Teradyne business update

Because Technology Never Stops
SEMICON CHINA
3D-IC BEYOND SMARTPHONES
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TERADYNE – WE ARE TEST
Chip Test
Wafers
Packaged
Devices
Sub System
Test
Printed Circuit
Boards
Global Services Organization
2
Final Product Test
Hard Disk
Drive
Wireless Products
TERADYNE BUSINESS
Semiconductor Test
System-On-Chip (SOC) Test
• Leading wireless, mixed signal, microcontroller and
performance analog test systems
• Largest installed base with over 11,000 systems installed at
IDM and OSAT customers
Memory Test
• Highest Throughput Flash and High Speed DRAM Solutions
FY2013
Wireless Products
Semiconductor
Test
System Test
18%
Wireless Test
• Unique tester architecture focused on production test of mobile devices
• Products deliver highest throughput and shortest time to market
• Serves ~$1B wireless production test market
Systems Test Group
Defense & Aerospace Board Test
• Defacto standard for DoD digital test
Storage Test
• Industry’s most productive 2.5” HDD Systems
Commercial Board Test
• Patented low voltage test technology delivers highest yield in-circuit
board test
3
11%
71%
SMARTPHONES ARE THE DRIVER…FOR NOW
• Smartphones have dominated semiconductor and packaging
technology for the last decade
• Smartphone and 3D-IC and TSV technologies have not aligned
• Smartphone size is driven by the screen size
(3D-IC makes things smaller)
• Smartphones need huge power hungry processors
(Thermal challenges make 3D-IC harder)
• Smartphones need huge amounts of memory and memory bandwidth
(LP-DDR capabilities have surged ahead of WideIO)
• Beyond 2016 smartphones growth slows down
• A variety of connected products drive the growth of the
semiconductor industry after 2016
• Small connected devices especially wearables need 3D-IC
technology to be truly successful
•
•
•
•
Wearables need to be incredibly small and light
Wearables need to be very power efficient because of limited battery size
Wearables have more specific applications
Wearables need to integrate a lot of different semiconductor technologies
• Test strategy for 3D-IC must align with the types of devices that
will use the technology
Source: Telenav via BGR
TECHNOLOGY WAVES
• Mobile Phone growth
has levelled off
• Smart Phone grow will
level off after 2016
• Tablets will overtake
PCs in 2014
• What will explosively
drive growth after
smartphones?
Source: Gartner
SMARTPHONE SEASONALITY DRIVES OPERATIONS
UltraFLEX Shipments
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SMARTPHONE VERSUS CONNECTED DEVICE
Photo Credit: iFixit
Photo Credit: EDN
Photo Credit: EDN
Photo Credit: Samsung
>20 complex devices
Processor: >100mm2 die size
RF: LTE, WLAN, BT, NFC, GPS
DRAM: 2GB
Flash: 64GB
Battery: 2600 mAh
6 complex devices
Processor: <35mm2 die size
Radios: WLAN, BT, GPS
DRAM: 1GB
Flash: 16GB
Battery 570mAh
Photo Credit: iFixit
Smartphone
Connected devices
Low mix /
Huge volume
High mix /
Moderate volume
Many Functions
Specific Functions
Big screen / HD Video
Small or no screen / No video
3D-IC WILL SUCCEED, BUT NOT WHERE YOU THINK
Hypothetical codesigned
Heterogeneous 3D-IC
Smartphone – Memory on Logic
Image Sensor
MEMS sensor
Radio
Touch
Low Power processor
Display Driver
Source: TSMC
High die costs
High power thermal stress
Huge interconnect counts
Co-design and testability issues
Difficulty hitting commodity pricing
Lack of need: Product size driven by screen size
Smaller, cheaper die
Small battery drives low power
Smaller interconnection counts
Cleaner technology partitioning
Smaller is definitely better
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TEST STRATEGY FOR 3D-ICS
In smartphone applications
In connected applications
• KGD for big digital devices
• Redundancy to achieve
required DPPM
• High probe count interfaces
• Post stack test requiring very
long scan tests
• High speed external IO
• Huge Volume / High Site
Count
• KGD for small mixed signal
devices
• DPPM achieved without
redundancy
• Simpler probe interfaces
• Little or no post stack test
• Low speed external IO
• Higher Mix / Lower Site Count
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TEST IMPLICATIONS FOR WEARABLE 3D-ICS
9 axis
MEMS
KGD
Test
WLAN
BT
GPS
KGD
Test
Stack
Touch
Control
KGD
Test
Stack
Display
Drive
KGD
Test
Stack
MCU
KGD
Test
Stack
Image
Processor
KGD
Test
Stack
Teradyne Confidential
Mixed signal and RF
Higher mix of products
Embedded memory
Cost sensitive
Functional Test of final product
Assembly
Final Test
FINAL TEST SYSTEM REQUIREMENTS
Digital
• Low speed external interfaces
• Deep and extensive scan test
• Low cost per pin
• Embedded Flash test capability
• Protocol Aware for Functional Test
Mixed Signal
• RF support for standards based testing
• High pin count converter test capability for Touch
• Display Driver test capability
Mechanical
• Positional stimulus for MEMS sensors
Teradyne Confidential

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