µm coatings for nm precision Curriculum Vitae

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Curriculum Vitae
Public
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Education
Work
1989-1994
2000-2002
M.Sc. Solid State Chemistry
Post-doc Physics
1995-2000
2002-
Ph.D. Applied Sciences
Materials specialist
µm coatings for nm precision
Maarten ter Heerdt
Dag van de Oppervlaktetechnologie, Maarssen, 13-Nov-2014
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Contents
Short introduction ASML
Surface treatments @ ASML
Short introduction ASML
Special topic: NiP
Challenge
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Faster, smaller, greener
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Open innovation from design to manufacturing
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Customers
Semiconductor producers
Co-solution network
Mask, Resist
Wafer track
Wafer processing
Supplier and partner
network
Optics, measurement
systems, parts, subsystems
Virtual innovation network
Academia, technology providers, research institutes
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Open innovation from design to manufacturing
Customers
Public
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Suppliers
Co-solution partners
Surface treatments @ ASML
Technology partners
Academia
Advanced Research Center for Nanolithography
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Surface treatments in use at ASML
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Purpose of coatings
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Prevent
Provide
• Particle shedding
• Cleanliness
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Anodization
• Corrosion
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NiP, passivation
• Wear
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DLC, Cr, hard anodizing
• Galling
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Inchromizing, Kolsterizing
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Electropolishing
• Electrical conductivity
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Chromate
• Low friction
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NiP-PTFE, opalization
• Low reflectivity
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Black Cr, Black Ni, Bilatal
• Color
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Lacquer, powder coat
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Mirrors: polished to nanometer accuracy
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The 30-cm mirrors used in our
EUV lithography systems must be
flat to less than 2 nm.
So if they had the same diameter
as the Earth, their tallest mountain
would be just 9 cm!
Special topic: NiP
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NiP, an ASML work-horse
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Specifying electroless Nickel
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Electroless Nickel is, probably after anodization, the most commonly
used surface treatment at ASML.
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Specification of a NiP coating can be done on many levels.
• Phosphorous content (low, middle, high)
• Coating house
Advantages
• Availability
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Too many to mention ;)
• Coating chemistry
• Design freedom (no dog-bone effect)
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MacDermid
• Sufficient corrosion protection @ 12 µm
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Atotech
• Thicker layers possible (if needed)
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Enthone
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Etc.
So what does ASML do?
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ASML specification of electroless Nickel
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Apparently, it is sufficient
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Maybe surprisingly…
We hardly specify anything!
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But sometimes…
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And then we dive in…
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How far do we go?
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Example 1: outgassing of water
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Problem: for application in vacuum, water outgassing is a critical parameter.
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Quite randomly, some products outgas more than others.
Possible cause: porosity of NiP-layers (function of supplier / P-content?).
Goal of the investigation: find out if P-content matters.
spec
mid-P high-P mid-P high-P mid-P mid-P high-P high-P
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Example 2: adhesive bonding
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Can cleaning before bonding have an effect?
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Problem: sometimes adhesive bonds fail.
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Yes, it can!
Possible cause: oxidation of NiP.
Goal of the investigation: find out if P-content matters.
This investigation led to the introduction of ASML cleaning standards.
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Example 3: more adhesive bonding
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Test results
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Problem: random bond failure under hydrogen exposure.
Possible causes: reduction of natural oxide, quality of NiP-layer, Pcontent.
Goal of the investigation: find safe design margin and coating spec.
S1N
S1Y
S2N
S2Y
S3N
S3Y
SxN = Supplier x, no hydrogen exposure
SxY = Supplier x, hydrogen exposure
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Test results
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Now what?
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We will do another test, varying:
• P-content (check with SEM/EDX)
• MTO
• Supplier
• Hydrogen exposure
And do this, again, statistically sound.
S1N
S1Y
S2N
S2Y
S3N
S3Y
SxN = Supplier x, no hydrogen exposure
SxY = Supplier x, hydrogen exposure
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Can you help?
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We are looking for the answers to all questions discussed.
Why does adhesion on NiP fail?
What is the root-cause?
Challenge to the audience
Why can’t we find this cause (yet)?
What do we do wrong?
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