Dipl.-Ing. Martin Schubert

http://www.avt.et.tu-dresden.de/iavt-und-zmp/mitarbeiter/mitarbeiter-einzelseite/, Tuesday, 10. May 2016, 00:03:01
Dipl.-Ing. Martin Schubert
wiss. Mitarbeiter/-innen
Telefon: (0351) 463 42510
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Kontaktformular
Raum: GLB 7-116
Referenzen
2015
Schubert, M.; Kirsten, S.; Bock, K.
Protective Function of Polymeric Encapsulation for Long-Term Implantable Microsystems
581. WE-Heraeus Seminar on "Flexible, Stretchable and Printable High Performance Electronics", Bad Honnef
Schubert, M.; Kirsten, S.; Voitsekhivska, T.; Bock, K.
Characterization of Polymeric Encapsulation for Implantable Microsystems Applying Dynamic Fluidic and Electrical Load
38th International Spring Seminar on Electronics Technology (ISSE), pp. 129-133, DOI: 10.1109/ISSE.2015.7247976
2014
Kirsten, S.; Schubert, M.; Uhlemann, J.; Wolter, K.-J.
Characterization of Ionic Permeability and Water Vapor Transmission Rate of Polymers Used for Implantable Electronics
36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’14), pp. 6561-6554, ISSN:
978-1-4244-7929-0/14
Kirsten, S.; Schubert, M.; Braunschweig, M.; Woldt, G.; Voitsekhivska, T.; Wolter, K.-J.
Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of
materials
IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 719 - 724, doi: 10.1109/EPTC.2014.7028327
Voitsekhivska, T.; Suthau, E.; Kirsten, S.; Schubert, M.; Zorgiebel, F. ; Cuniberti, G.; Wolter, K.-J.
Package characterization of FET-based biochemical sensors
IEEE 16th Electronics Packaging Technology Conference (EPTC), Singapur, pp. 725 - 729, DOI: 10.1109/EPTC.2014.7028338
2013
Kirsten, S.; Schubert, M.; Uhlemann, J.; Wolter, K.-J.
Fluid Dynamic Load of Polymers Used as Encapsulation Material for Implantable Microsystems
Biomedical Engineering / Biomedizinische Technik, 2013, DOI: 10.1515/bmt-2013-4067