DDR4: The Right Memory for Your Next Server and High-End Desktop System Geof Findley – Director Memory Enabling & Apps Engineering, Intel Corporation Becky Loop – PE Memory & Storage Architect, Intel Corporation SPCS009 Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 2 Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 3 Industries… First DDR4 Supported Platforms Intel® Xeon® Processor E5-2600 v3 product family support DDR4. Industries first enterprise system supporting DDR4. Intel® Core™ Processor Extreme Edition featuring DDR4 with Intel® Extreme Memory Profile (Intel® XMP) 2.0 support. First Desktop processor with 8 cores on the new Intel® X99 chipset based platform. Production availability Intel Xeon Processor E5-2600 v3 product family & Intel Core processor Extreme Edition is NOW!!! Memory Ecosystem ready for DDR4 on Future Intel Xeon and Intel Core Processor Extreme Editions. Inquire about DDR4 availability and pricing through your preferred memory vendor. 4 Memory Usage Roadmap for Intel® Architecture Products Desktop Mobile 5 Product Name Memory Usage Future HEDT Intel® Core™ i7-5960X processor Extreme Edition DDR4 up to 2133 + XMP 2.0 DDR4 MS 4th Generation Intel Core 4000 series DDR3/L up to 1600 DDR3 and DDR4 Entry SoC Intel® Pentium® processor J2900, Intel® Celeron® processor J1900 DDR3L up to 1333 DDR3 H-Processor Line 4th Generation Intel Core 4000H series DDR3L up to 1600 DDR4 and LPDDR3 U-Processor Line 4th Generation Intel Core 4000U series DDR3L/RS & LPDDR3 up to 1600 DDR3, DDR4 and LPDDR3 Y-Processor Line 4th Generation Intel Core 4000Y series LPDDR3 up to 1600 LPDDR3 M-Processor Line 4th Generation Intel Core 4000M series DDR3L/RS & LPDDR3 up to 1600 Entry-Processor Line Intel Pentium processor N3xxx, Intel Celeron processor N2xxx DDR3L up to 1333 DDR3 Memory Usage Roadmap for Intel® Architecture Products Product Name Memory Usage Future EX Intel® Xeon® processor E78800/4800/2800 V2 product families DDR3L up to 1600 DDR4 EP Intel Xeon processor E5-2600 v3 product family DDR4 up to 2133 TODAY DDR4 EN Intel Xeon processor E3-1200 v3 product family DDR3/L up to 1600/1333 DDR4 uServer Intel® Atom™ processor C2000 series family DDR3/L up to 1600 DDR4 Intel Atom processor Z3000 series family LPDDR3 up to 1066 & DDR3L/RS up to 1333 LPDDR3 and DDR3 Server & Workstation Tablet 6 Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 7 Memory Roadmaps 8 Technology Forecast • Mobile DRAM shipments retreated in Q1-14 - 30% of bits shipped in Q1-14 were mobile DRAM - Expected to settle at 40%-45% on annual basis • DDR4 is coming this year - Server support in 2014 (some high-end client support), client support in 2015 - Crossover with DDR3 in 2016 DRAM DRAM Title Revenue density technology forecast Market forecast Shares – bit forecast basis DRAM technology – bit basis 100% 12% 80% 15% 23% 33% 37% 42% 43% 42% 41% 60% 40% 44% 20% 49% 30% 11% 0% 9 Q1-12 Q2-12 Q3-12 Q4-12 Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 DDR4 DDR3 DDR2 Mobile Source: IHS 2010 DDR 2011 2012 SDR 2013 2014 Graphic 2015 2016 2017 2018 © 2014 IHS Density Forecast • 4Gb transition happened in 2013 - 4Gb will make >75% of bit shipments in 2014 • 8Gb die will emerge in small volume in 2014 - First products will be mobile DRAM where higher density is in great demand today - DDR4 crossover device will be 8Gb (primary DDR4 die available when DDR4 out ships DDR3 in 2016) DRAM density forecast – bit basis DRAM Revenue Market Shares DRAM density forecast – bit basis 100% 20% 13% 80% 38% 60% 75% 40% 