Company Catalog

Product Catalog
SystemOnGlass
TM
Company Profile
ColorChip, established in 2001, is a pioneer and a world leading innovator in the fields of integrated optical components and
sub-systems. Today, ColorChip enables reliable, scalable and robust high speed networking and communications solutions.
Through our two lines of business , we deliver industry leading optical high speed transceivers to the Datacom/Telecom
markets and passive PLC splitters to the FTTx markets.
ColorChip is led by seasoned executives that bring decades of multidisciplinary electro-optic experience, operational expertise
and technological breakthroughs from the networking, communication and optical industries.
ColorChip domains:
yy Passive Optical Components
yy Active High Speed Transceivers
yy Embedded Optical Modules (EOMs)
ColorChip Product Offerings:
ColorChip Product Roadmap:
yy Full Suite of 1XN PLC Splitter Wafers and Chips
yy 40GBASE QSFP+ Transceivers
yy 56G QSFP+ SMF Transceivers
yy 2xN PLC Splitter Wafers and Chips
yy 100GBASE QSFP28 and CFP4 Transceivers
ColorChip’s Corporation and Products’ Certifications:
ColorChip was
selected as 2012
Red Herring Top 100
Private Companies in
Europe
Simplified & Scalable
PIC Design
S
2
=
Economical
Solutions
High Speed Networking
Transceiver Product Family
Image by Nicholas L, Flickr.com
SystemOnGlassTM
SystemOnGlassTM
40GBASE QSFP+ LR4 Transceiver
Overview
yy 40Gbps hot pluggable transceiver in QSFP+ form factor
yy Optical connectivity based on two SMF LC connectors
yy Optical engine combining uncooled 4 X 10Gbps
CWDM DFB lasers with integrated MUX/DeMUX
yy Built in digital diagnostics
yy XLPPI electrical interface
yy RoHS-6 compliant
yy Operating case temperature range of 0 to 70°C
40GBASE QSFP+ LR4 Typical Optical Eye
Applications
yy
yy
yy
yy
yy
40GBASE Ethernet links
OTN, OTU-3
QDR/DDR Infiniband links
40G Telecom connections
Data Center interconnections
40GBASE QSFP+ LR4
yy
yy
yy
yy
Hot pluggable electrical interface based on IEEE 802.3ba standard
Supports 40Gb/s data rate links up to 10km over SMF
Typical power dissipation: 2.8W
Single 3.3V power supply
Code
Transmiitter
Wavelength
(nm)
40GBASE 1270 / 1290 /
QSFP+ LR4 1310 / 1330
Data
Rate per
Lane
(Gb/s)
2.5 to
10.7
Receiver
AV Optical
Optical
Data
Extinction
Power per Modulation
Rate per
Ratio
lane
Amplitude
Lane
(dB)
dBm)
(dBm)
(Gb/s)
-4 to +2.3
-4 to +3.5
> 3.5
** Receiver OMA Sensitivity per lane (@ 10.3125Gb/s, PRBS 231-1, BER= 10-12)
Simplified & Scalable
PIC Design
S
2
=
Economical
Solutions
2.5 to
10.7
General Specifications
Sensitivity Operating
(OMA) per
Case
Lane
Temperature
(**)
(°C)
< -11.5
0 to 70
Supply
Voltage
(V)
Typical Power
Consumption
(W)
Reach
(km)
3.1 to 3.5
< 2.8
≤ 10
Expert in CWDM Solutions
40GBASE QSFP+ iLR4* Transceiver
Overview
yy 40Gbps hot pluggable transceiver in QSFP+ form factor
yy Optical connectivity based on two SMF LC connectors
yy Optical engine combining uncooled 4 X 10Gbps
CWDM DFB lasers with integrated MUX/DeMUX
yy Built in digital diagnostics
yy XLPPI electrical interface
yy RoHS-6 compliant
yy Operating case temperature range of 0 to 70°C
40GBASE QSFP+ iLR4 Typical Optical Eye
Applications
yy
yy
yy
yy
yy
40GBASE Ethernet links
