Introduction to the Open Interconnect Consortium (OIC) David McCall – Senior Strategic Planner, Intel Corporation SPCS005 Agenda Why do we need a standard connectivity framework? What is the Open Interconnect Consortium (OIC)? • • • • • Members Goals Structure Technology Schedule How can you use, participate in and join the OIC? 2 Agenda Why do we need a standard connectivity framework? What is the Open Interconnect Consortium (OIC)? • • • • • Members Goals Structure Technology Schedule How can you use, participate in and join the OIC? 3 Modes of Communication Client to Cloud Smart Devices Things & Wearables Bridging & Forwarding Cloud Peer-to-Peer IoT Smart IP Internet 4 Client to Cloud STUN/TURN LE Device to Device Same Network Cloud Similar APIs across OSs & Languages APIs vary across OSs & Languages Industry standards for identity & security ? Modes of Communication Client to Cloud Smart Devices Things & Wearables Bridging & Forwarding IoT Cloud Services Reporting & Control Internet STUN/TURN LE * IoT Smart Cloud Peer-to-Peer Internet We need a way to make IoT Comms as easy, for developers and manufacturers, as connecting a client to a server in the Cloud Scope of OIC – IoT Comms OIC will address the challenge of IoT Comms 5 Agenda Why do we need a standard connectivity framework? What is the Open Interconnect Consortium (OIC)? • • • • • Members Goals Structure Technology Schedule How can you use, participate in and join the OIC? 6 OIC Membership First OIC face-to-face meeting was 28th & 29th August • Targeted at potential members • Over 100 attendees from over 40 companies Press release later this month will announce initial members including Board of Directors First member meeting targeting 1st, 2nd & 3rd September • Members only • Member agreements & information available at: www.openinterconnect.org/join 7 OIC Goals • Single solution covering interoperability across multiple vertical markets (Consumer, Enterprise, Industrial, Automotive, Health, etc…), OSs, platforms, modes of communication, transports and use cases - Common communications protocols for discovery and connectivity across multiple D2D transports - Common approaches for security and identity - Common service-level protocols, object models & developer APIs 8 • Promote interoperability vs. closed solutions • Promote innovation and allows differentiation • Delivers necessary connectivity from smart devices down to the smallest connected things and wearable devices OIC Structure Open Interconnect Consortium Board of Directors Funding allocation to Open Source and Standards Divisions Oversee IPR Policy & Bylaws 9 Open Source Work Group Standards Work Group Lead and oversee development of Open Source implementations of specifications and other features across multiple devices, OSs and architectures Lead and oversee development of Standards, Specifications, accompanying interoperability and certification programs and related activities. OIC Intellectual Property Rights Policy OIC is a royalty free organisation Open Source – Apache* 2.0 • Copyright & patent coverage for submitted code Standard – RANDZ • IP pool covering “Compliant Portions” of a member company’s products 10 Technology Foundation Profiles Consumer Enterprise Industrial Automotive Education Health Framework APIs Common Object Model Discovery Framework Data Transmission Device Management Security, Identity & Permissions Transports 11 LE Remote Access Cloud Data Management Schedule Aug Sep Oct Nov Dec Spec v0.5 IFA Jan CES Feb Spec v1.0 IDF Open Source Release M1 Preview 12 Open Source Release M2 Production Quality Open Source Release M3 Spec Compliant Mar Agenda Why do we need a standard connectivity framework? What is the Open Interconnect Consortium (OIC)? • • • • • Members Goals Structure Technology Schedule How can you use, participate in and join the OIC? 13 How You Can Use OIC Technology… Use the code from the open source project • Open to any individual or company • Availability will be announced soon – check www.openinterconnect.org Join as a Gold member • • • • 14 Certify spec compliant apps and devices Use OIC branding Benefit from patent pool protection Go to www.openinterconnect.org for membership agreement, etc… How You Can Participate in the OIC… Contribute code to the open source project • Open to any individual or member company Vote on open source issues • Open to any individual or member company that contributes at the required level Participate in and vote on standards development • Open to Gold and above member companies • Can also lead task groups Lead Work Groups • Open to Platinum and above member companies One Director appointed to Board by each Diamond member company • Plus, after two years, two directors elected from Platinum member companies’ nominations 15 OIC Membership Level Summary Lead Working Group Lead Task Group Vote (if contribution requirement met) & Participate Lead Working Group Lead Task Group Vote, Participate, Adopt & Certify (IP Pool) Standards ● – Included / Guaranteed ○ – Eligible, but must be elected/appointed Diamond ● ○ ○ ● ○ ○ ● Platinum ○ ○ ○ ● ○ ○ ● ○ ● ○ ● Gold Individual 16 Open Source Director Board ● Summary • Devices, apps and users need to interconnect across OSs, platforms and vendors • The Open Interconnect Consortium will deliver, via a standard and open source project, a framework to make these interconnections easy for developers and manufacturers - The right companies - The right foundation - The right technology Build it! 17 Use it! Join OIC! Call to Action • Go to www.openinterconnect.org to find out more and join OIC • Download and contribute to the open source project – preview release available soon • Use the OIC framework to deliver great D2D connectivity and new, innovative user experiences • Attend TABS003 “Building Peer to Peer Applications with the Intel® Common Connectivity Framework” to find about Intel’s peer-to-peer SDK for apps and devices (today at 1:15pm in Room 2008) • Attend TABL001 “Hands-on Lab: Introduction to the Intel® Common Connectivity Framework (Intel® CCF) SDK, APIs and Samples” (tomorrow at 9am in Room 2000) 18 Additional Sources of Information A PDF of this presentation is available from our Technical Session Catalog: www.intel.com/idfsessionsSF. This URL is also printed on the top of Session Agenda Pages in the Pocket Guide. Lots of information available at www.openinterconnect.org • Member agreements, bylaws, IPR policy, NDA • Latest news, including open source project when available Intel® Common Connectivity Framework Demos in • Tech Showcase – L1 – Intel Software & Services Pavilion • Intel Technology Zone – L2 – Booth and Stage Demos 19 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-5484725, or go to: http://www.intel.com/design/literature.htm Intel, Look Inside and the Intel logo are trademarks of Intel Corporation in the United States and other countries. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Intel is under license. *Other names and brands may be claimed as the property of others. Copyright ©2014 Intel Corporation. 20 Risk Factors The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forwardlooking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be important factors that could cause actual results to differ materially from the company’s expectations. Demand for Intel's products is highly variable and, in recent years, Intel has experienced declining orders in the traditional PC market segment. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; consumer confidence or income levels; customer acceptance of Intel’s and competitors’ products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term. Intel's gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; and product manufacturing quality/yields. Variations in gross margin may also be caused by the timing of Intel product introductions and related expenses, including marketing expenses, and Intel's ability to respond quickly to technological developments and to introduce new products or incorporate new features into existing products, which may result in restructuring and asset impairment charges. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel’s results could be affected by the timing of closing of acquisitions, divestitures and other significant transactions. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC filings. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Form 10-Q, Form 10-K and earnings release. Rev. 4/15/14 21
© Copyright 2024 ExpyDoc