70% 78% 78% 79% 80% 82% 80% 64% 59% 20% 0% 38% 9% 18% 26% 24% 13% 8Gb Source: IHS 85% 55% 47% Q1-12 Q2-12 Q3-12 Q4-12 Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 10 77% 4Gb 2Gb 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 1Gb 512Mb <512Mb © 2014 IHS DDR4 Transition by Segment 100% • Servers: full support in 2014 - Small DDR4 volumes in 1H 2014 – validation phase - Volumes pick up in 2H 2014 and ramp strongly in 2015 80% 60% 40% 20% Servers DDR4 Source: IHS Servers DDR3 Q4 17 Q3 17 Q2 17 Q1 17 Q4 16 Q3 16 Q2 16 Q1 16 Q4 15 Q3 15 Q2 15 Q1 15 Q4 14 Q3 14 Q2 14 0% Q1 14 % of bits shipped (DDR3 & DDR4) Servers Ultrathin Mobile DRAM Forecast Forecasty © 2014 IHS 80% - Small DDR4 penetration in 2H 2014 - Adoption ramps for Desktop and Laptops quickly in 2016 60% 40% 20% Source: IHS 11 • Desktops: minor support 2014, widespread in 2015 100% Desktops DDR4 Desktops DDR3 Q4 17 Q3 17 Q2 17 Q1 17 Q4 16 Q3 16 Q2 16 Q1 16 Q4 15 Q3 15 Q2 15 Q1 15 Q4 14 Q3 14 Q2 14 0% Q1 14 % of bits shipped (DDR3 & DDR4) Desktops Ultrathin Forecasty Mobile DRAM Forecast © 2014 IHS Mobile DRAM Forecast • LPDDR3 to grow aggressively in 2014 - Slightly more power efficient than LPDDR2 - Primary benefit is 50% increase in performance (bandwidth) • LPDDR4 spec to be finalized in 2014 - Products have already been announced by Samsung*, SK Hynix*, and Micron* - Will launch quickly as LPDDR3 is sort of a half-step technology - LPDDR4 will dominate by 2016 Low power DRAM technology forecast Percent of mobile DRAM bits shipped 100% 80% 60% 5% 5% 46% 52% 71% 60% 74% 82% 84% 40% 50% 20% 26% 19% 9% 2012 Source: IHS 33% 29% 0% 12 5% 8% 2013 2014 LP SDR & LP DDR LP DDR2 2015 LP DDR3 2016 LP DDR4 2017 Wide I/O (I & II) 11% 2018 © 2014 IHS DDR3/DDR4 Pricing DDR3 & DDR4 pricing $250 16GB RDIMM ASP $200 $150 $100 $50 $0 Q1-15 Source: IHS Q2-15 Q3-15 Q4-15 DDR3 Q1-16 Q2-16 Q3-16 Q4-16 DDR4 (High volume) Q1-17 Q2-17 Q3-17 DDR4 (Low volume) • DDR4 premium expected until early/mid 2016 • Premium to shrink from ~25% in 2014 to ~10% in 2015 - Expect 30% premium in Q3-14 • Overall strength/weakness of DRAM market could push prices higher or lower 13 Q4-17 © 2014 IHS Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 14 Advantages of DDR4 35% 10% DDR4 DDR3 DDR4 DDR3L Power Standby Current • Efficient - Up to 35% power savings compared to DDR3L • Speed – up to 100% performance boost in bandwidth in life of product • Density – 2X; 8 Gb over 4 Gb Performance % 3200Mbps 16 banks DDR4 8 banks DDR3 • Reliability: ADDR/CMD parity on DRAM Applications: High End Performance for the new 8 core Enthusiast Desktop CPU. Enterprise applications utilize lower power and enhanced RAS features to meet the increasing requirements. Networking devices need for low power and high bandwidth. 15 Power Efficiency and Speed improvements based on JEDEC defined architectural features and frequency for DDR4, they are not measured. New: Servers, Workstations with Intel® Xeon® Processor E5-2600 v3 Product Family Intel® Xeon® Processor E5-2600 v3 product family • Up to 18 cores/36 threads per socket • New Instructions • DDR4 Memory support • Integrated PCIe Express* with Atomics • IVR-enabled Platform Efficiency Intel® Platform Technologies Intel® Xeon Phi™ coprocessor Chipset Intel® SSD Data Center Family P3700; 600; 500 NVM Express* SSD Intel® Ethernet Controller XL710 Private Cloud/ Enterprise Public Cloud HPC Storage Networking and SDN Workstation Networking Enables key usage models across high growth segments DDR4 a Key Ingredient required to create