OTN, OTU-3
QDR/DDR Infiniband links
40G Telecom connections
Data Center interconnections
40GBASE QSFP+ iLR4*
yy
yy
yy
yy
Hot pluggable electrical interface based on IEEE 802.3ba standard
Supports 40Gb/s data rate links up to 10km over SMF
Typical Power dissipation: 2.2W
Single 3.3V power supply
Code
Transmiitter
Wavelength
(nm)
40GBASE 1270 / 1290 /
QSFP+ iLR4 1310 / 1330
Data
Rate per
Lane
(Gb/s)
2.5 to
10.7
Receiver
AV Optical
Optical
Data
Extinction
Power per Modulation
Rate per
Ratio
lane
Amplitude
Lane
(dB)
dBm)
(dBm)
(Gb/s)
-7 to +2.3
-5 to +3.5
> 3.5
2.5 to
10.7
General Specifications
Sensitivity Operating
(OMA) per
Case
Lane
Temperature
(**)
(°C)
< -9
0 to 70
Supply
Voltage
(V)
Typical Power
Consumption
(W)
Reach
(km)
3.1 to 3.5
< 2.2
≤2
* Intermediate Long Reach
** Receiver OMA Sensitivity per lane (@ 10.3125Gb/s, PRBS 231-1, BER= 10-12)
SystemOnGlassTM
SystemOnGlassTM
100GBASE QSFP28 iLR4* Transceiver Roadmap
Overview
yy 100Gbps hot pluggable transceiver in QSFP28 form factor
yy Optical connectivity based on two SMF LC connectors
yy Optical engine combining uncooled 4 X 25Gbps
CWDM DFB lasers with integrated MUX/DeMUX
yy Built in digital diagnostics
yy RoHS-6 compliant
yy Operating case temperature range of 0 to 70°C
Applications
yy
yy
yy
yy
100GBASE Ethernet links
100GE Enterprise switch and routers
Carrier grade 100GE core routers
Point-to-point and ring applications
100GBASE QSFP28 iLR4*
yy
yy
yy
yy
Supports up to 100Gb/s data rate links
Based on QSFP28 baseline specifications
Typical Power dissipation: 3.5W
Single 3.3V power supply
Code
Transmiitter
Wavelength
(nm)
100GBASE 1270 / 1290 /
QSFP28 iLR4 1310 / 1330
Receiver
Data Rate
per Lane
(Gb/s)
AV Optical
Power per
lane
dBm)
Extinction
Ratio
(dB)
Data Rate
per Lane
(Gb/s)
25.78125
-3 to +3
>4
25.78125
* Intermediate long reach
** Receiver OMA Sensitivity per lane (@ 10.3125Gb/s, PRBS 231-1, BER= 10-12)
Simplified & Scalable
PIC Design
S
2
=
Economical
Solutions
General Specifications
Sensitivity
Operating
(OMA) per
Case
Lane
Temperature
(**)
(°C)
< -7.5
0 to 70
Supply
Voltage
(V)
Typical Power
Consumption
(W)
Reach
(km)
3.1 to 3.5
<3.5
≤2
Expert in CWDM Solutions
100GBASE CFP4 iLR4* Transceiver Roadmap
Overview
yy 100Gbps hot pluggable transceiver in CFP4 form factor
yy Optical connectivity based on two SMF LC connectors
yy Optical engine combining uncooled 4 X 25Gbps
CWDM DFB lasers with integrated MUX/DeMUX
yy Built in digital diagnostics
yy RoHS-6 compliant
yy Operating case temperature range of 0 to 70°C
yy Design is based on QSFP28 optical engine and CFP4 electrical interface
Applications
yy
yy
yy
yy
100GBASE Ethernet links
100GE Enterprise switch and routers
Carrier grade 100GE core routers
Point-to-point and ring applications
100GBASE CFP4 iLR4*
yy
yy
yy
yy
Supports up to 100Gb/s data rate links
Based on CFP4 baseline specifications
Typical Power dissipation: <3.5W
Single 3.3V power supply
Code
Transmiitter
Wavelength
(nm)
100GBASE 1270 / 1290 /
CFP4 iLR4 1310 / 1330
Receiver
Data Rate
per Lane
(Gb/s)
AV Optical
Power per
lane
dBm)
Extinction
Ratio
(dB)
Data Rate
per Lane
(Gb/s)
25.78125
-3 to +3
>4
25.78125
General Specifications
Sensitivity
Operating
(OMA) per
Case
Lane
