Applied Research Center, Thomas Jefferson Lab Old Dominion University Mechanical Aerospaceand Engineering Department and of Mechanical Aerospace Department Engineering Materials Science & Engineering Thin films fabrication and Nano Scale Mech. & Struct. Properties Nanoindentation Nano Scale Modeling & Simulation Activation analysis / Dislocation plasticity Nanopositioners for Electron Microscopy, Precision Machining and Precision Motion Old Dominion University Department of Mechanical and Aerospace Engineering Faculty A.A. Elmustafa (PI) Mechanical & Aerospace Eng. (ODU) Applied Research Center-Jefferson Lab Graduate students Current: 1- Dave Stegall (Ph.D) 2- Abdullah Mamun (Ph.D) 3- Cody Wright (Ph.D) 4- Mahzad Bastaninejad (Ph.D) 5- Donald Muffet (M.S) Former: 1- Saptarshi Mandal (Thomas Jefferson Lab) 2- Justin Rice (US Navy, Dahlgren) 3- Sandeep Thubee (Somotomo Drive Trains) 4- Phani Kumar Collaborators Matt Poelker Jefferson Lab 1- Donald Stone (University of Wisconsin-Madison) 2- Claretta Sullivan (Eastern Virginia Medical School) 3- Matt Poelker (Jefferson Lab) 4- Rol Johnson (Muons Inc.) 5- Winston Soboyejo (Princeton University) 6- Stan Woodard (NASA Langley Research Center) 7- Gene Hour (MAE ODU) 8- Deji Dumren (MAE ODU) 9- Hani Elayed-Ali (ECE ODU) 10- Helmut Baumgart (ECE ODU) 11- Gon Namkoong (ECE ODU) 2 Old Dominion University Department of Mechanical and Aerospace Engineering • Thin films fabrication Solder joints in microelectronics SAC (Sn-Ag-Cu) and In-Sn alloys Metal and alloys (Al, Ni, Ag, -brass,Ni-Cu, 7075 Al) • Nanomechanical/structural properties – – – – – – High-k metal gates (HfO2, Al2O3, AlN, GaN) Superconductivity/accelerators (NbN) Solar cells (ZnO) Satellites (Sb2Te3) Communications (VO2) Surgical instruments, dental implants, Titanium alloys in jet engines (V) • Structural/mechanical properties of biological materials – Nanomechanical structural properties of E. coli – Nanomechanical structural properties of human costal cartilage – Structural/mechanical properties of prostate cancer cells • ISE / indentation creep / activation volume / SFE correlations • Field emission in accelerator physics and breakdown characterization in RF cavities • FSW Old Dominion University Department of Mechanical and Aerospace Engineering Spin polarized electron beams via photoemission from a photocathode biased at high voltage Proton Electron Neutron Old Dominion University Department of Mechanical and Aerospace Engineering Materials science and engineering Modeling and simulation Historical background Nano Scale Modeling & Simulation Lab ARC-JLAB (2006) We started the Nanoscale Modeling and Simulation group at the ARC-JLAB with five computers running SUSE LINUX and one SUSE LINUX computer as a FLEXLm license server for commercial software ABAQUS. The group has performed simulations of strain rate sensitivity of nanoindentation creep, simulation of the effect of pile-up and sink-ins during nanoindentation creep, scaling of area with depth during nanoindentation, and a numerical study of the plunge phase in FSW using ABAQUS. Then, we moved the simulations software to ODU ZORKA clusters Finally, TURING 5 Old Dominion University Department of Mechanical and Aerospace Engineering Nano Creep Modeling at Turing Modeling and simulation bulk-thin films Slip tolerance = 0.005 Friction coefficient = 0.0 22.5 6 Old Dominion University Department of Mechanical and Aerospace Engineering Nano Creep Modeling at Turing (Viscoplasticity) Pre-processing (Input file) Genmesh and Genmeshmpc developed by our group using PYTHON (axisymmetric elastic-plastic von Mises materials. 