optimized solutions 16 The DDR4 Difference 2200 1800 Power System Capacity 17 UP TO 40% INCREASED BANDWIDTH with 3 DPC 50% DDR4 40% DDR4 1000 DDR3 1400 % DDR3L 32GB LRDIMM ON E5-2600 v3DDR4-2133 32GB LRDIMM ON E5-2600 v2DDR3-1866 Standby Current UP TO 50% INCREASED POWER EFFICIENCY with 3 DPC Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance Source as of August 2014 TR#3044 on STREAM (triad): Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, 24x16GB DDR3-1866 @1066MHz DR-RDIMM, score: 58.9 GB/sec. New Configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, 24x16GB DDR4-2133 @ 1600MHz DR-RDIMM, score: 85.2 GB/sec. Intel Confidential — Do Not Forward 17 Why Should I Pay a Premium? For Intel® Xeon® E5 v3 DDR4 Memory vs. Intel Xeon E5 v2 with DDR3 Answer: With DDR4 you can support higher memory bandwidth with lower density DIMMs; Overall platform price impact is minimal even assuming a 30% premium for DDR4 memory INTEL® XEON® PROCESSOR E5 v3 FAMILY-BASED SERVER 8 GB 8 GB 8 GB 1 DPC (2133MHz) 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB E5-2697 v3 8 GB 8 GB 8 GB Total Estimated System Price: $12,392 11% premium vs. Intel Xeon processor Up to 18 cores vs 12 v2-based system Intel® Advanced Vector Extensions 33% increase in memory speed with DDR4-2133 vs. DDR3-1600 Headroom for future growth in memory INTEL XEON PROCESSOR E5 v2 FAMILY-BASED SERVER 1 DPC (1600MHz) 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB Total Estimated System Price: $11,152 E5-2697 v2 Additional $1.13 investment per day over 3 years requirements 18 Average system price of IBM*, HP*, Dell* systems with 2x Intel Xeon processor E5 2697 v2 cpus, 8x16GB DDR3 DIMMs, Assumes 30% premium for 8x16GB DDRR4 memory plus $200 incremental premium for Intel Xeon Processor E5 v3 cpu; Intel Confidential — Do Not Forward 18 DDR4 RDIMM / LRDIMM System-Level Portfolio on Intel® Xeon® E5-2600 v3 Processor Family Type Ranks Per DIMM and Data Width DIMM Capacity (GB) 19 DIMM Vendor SK Hynix* 8Gb SK Hynix x 8GB 4Gb Crucial* Kingston* Micron* SRx8 4GB x x x SRx4 8GB x x x x x 16GB DRx8 8GB x x x x 16GB DRx4 16GB x x x x 32GB x QRx4 32GB x x x x 64GB x RDIMM LRDIMM DIMM Capacity (GB) DIMM Vendor RCD/ DB Vendors IDT x Inphi Montage Samsung* TI DDR4 Non-ECC UDIMM Validation Results on New High End Intel® Core™ i7-59xx/58xx Listed below are the results from a small sample of DDR4 UDIMM tested on new High End Intel® Core™ i7 -59xx/5800 Series Processor. We are providing this information as a guide to module compatibility with Intel server reference platforms. This testing is not intended to replace the normal OEM qualification process. For results on specific Intel® motherboards or OEM production motherboards, please refer to the OEM's list of qualified memory suppliers. UDIMM SR/DR DDR42133 1.2V 1DIMM per channel; 1 slot per channel; 4 channels DIMM Supplier 20 Size CL Supplier Part Number Density Width Die Date Code MTA8ATF51264AZ-2G1A1 4GB 15 A Micron MT40A512M8HX-093E:A MTA16ATF1G64AZ-2G1A1 8GB 15 B Micron MT40A512M8HX-093E:A 4Gb 4Gb X8 X8 1408 Micron Crucial* CT4G4DFS8213.8FA1 4GB 15 A Micron MT40A512M8HX-093E:A 4Gb X8 1408 Crucial CT8G4DFD8213.16FA1 8GB 15 B MT40A512M8HX-093E:A 4Gb X8 1408 Samsung* Samsung M378A5143DB0-CPB 4GB 15 A Micron Samsung K4A4G085WD-BCPB M378A1G43DB0-CPB 8GB 15 B Samsung K4A4G085WD-BCPB 4Gb 4Gb X8 X8 1407 4Gb 4Gb x8 x8 1406 4Gb 4Gb x8 x8 1412 Micron New Memory added regularly Please check URL for the most up to date list * Part Number DRAM Raw Card SK Hynix* HMA451U6MFR8N-TF 4GB 15 A SK