unopened
containers at temperatures between 18°C and 25°C.
Health & Safety :
It is recommended to consult the Henkelproduct
literature, including material safety datasheets, prior
to using Henkel products.These may be obtained
from your local sales office.
(STYCAST is a registered trademark of Henkel)
E22/03/99-MVRRVH (1004s)
Storage Temperature
(°C)
18 to 25
Usable Shelf Life
1 year
Attention Specification Writers :
The technical information contained herein is
consistent with the properties of the material and
should not be used in the preparation of
specifications, as it is intended for reference only.
For assistance in preparing specifications, please
contact your local Henkel office fordetails. Please
contact Henkel QualityAssurance for test method
details.
UK Distributors
HITEK Electronic Materials
15 Wentworth Road
Scunthorpe
DN17 2AX
www.hitek-ltd.co.uk
tel +44 (0) 1724 851678
fax+44 (0) 1724 280586
PROTECTING YOUR ELECTRONICS.

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