Temperature
(**)
(°C)
< -7.5
0 to 70
Supply
Voltage
(V)
Typical Power
Consumption
(W)
Reach
(km)
3.1 to 3.5
< 3.5
≤2
* Intermediate long reach
** Receiver OMA Sensitivity per lane (@ 10.3125Gb/s, PRBS 231-1, BER= 10-12)
SystemOnGlassTM
SystemOnGlassTM
56G IB-4X-FDR QSFP+ iLR4* Transceiver
Overview
yy 56G hot pluggable transceiver in QSFP+ form factor
yy Optical connectivity based on two SMF LC connectors
yy Optical engine combining uncooled 4 X 14Gbps
CWDM DFB lasers with integrated MUX/DeMUX
yy Built in digital diagnostics
yy XLPPI electrical interface
yy RoHS-6 compliant
yy Operating case temperature range of 0 to 50°C
56G IB-4X-FDR QSFP+ iLR4 Transceiver
Typical Electrical Eye
Applications
yy FDR/QDR/DDR Infiniband links
yy Data Center and HPC interconnections
56G IB-4X-FDR QSFP+ iLR4*
yy
yy
yy
yy
Hot pluggable electrical interface
Supports 56Gbps data rate links up to 2km on a Singlemode Fiber (SMF)
Power dissipation < 3.5W
Single 3.3V power supply
Code
Transmiitter
Wavelength
(nm)
Data
Rate per
Lane
(Gb/s)
Receiver
AV Optical
Optical
Data
Extinction
Power per Modulation
Rate per
Ratio
lane
Amplitude
Lane
(dB)
dBm)
(dBm)
(Gb/s)
56G IB-4X1270 / 1290 /
FDR QSFP+
2.5 to 14
1310 / 1330
iLR4
-3.5 to
+2.3
-5.2 to +3.5
> 3.0
* Intermediate long reach
** Receiver OMA Sensitivity per lane (@ 10.3125Gb/s, PRBS 231-1, BER= 10-12)
Simplified & Scalable
PIC Design
S
2
=
Economical
Solutions
2.5 to 14
General Specifications
Sensitivity Operating
(OMA) per
Case
Lane
Temperature
(**)
(°C)
< -8.5
0 to 50
Supply
Voltage
(V)
Typical Power
Consumption
(W)
Reach
(km)
3.1 to 3.5
< 3.5
≤2
Fiber-To-The-X
Passive PLC Splitters Family Line
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SystemOnGlassTM
5
3
4
2
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REV
SED,
UT
P.
SystemOnGlassTM
ECO No.
5
6
RESTRICTION ON USE :
THIS DOCUMENT CONTAINS PROPRIETARY
INFORMATION OF COLOR-CHIP.
IT SHALL NOT BE REPRODUCED, DISCLOSED,
OR USED IN WHOLE OR IN PART WITHOUT
WRITTEN PERMISSION FROM COLOR-CHIP.
1
REVISION RECORD
DESCRIPTION
ZONE
APPR.
DATE
3
4
RESTRICTION ON USE :
THIS DOCUMENT CONTAINS PROPRIETARY
INFORMATION OF COLOR-CHIP.
IT SHALL NOT BE REPRODUCED, DISCLOSED,
OR USED IN WHOLE OR IN PART WITHOUT
WRITTEN PERMISSION FROM COLOR-CHIP.
A
5.7” DPLC Splitter Wafer
D
5 REV
6
2
1
REVISION RECORD
DESCRIPTION
4
ECO No.
ZONE
APPR
D
A
4.0''
C
6.0''
B
LID
WAVE GUIDES
PLANE
A (5 : 1)
5.7” PLC Wafer
B
Side View
WAFER
A (5 : 1)
B
101.60±0.3
Features
yy Full Suite of 1XN wafer family line
yy Low Insertion Loss
yy Operating Wavelength: 1260- 1650nm
yy Low Polarization Dependent Loss (PDL)
A
yy 5Excellent
Channel Uniformity
4
yy Telcordia and PCT Compliant
BREAK SHARP EDGES
0.1 X 45
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN mm.
Wafer Format- Lid & Wafer Configuration
ColorChip
MATERIAL: AL.6061 T6.
PROCESS\TREATMENT:
yy Dicing Marks
DATE
ySIGN.
y Ultimate
Dicing Material
TITLE:
101.60±0.3
NAME
DSGN
TOLERANCES
LINEAR
ANGULAR CHKD
0.05
APPR
1
1st. ANGLE PROJECTION
Eyal S.
SURFACE ROUGHNESS [microINCH]
63
( 32)
A
3
2
BREAK SHARP EDGES
DWG. No.
SIZE
0.1 X 45
A3
5
4
A
1
DIMENSIONS ARE IN mm.
OF 1
NAME
DSGN
TOLERANCES
LINEAR
ANGULAR CHKD
0.05
APPR
1
6
ColorChip
MATERIAL: AL.6061 T6.