hynix H5AN4G8NMFR-TFC SK Hynix HMA41GU6MFR8N-TF 8GB 15 B SK hynix H5AN4G8NMFR-TFC Kingston* KVR21N15/4 4GB 15 A SK hynix H5AN4G8NMFR-TFC Kingston KVR21N15/8 8GB 15 B SK hynix H5AN4G8NMFR-TFC http://www.intel.com/technology/memory/ Use Memory Validated by Intel Efficient Platform Development 20 1408 1407 1406 1412 Note DRAM Comparison: Overview 21 Item DDR DDR2 DDR3 DDR4 Data Rate (Mbps) 200, 266, 333, 400 400, 533, 667, 800 800, 1067 1333, 1600, 1866 1600, 1866, 2133 2400, 2666, 3200 CL 2 / 2.5 / 3 2/3/4/5/6 5~14 9~24 BL 2/4/8 4/8 8, BC4 (fixed, on the fly) 8, BC4 (fixed, on the fly) Termination (DQ) VTT VTT VTT VDDQ VDD/VDDQ 2.5V 1.8V 1.5V/1.35V/1.25V 1.2V VREF.DQ 0.5 VDDQ 0.5 VDDQ 0.5 VDDQ internally generated (training is a must) Bank Group n/a n/a n/a 4 (x4/8), 2 (x16), 1 (x32) Bank 4 4, 8 (1Gb ~) 8 16 (x4/8), 8 (x16/32) Page Size - 1KB (x4/8), 2KB (x16) 1KB (4/x8), 2KB (x16), 4KB (x32) 1/2KB (x4) , 1KB (x8) 2KB (x16), 4KB(x32) PKG Type 66Pin TSOP-II FBGA (60/84 Ball) FBGA (78/96) FBGA (78/96) Prefetch 2 Bit 4 Bit 8 Bit 8 Bit Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 22 WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit: http://www.intel.com/consumer/game/gaming-power.htm 23 Get ready for DDR4 Overclocking! • First desktop DDR4 platform launched Aug 29th, 2014 - 2,133 MT/s is the supported frequency • Amazing overclocking results† on day-1 - Ratio based OC up to 2667 MT/s; higher with BCLK OC’ing - Up to 2,800 MT/s without voltage increase (1.2v) - Up to 3,200 MT/s and beyond today!!! • DDR4 Intel® Extreme Memory Profile 2.0 certified modules available 24 Intel® Extreme Memory Profile (Intel® XMP) † Overclocking results may vary and subject to change. Intel® Extreme Memory Profile for DDR4 Intel® Core™ i7 Processor Family for LGA 2011-v3 Quad Channel DDR4 Memory Kits • • • • 25 Performance-oriented expansion of standard DDR4 memory specification Memory DIMM kits certified for four channel mode, ensuring optimal performance Designed for ultimate flexibility with predefined and certified memory optimizations Intel “Supports” Identifier badge on memory packaging for easy identification in retail Partial list of Intel® Extreme Memory Profile (Intel® XMP) certified memory vendors. Consult motherboard manufacturers and memory vendors for Intel XMP support details. Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 26 Best Fit Memory for PC Client LPDDR3 Pros •Lowest Power •Best for SFF DDR4 •Transition inevitable •Lower Power vs. DDR3 •High Bandwidth Headroom LPDDR3 Low Power N/A High BW DDR4 LPDDR3 Cons •Limited BW Headroom •High Cost N/A N/A Low Cost DDR3 •Tech: 5yrs+, EOL? •Higher power •Limited Bandwidth Headroom DDR3L DDR4 offers High Bandwidth & Lower Power. DDR4 comes to Client next year. 27 Universal DIMM Technology Overview Value Proposition Today SODIMM and UDIMM are DDR3 or DDR4 only and footprint is not DDR3/DDR4 common Common MB for all LPDDR3 Extends LPDDR3 to DIMM form factor and DDRx memory technologies Common platform for validation and SKU management BIOS limits unsupported technologies from booting Scalability to smaller footprint than SODIMM Ecosystem Smaller DIMM supports single rank DDR3/4, full capacity LPDDR3 ISO capacity at standard SODIMM form factor Larger than memory down solutions Kingston* and Micron* are committed to support UniDIMM Reuses existing 260pin SODIMM connector, with new key SODIMM or High Capacity UniDIMM 69.6 mm x 30 mm 2088 mm2 28 UniDIMM 69.6 mm x 20 mm 1396 mm2 UniDIMM Implications across Memory Subsystem 29 Subsystem