MAMG-002735-030PSM

MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
Functional Schematic
Features
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Preliminary - Rev. V1P
Very Compact Size (7X7 mm) 28 PIN QFN
GaN on SiC D-Mode Transistor Technology
Partially Matched, de-coupled DC and RF
Typical Bias: 50 V, Class AB
Intended for Pulsed RADAR Applications
Output Power > 35W, with 25dB Gain and 55%
Power Added Efficiency
Up to 1 ms Pulse Width and 15% Duty Cycle
MTTF = 600 years (TJ < 200°C)
Thermally Enhanced Laminate LGA Package
RoHS* Compliant. Lead Free Reflow Compatible
MSL-3
Description
The MAMG-002735-030PSM is a 2-stage GaN
power module in a “True SMT” LGA overmolded
laminate package. The module is partially
matched. Under pulsed conditions, it can deliver
output power greater than 35W, with 25 dB
typical associated gain and 55% typical power
added efficiency.
Pin Configuration3,4
Pin No.
Function
Pin No.
Function
1
Ground
15
Ground
2
Ground
16
Ground
3
RF IN
17
RF OUT
Ordering Information 1,2
Part Number
Package
4
RF IN
18
RF OUT
MAMG-002735-030PSM
Bulk Packaging
5
RF IN
19
RF OUT
MAMG-0T2735-030PSM
100 Piece Reel
6
Ground
20
Ground
MAMG-002735-SB2PPR
Evaluation Board
7
Ground
21
Ground
8
VG1
22
VD2
9
NC
23
VD1
10
Ground
24
Ground
11
Ground
25
Ground
12
Ground
26
Ground
13
NC
27
NC
14
VG2
28
NC
1. Reference Application Note M513 for reel size information.
2. All sample boards include 3 loose parts.
3. MACOM recommends connecting unused package pins to
ground.
4. The exposed pad centered on the package bottom must be
connected to RF and DC ground.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
Preliminary - Rev. V1P
Electrical Specifications 5
Parameter
Symbol
Min.
Typ.
Max.
Units
RF FUNCTIONAL TESTS: Freq. = 2900-3500MHz, VDD = 50 V, IDQ = 100 mA, TA = 25°C, ZL = 50 Ω, Pulse Width = 1ms,
Duty Cycle = 10%, PIN = 20.0dBm
POUT
-
45.5
-
dBm
POUT
-
36
-
W
Gp
-
25.5
-
dB
PAE
-
55
-
%
Droop
-
0.2
0.4
dB
2F0
-
-35
-
dBc
3 Harmonic
3F0
-
-45
-
dBc
Load Mismatch Stability
VSWR-S
-
5:1
-
-
Load Mismatch Tolerance
VSWR-T
-
6:1
-
-
Peak Output Power 6
Power Gain
Power Added Efficiency
Pulse Droop
7
2nd Harmonic
rd
5. Typical RF performance measured in RF evaluation board (see layout on page 3).
6. Peak output power measured at center of pulse.
7. Pulse droop measured between 10% and 90% of pulse.
Absolute Maximum Ratings 8,9,10,11,12
Parameter
Absolute Maximum
Input Power
26 dBm
Drain Supply Voltage (pulsed), VDD
+55 V
Gate Supply Voltage Range, VGG
-9 V to -2.5 V
Supply Current, IDD
1.7A
Power Dissipation, Pulsed Mode @ 85ºC
Junction Temperature
40W
13
200 °C
Operating Temperature
-40°C to +85°C
Storage Temperature
-65°C to +150°C
ESD Maximum - Human Body Model (HBM)
600 V
ESD Maximum - Charged Device Model (CDM)
300 V
8.
9.
10.
11.
12.
Exceeding any one or combination of these limits may cause permanent damage to this device.
MACOM does not recommend sustained operation near these survivability limits.
For saturated performance it is recommended that the sum of (3 * VDD + abs (VGG)) < 175 V.
CW operation is not recommended. Max Duty cycle is 20%
Operating at nominal conditions with TJ ≤ 200°C will ensure MTTF > 1 x 106 hours. Junction temperature directly affects device MTTF
and should be kept as low as possible to maximize lifetime.
13. Junction Temperature (TJ) = TC + ӨJC * ((V * I) - (POUT - PIN)).
Typical Transient Thermal Resistance ӨJC = 3.0°C/W (1 ms pulses, 10% duty cycle)
2
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
PCB Layout
Preliminary - Rev. V1P
Parts List
Part
C1, C5
C2
C3
C4
C6
C7
C8
C9
L1
R1
R2
Value
0.9 pF
12 pF
2.4 pF
10 pF
100 pF
10 nF
100 pF
10 nF
2.0 nH
100 Ohm
15 KOhm
Case Style
0402
0402
0402
0402
0603
0603
0402
0402
0402
0402
0402
Parts are measured and sampled in the evaluation
board shown on the left. The board is made of
12 mil thick RO4003C and is bolted onto a Ni-plated
Aluminum plate. Electrical and thermal ground is
provided using a Cu-filled via-hole array (8 mil
diameter, 8 mil spacing edge-to-edge).
Bias Sequencing
Turning the device ON
1. Set Pulsed VG to the pinch-off value (VP), typically
-5 V.
2. Turn on VD to nominal voltage (50 V).
3. Increase VG to desired quiescent current (100mA
X Pulse Duty Cycle, in this case 10mA).