PROCESS\TREATMENT:
SCALE: 1:1 UNLESS OTHERWISE
REV. 0 SPECIFIED SHEET 1
1st. ANGLE PROJECTION
6
2.35±0.2
101.60±0.3
WAFER
2.35±0.2
1.25±0.1
C
1.25±0.1
WAVE GUIDES
PLANE
C
'
7'
5.
101.60±0.3
LID
Eyal S.
SIGN.
DATE
SURFACE ROUGHNESS [microINCH]
63
( 32)
5
3
2
TITLE:
SIZE
A3
DWG. No.
SCALE: 1:1
4
Applications
yy FTTX Networks
yy Analog and Digital PON
yy CATV Networks
Parameter
Unit
Insertion Loss (Max) A/P Grade
Uniformity (Max) A/P Grade
dB
1x2
1x4
1x8
1x16
1x32
1x64
≤3.7/3.5
≤7.0/6.7
≤10.0/9.8
≤13.2/13.0
≤16.2/16.0
≤19.8/19.6
≤0.5/0.5
≤0.5/0.5
≤0.6/0.5
≤1.0/0.7
≤1.2/1.0
≤1.5/1.4
PDL (Max) A/P
< 0.15
Pitch
μm
Return Loss
dB
≥55
Directivity
dB
≥55
Operating Wavelength
nm
1260 ~ 1650
Operating Temperature
°c
-40 ~ +85
Simplified & Scalable
PIC Design
S
2
=
250
Economical
Solutions
250
< 0.2
127
127
< 0.25
127
127
REV. 0
1
SHEE
Expert in CWDM Solutions
5
6
RESTRICTION ON USE :
THIS DOCUMENT CONTAINS PROPRIETARY
INFORMATION OF COLOR-CHIP.
IT SHALL NOT BE REPRODUCED, DISCLOSED,
OR USED IN WHOLE OR IN PART WITHOUT
WRITTEN PERMISSION FROM COLOR-CHIP.
5.7” PLC Splitter Chips
3
4
2
REV
REVISION
DESCRIPTION
ECO No.
D
W
IDT
H)
th)
0.2
ng
Le
L(
(W
H (Height) 2.35 0.1
C
1.1 0.05
1.25 0.05
Splitter Chip (Glass)
Adhesive Gap 2-10 um
Lid (Glass)
0.1
B
Features
yy
yy
yy
yy
yy
yy
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN mm.
Chip Format- Lid & Chip Configuration
NAME
DSGN
TOLERANCES
LINEAR
ANGULAR CHKD
0.05
APPR
1
Full Suite of 1XN chip family line
Low Insertion Loss
Operating Wavelength: 1260- 1650nm
Low Polarization Dependent Loss (PDL)
Excellent Channel Uniformity
Telcordia and PCT Compliant
1st. ANGLE PROJECTION
6
5
4
Eyal S.
3
Insertion Loss (Max) A/P
Uniformity (Max) A/P
dB
1x2
1x4
1x8
1x16
1x32
1x64
≤3.7/3.5
≤7.0/6.7
≤10.0/9.8
≤13.2/13.0
≤16.2/16.0
≤19.8/19.6
≤0.5/0.5
≤0.5/0.5
≤0.6/0.5
≤1.0/0.7
≤1.2/1.0
≤1.5/1.4
PDL (Max) A/P
< 0.15
Pitch
Dimension
μm
L
W
mm
H
< 0.2
< 0.25
250
250
127
127
127
127
8.00
9.80
10.30
14.10
17.27
26.35
2.00
2.30
2.00
2.50
4.40
9.00
2.35
2.35
2.35
2.35
2.35
2.35
Return Loss
dB
≥55
Directivity
dB
≥55
Operating Wavelength
nm
1260 ~ 1650
Operating Temperature
°c
-40 ~ +85
DATE
2
yy FTTX Networks
yy Analog and Digital PON
yy CATV Networks
Unit
SIGN.
SURFACE ROUGHNESS [microINCH]
63
( 32)
Applications
Parameter
C
MATERIAL: AL.6061 T6.
PROCESS\TREATMENT:
BREAK SHARP EDGES
0.1 X 45
A
SystemOnGlassTM
TITLE:
SIZE
A3
DWG
SCALE: 2:1
ColorChip Corporation LTD.
Tavor Building 1 | P.O. Box 158 | New Industrial Park | Yokne’am 2069203 | Israel
T: +972 4 630 0200 | F: +972 4 630 0260 | www.color-chip.com | [email protected]

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