4-node CAX4H isoparametric quadrilateral elements (defined in Abaqus) Step 1 (1 second) Slip tolerance = 0.005 Friction coefficient = 0.0 22.5 Step 2 (1 second) Penetrate the sample with displacement Adjusting the time increment Calibrating the reaction force (NanoCreep is a load control experiment Penetrate the sample with load Step 3 (2 seconds) Materials relaxes Step 4 (1 second) Retracting the tip from the sample Total Turing simulation time (1 day – 4 months depending on type of 7 problem) Old Dominion University Department of Mechanical and Aerospace Engineering Nano Creep Modeling at Turing (Viscoplasticity) Post-processing Data analysis (ODB file) History Output Step 1 Reaction force RF2 Spatial displacement U2 Total area in contact CAREA Step 2 Processing the data using mkcreep in GENPLOT to calculate the strain rate sensitivity of the hardness in creep Step 3 Generate mH/m vs. H/E* 8 Old Dominion University Department of Mechanical and Aerospace Engineering 0.6 Results and Discussion 1.0 0.4 4 4 4 4 5 5 6 7 10 10 10 4 4 4 10 10 10 12 0.8 0.6 0.4 0.2 m E (GPa) -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.2 -0.52 100 200 300 400 100 200 100 100 100 200 300 100 200 300 100 200 300 100 m H/E* n mH/m Spherical FEA Spherical coarse mesh o RateCone 19.7 o sensitive Cone 25.3 plasticity o Cone 22.5 (Elmustafa et al., 2007) Berkovich coarse mesh Spherical (Johnson 1951) Analytical Conical (Johnson 1951] solutions 0.5 0.2 0.2 0.2 0.2 0.16 0.16 0.133 0.114 0.08 0.08 0.08 0.2 0.2 0.2 0.08 0.08 0.08 0.04 0.3 0.2 25.3o 0.1 0.0 o -3 4 5 6 8 -2 3 4 5 6 8 10 m E E* 1 2 -1 m 1 n R 0.2 depth depth depth depth 2.0 2 H/E* 1 ( n [( m 1) ] m ) m 1 Pm 4 a E * 3 R 10 2 a R A.A. Elmustafa, S. Kose, and D.S. Stone, JMR 22 4 (2007) A.A. Elmustafa, and D.S. Stone, JMR 22 10 (2007) D.S. Stone, J.E. Jakes, J. Puthoff, and A.A. Elmustafa, JMR 25 4 (2010) Outstanding paper 3 m H / m 10 3 0.4 0.6 0.8 2.5 o 2 0.2 tan(cone) or a/R(sphere) 22.5 Empirical Theory based on k', ave = variable [Elmustafa et al., 2007] Theory based on k', ave = const. 0.0 0.0 19.7 1.5 < = = = 0.1 0.2 0.4 0.5 R R R R 5 -2 2 1.0 0.5 0.0 10 2 -4 5 10 -3 2 10 5 10 -1 2 5 10 0 (H / E*)/(a/R) Y. Mohamed, D.S. Stone, and A.A. Elmustafa, Unpublished work Old Dominion University Department of Mechanical and Aerospace Engineering 4 sided probe nanocreep simulations Thin films nanocreep simulations Nanofriction and tribological coatings simulations Friction stir welding simulations Nanolayer composites simulations Nanoelectronics/Microelectronics Interconnects Contact mechanics ab c d 12345 e 1 1 1 1 2 1 3 41 51 1 6 1 7 8 9 Cu Al 6789 1 0 f S. Mandal, J. Rice, G. Hou, K.M. Williamson, and A.A. Elmustafa, JMEPEG 22, 2013, 1558-1564 10 S. Mandal, J. Rice, and A.A. Elmustafa, J. Mater. Proc. Technol. 203, 2008, 411-419
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