4. Apply Pulsed RF power to desired level.
Turning the device OFF
1. Turn off RF power.
2. Decrease VG down to VP.
3. Turn off VD.
3
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
Preliminary - Rev. V1P
Typical Large-Signal Performance Over Temperature:
Pulsed RF, 1000 µs Pulses, 10% Duty Cycle, VDD= 50 V, IDQ = 100 mA_pk
Pout
Power Gain
MAMG-002735-030PSM Overtemp
(Vd=50V, Idq=100mApk, Pin=100mWpk, 1ms, 10%)
MAMG-002735-030PSM Overtemp
(Vd=50V, Idq=100mApk, Pin=100mWpk, 1ms, 10%)
28
44
27
42
40
26
Gp (dB)
Pout (Wpk)
-40 DEG. C
-40 DEG. C
38
-20 DEG. C
-20 DEG. C
25
0 DEG. C
0 DEG. C
25 DEG. C
25 DEG. C
36
50 DEG. C
50 DEG. C
75 DEG. C
24
75 DEG. C
85 DEG.C
85 DEG.C
34
23
32
22
30
2900
2900
3000
3100
3200
3300
3400
3000
3100
3200
3500
3300
3400
3500
Freq (MHz)
Freq (MHz)
Droop
Drain Efficiency
MAMG-002735-030PSM Overtemp
(Vd=50V, Idq=100mApk, Pin=100mWpk, 1ms, 10%)
MAMG-002735-030PSM Overtemp
(Vd=50V, Idq=100mApk, Pin=100mWpk, 1ms, 10%)
70
1
0.9
65
0.8
0.7
60
0.6
Droop (dB)
Eff (%)
-40 DEG. C
-20 DEG. C
55
0 DEG. C
25 DEG. C
-40 DEG. C
-20 DEG. C
0.5
0 DEG. C
25 DEG. C
0.4
50 DEG. C
50 DEG. C
75 DEG. C
50
75 DEG. C
0.3
85 DEG.C
85 DEG.C
0.2
45
0.1
40
2900
0
3000
3100
3200
3300
3400
2900
3500
3000
3100
3200
Freq (MHz)
3300
3400
3500
Freq (MHz)
Typical Small-Signal Performance Over Frequency:
VDD= 50 V, IDQ = 100 mA, TA = 25°C
MAMG-002735-030PSM Measured S-pars
35
30
20
DB(|S(1,1)|)
SN_2
DB(|S(2,1)|)
SN_8
DB(|S(2,1)|)
SN_2
DB(|S(2,2)|)
SN_8
DB(|S(2,2)|)
SN_2
K()
SN_2
DB(|S(1,1)|)
SN_8
K()
SN_8
10
0
-10
-20
-30
0.2
2.2
4.2
6
Frequency (GHz)
4
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
Preliminary - Rev. V1P
Typical Large-Signal Performance Over Votage:
Pulsed RF 100 mW_pk, 750 µs Pulses, 20% Duty Cycle, VDD in V, IDQ = 100 mA_pk
Pout
Power Gain
MAMG-002735-030PSM Over Voltage Test
(Pin=100mWpk, Idq=100mApk, 750us, 20%)
MAMG-002735-030PSM Over Voltage Test
(Pin=100mWpk, Idq=100mApk, 750us, 20%)
30
40
35
25
30
20
28V
28V
32V
20
36V
Gp (dB)
Pout(Wpk)
25
32V
15
36V
40V
15
40V
44V
44V
10
48V
48V
10
5
5
0
2700
0
2800
2900
3000
3100
3200
3300
3400
3500
3600
2700
2800
2900
3000
Freq (MHz)
3100
3200
3300
3400
3500
3600
Freq (MHz)
Droop
Drain Efficiency
MAMG-002735-030PSM Over Voltage Test
(Pin=100mWpk, Idq=100mApk, 750us, 20%)
MAMG-002735-030PSM Over Voltage Test
(Pin=100mWpk, Idq=100mApk, 750us, 20%)
60
0.8
0.7
50
0.6
40
Eff (%)
32V
30
36V
Droop (dB)
0.5
28V
28V
32V
0.4
36V
40V
44V
20
40V
0.3
44V
48V
48V
0.2
10
0.1
0
2700
0
2800
2900
3000
3100
3200
3300
3400
3500
3600
Freq (MHz)
2700
2800
2900
3000
3100
3200
3300
3400
3500
3600
Freq (MHz)
5
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-002735-030PSM
S-Band 30 W 2-Stage Partially Matched GaN Module
Surface Mount Laminate Package
Preliminary - Rev. V1P
Package Outline and Recommended Landing Pattern14,15,16,17
TOP VIEW
SOLDER MAKS PATTERN
14. All dimensions are in millimeters and inches.
15. Reference Application Note S2083 for lead-free solder
reflow recommendations. Plating is Ni/Pd/Au.
16. Landing pattern indicates solder mask opening. Cu-filled
via-holes under the ground are used for optimal thermal
performance. Recommended pattern: 8-mil diameter, 8-mil
spacing.
17. Layout drawing available upon request.
BOTTOM VIEW
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Nitride Devices and Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
6
ADVANCE: Data Sheets contain information regarding a product MACOM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MACOM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. (MACOM ) and its affiliates reserve the right to
make changes to the product(s) or information contained herein without notice.
For further information and support please visit:
https://www.macomtech.com/content/customersupport