Cu CMP

Head Office
9-4, Nishishimbashi 3-chome, Minato-ku, Tokyo 105-8464, Japan
Electronics Equipment Dept. (Takebashi Office)
1-1, Hitotsubashi 2-chome, Chiyoda-ku, Tokyo 101-0003, Japan
TEL: +81-3-3515-1940 FAX: +81-3-3515-1959
E-mail: [email protected]
Data & Configuration
ID No.:
S00052859
Description:
CMP
Manufacturer:
AMAT
Model:
REFLEXION
Wafer Size:
300mm
Vintage:
2003
Serial Number:
403588
Location:
Japan
1,Mainframe(Polishing Module) System Configuration
1-1, Mainframe(Reflexion Polishing Module)
*30 inch platen x3
(Note) Can be used ISRM
*HCLU x1
*Dual Wafer Transfer Robot (Wafer Exchanger) x1
(Note) Wafer transfer for Dual Transfer Station to HCLU
*Dual Transfer Station x1
*Pad conditioner x3
*Pad conditioner cleaner x3
*Inter Platen cleaner x4
*Inside retractable slurry delivery system x1
*12 inch Polishing Head x4
*Polishing Head Spindle x4
*Cross(Carousel) x1
*Lower Pneumatic x5
*Upper Pneumatic x4
*Hand shower (Inside retractable type) x2
Configuration:
1-2, Electric/Control
Electric/Control module
x1
1-3, PC monitor
LCD x2
1-4, PC Based System Software
*Reflection software x1
1-5, Wet robot (For 31 inch Work Space)
*Wet Robot x1
Head Office
9-4, Nishishimbashi 3-chome, Minato-ku, Tokyo 105-8464, Japan
Electronics Equipment Dept. (Takebashi Office)
1-1, Hitotsubashi 2-chome, Chiyoda-ku, Tokyo 101-0003, Japan
TEL: +81-3-3515-1940 FAX: +81-3-3515-1959
E-mail: [email protected]
1-6,Cleaner
(Note) The cleaner made by AMAT of WET IN/ DRY OUT type developed
for 300mm Reflexion system
*Input Station x1
*Mega-sonic Module x1
*Dual side scrub (Brush) module (Brush module) x2
*Spin rinse dry Module(SRD) x1
*Output Module x1
*Walking Beam x1
*Liquid Delivery Module (LDM) x4
(Note) Exclusive LDM is inside of the cleaner per Mega-sonic,
Brush Module 1 &2 and SRD
*Upper/Lower Electronics
*Filter Fan Unit (FFU) x1
*Hand shower (Inside retractable type) x1
*Input Buffer x1
*Pass-thru station x1
1-7, Factory Interface
(Note) 4 Port Loading Station made in US.
*Port (FOUP Opener) x2
*Wafer Handling Robot x1
*X-axis drive x1
*Wafer Mapping Sensor x1
(Note) Wafer Mapping correspondence on FOUP(Wafer carrier)
1-8,Chiller
*Neslab HX300 Heat Exchanger
x1
2, Integration Configuration
2-1,Reflexion system(Polishing module, Cleaner and FI)
*Correspondence Wafer: SEMI standard Si Wafer
*Wafer size: 300mm Notch type
2-2, Mainframe(Polishing Module)
*CE Latch type with guard ring x4
2-3, Load cup
*Each unit configuration is below.
Head Office
9-4, Nishishimbashi 3-chome, Minato-ku, Tokyo 105-8464, Japan
Electronics Equipment Dept. (Takebashi Office)
1-1, Hitotsubashi 2-chome, Chiyoda-ku, Tokyo 101-0003, Japan
TEL: +81-3-3515-1940 FAX: +81-3-3515-1959
E-mail: [email protected]
2-4, Wafer exchanger (Dual Wafer Transfer Robot)
*Wafer transfer robot: 2 axis robot, Horizontal left-right rotation,
up-down (Z-axis)
*Wafer gripe method: Edge contact gripe
*Finger: Wafer edge grip by 3 finger on grip unit.
