ASIC design (first trial) Final mask design (Digian corp.) Chip area 2-channel iCDS 8 mm x 2.5 mm 1.5 mm x 0.5 mm Collaboration with Ikeda-sensei (JAXA) who developed ‘Open-IP’ Packaging (Steady Design corp.) bonding Bare chip 0.5 mm 1ch 2ch LSI chip 0.5 mm 8 mm 50 ｍｍ 2.5 mm 0.7 mm 50 ｍｍ Pad Result of M01 using the NeXT1 chip 24mm CCD-NeXT1 CCD-NeXT1 Pixel size # of pixels # of read-out 12 mm x 12 mm 2000 x 2004 2 M01 functioned properly in photon count mode. However, the noise level is large (55 electrons). This is due to the chip design. We are now developing new ASIC chip as the second trial. 4.8 mm
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