Components UniDIMM DRAM device and PHY No changes DRAM packaging No changes DIMM connector Existing form factor; new key DIMM raw card New raw card designs for all technologies Motherboard New VR solution Single MB across technologies 29 Technology Trade-offs relative to SODIMM Expertise Status Thermals/Mechanicals Same as SODIMM Signaling (max bin estimates) LP3-1867 DDP // 2133Mts DDP (QDP TBD) DDR3/DDR4 Iso Performance SODIMM Battery life DDR3/DDR4 parity SODIMM LP3 Worse than MD by 10-15% LP3 UniDIMM better than DDR3/4 SODIMM XY Form Factor 35% smaller than SODIMM (type-3) Comparable to SODIMM-VLP (type-3) ~2x bigger than 4x32 LP3 MD ~4x bigger than 2x64 LP3 MD Operating system (Chrome*, Android*, Windows* 8, iOS*) No impact. Voltage regulator cost 25¢ - 50¢ cost adder due addition of dedicated VR requirement Memory down provides unequivocally a smaller form factor, lower power, lower z-height than any DIMM. UniDIMM provides flexibility and comparable performance to SODIMM. 30 30 Agenda • Memory Roadmap for Intel® Systems • Memory Market Update • Value Proposition of DDR4 for Enterprise and HEDT • DDR4 Ecosystem • DDR4 Intel® Extreme Memory Profile (Intel® XMP) • UniDIMM • Summary 31 Summary • Memory industry is ready for Intel’s newest enterprise and client products that use DDR4 • DDR4 provides power, performance, and reliability advantages over DDR3 • Production availability of the Intel® Xeon® processor E5-2600 v3 product family & Intel® Core™ processor Extreme Edition is NOW! • Intel investigating transitional memory form factors as customer needs change 32 Call to Action • Go to the exhibit hall and see the thirteen different companies showing DDR4 enterprise and HEDT systems and products… PDF of this presentation is available from our Technical Session Catalog: www.intel.com/idfsessionsSF. The URL is on top of Session Agenda Pages in Pocket Guide. 33 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel, Core, Pentium, Celeron, Xeon, Atom, Look Inside and the Intel logo are trademarks of Intel Corporation in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright ©2014 Intel Corporation. 34 Legal Disclaimer • Processor Numbering Notice: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers • Iris™ Graphics: Iris™ graphics is available on select systems. Consult your system manufacturer. • Overclocked Memory: Warning: Altering PC memory frequency and/or voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details. • Overspeed Protection Removed: Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. • Intel® Turbo Boost Technology requires a system with Intel Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo. • Intel® Advanced Vector Extensions (Intel® AVX/ Intel®AVX2): Intel® AVX/AVX2 is designed to achieve higher throughput in certain integer and floating point operations. Depending on processor power and thermal characteristics, and system power and thermal conditions, AVX/AVX2 floating point instructions may run at lower frequency to maintain reliable operations at all times. For further details see product data sheet. 35 Risk Factors The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forwardlooking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. 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Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; consumer confidence or income levels; customer acceptance of Intel’s and competitors’ products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term. 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