High Frequency Test Methods for Laminate Materials

High Frequency Test
Methods for Laminate
Materials (HF) Project
Project Update
HDPUG Meeting
Sept. 20-21, 2011
Spain
OBJECTIVE
Using all viable electrical test methods for speeds
above 2 GHz, test wide range of high frequency
(below IPC ~0.010 Df at 1 GHz) laminate materials
including most commercial (volume production with
UL approval) “halogen-free” laminate materials.
Material resin content/construction, Cu foil surface
roughness/type and moisture content shall be
consistent and not variables in this Phase 1 testing.
Goal
Compare the results of the many various higher frequency Dk
and Df test methods for each of the materials tested.
• Focus on identifying possible correlations for future work
• Identify test method problems and/or discrepancies in results
SCHEDULE
Completed selecting laminate materials to be tested
and high frequency test methods to be used.
Completed test board layout, fabrication and test
facility commitments. Remaining schedule:
1) Complete test board construction and design data
package – est. Sept. 23rd
2) Fabricators order materials – est. Sept. 30th
3) Fabricators receive materials – est. Nov. 1st
4) Manufacture of test boards completed and
shipped to testers – etc. Nov. 30th
5) Testing starts – est. Jan. 1, 2012
6) Testing is completed – est. Feb. 1, 2012
7) Final report completed – est. Feb. 15, 2012
PROCESS FLOW CHART
TV Design
6 Layers
Fabrication:
Testing:
Laminate Manufacturers
Viasystems
Hitachi
SPC-IPC
Hitachi
Tri-Plate
Resonator
JPCA
TM0001
Viasystems
4-Port VNA
Isola
Bereskin
Stripline
TTM
Shengyi
Iteq
Stripline
IPC 2.5.5.11 IPC 2.5.5.5,
IPC 2.5.5.12 IPC 2.5.5.13
SPDR
NIST
SPC
Resonator
Interobotics
SPP
EBW
Intel
SET2DIL
Cisco
S3
LAMINATE MATERIALS
Not Halogen-Free
Halogen-Free
Matsushita Megtron-6
Hitachi FX-2
Iteq IT-150D or DA
Nelco 4000-13EP SI
Iteq IT-200LK
Isola IS-415
Matsushita R-2125
Isola 370HR
Mitsubishi MGC FL700
EMC EM-828K
Iteq IT-168G
Hitachi MCL HE 679G
TUC TU-862HF
Matsushita R-1566W
Shengyi S-1165
Iteq IT-170GR or GRA
Hitachi MCL-E-75G
TEST METHODS
Dk/Df:
SPP (IBM)
S-3 (CISCO)
Bereskin Stripline (Isola)
Split Post Dielectric Resonator Cavity (IPC 2.5.5.13)
Tri-plate Line Resonator (JPCA-TM001)
SET2DIL (Intel)
EBW Stripline (IPC 2.5.5.5)
NIST
Other (for control and monitoring):
DC Resistance
Propagation Delay
TEST BOARD LAYOUT
RESOURCES/SUPPORT
Reference SCHEDULE on Slide #3:
• Two fabricators share building all test boards
• Each laminate material will be supplied to one fabricator
• Oracle to fund Interobotics for SPP testing
• Hitachi to do JPCA testing
• Iteq & Hitachi & Shengyi to do IPC testing
• Isola to do Bereskin Stripline testing
• CISCO to do S-3 testing
• SET2DIL testing by Intel or TBD
• Prop Delay and DC Resistance test sites TBD
All other activities to be sourced through and funded by the
project members. No additional HDP funding required.
PARTICIPANTS
Contributors, Fabricators, Testers
• Karl Sauter, Oracle Corp.
• Mike Freda, Oracle Corp.
• Holle Galyon, Viasystems
• Eric Mieglitz, Viasystems
• Chris Katzko, TTM Meadville
• Joe Smetana, Alcatel-Lucent
• Scott Hinaga, CISCO
• David Senk, CISCO
• Jeff Taylor, IBM
• Michael D. Janezic, NIST
• Dylan Williams, NIST
• James Baker Jarvis, NIST
Laminate Material Suppliers:
• Albert Chen, EMC
• Terry Fischer, Hitachi-Chemical
• David Bedner, Isola
• Peg Conn, Isola
• Rick Lovelady, Iteq
• Robert Huang, Iteq
• DeAnn Drottz, ParkElectro
• Scarlet Wang, ShengyiGuangdong
• Kevin Zhang, ShengyiGuangdong
• Frieda Yip, Shengyi-Guangdong
• CS Ng, TUC-Taiwan

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