2-5, Dual transfer station
*Right side station: Loading only
*Left side station: Unloading only
2-6, Load cup
* Air cylinder drive for Load cup and pedestal up-down apparatus.
2-7, Polishing head
*Membrane pressurize method:
Head can be pressurized for Internal Membrane, Retaining Ring,
Upper Chamber Pressure.
Wafer is adsorbed by vacuum between Support Ring and Internal
Membrane in External Membrane.
2-8, Cross/Spindle
*Cross: 4 head arranged into a cross form.
Wafer slide detect by wafer slip sensor.
*Spindle: Polishing head rotation by direct drive.
(Max 200rpm/±5% Full-scale)
2-9, Pad conditioner configuration
*Pad conditioner head is pressurized by air through diaphragm.
*Pad is conditioned by conditioner head rotation. (30-120rpm)
*φ4inch diamond grid type
2-10, Platen configuration
*Materials: Aluminum 6061
Platen surface dives lapping processing after the hard black anodize.
Corrosion resistance coating for other parts.
*Max rotation speed: 133rpm (±5% Full-scale)
2-11, VME Super Module 4 Kit
*VME: PentiumⅢ processor, 128M SDRAM
*HDD: 9.2GB (SCSI Type)
*FDD: 3.5”
*Main PCB: DIO, AIO, MEI(Motion Engineering inc.), Device internet
Head Office
9-4, Nishishimbashi 3-chome, Minato-ku, Tokyo 105-8464, Japan
Electronics Equipment Dept. (Takebashi Office)
1-1, Hitotsubashi 2-chome, Chiyoda-ku, Tokyo 101-0003, Japan
TEL: +81-3-3515-1940 FAX: +81-3-3515-1959
E-mail: [email protected]
2-12, ISRM (IN-SITU Polishing Monitor System)
*Auto-detect on In-Situ of polishing end.
*Digital ISRM type
*Laser: Wave length 670mm semiconductor laser,
Light source region: class 3a, Visible region: class 1
2-13, Wet robot configuration
*Wafer transfer between Cleaner/Polishing Module by KAWASAKI robot.
*Wafer transfer robot : 4-axis robot
: Arm horizontal rotation(θ),Elastic(R),Up-down(Z)
: Blade rotation(Horizontal Ù Vertical), (W: Flipper)
*Wafer grip: Plunger type
*Blade materials: SUS304
*Teflon coat for robot casing
3,Cleaner Module
*The cleaner made by AMAT of WET IN/ DRY OUT type developed for
300mm Reflection system integration.
Cleaner receive a wafer after polishing and perform ultrasonic cleaning,
Dual side scrub, spin drying and return a wafer to FI.
Wafer clean, Spin dry, etc. by Vertical (accuracy 87.5deg) position
3-1, Mega-sonic Module
*Temperature control: 20 – 65deg
*Heat Exchanger temperature control accuracy: ±0.5deg
*Ultrasonic Frequency: 950kHz
*Ultrasonic Power: 600W
3-2, Dual side scrub module (Brush Module)
*Maximum Brush Rotation: 700rpm
*Maximum Wafer Rotation: 50rpm
*Brush information:
Maker: TEXWIPE(SYNTAK)
Materials: PVA Sponge
Size: φ2.75”/φ1.25”(OD/ID) x12.5”L
*DIW control on brush: 1000 – 4000 ml/min
3-3, Spin Rinse Dry Module (SRD)
*Fly Wheel Maximum Rotation Speed: 2500rpm
The equipment being quoted is used, and is being sold “AS-IS, WHERE IS” basis unless otherwise agreed. This equipment
data may contain typographical errors and we do not warrant the completeness or accuracy of the information contained
herein. Any reliance you place on any information on this equipment data is strictly and completely at your own risk. Any
offer by you to purchase of the equipment described in this equipment data shall be subject to our standard terms and
conditions of sale.

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