Spec Sheet PDF

Memory Module Specifications
HX424C15FBK4/64
64GB (16GB 2G x 64-Bit x 4 pcs.)
DDR4-2400
DDR4
2400 CL15 288
288-Pin
Pin DIMM
SPECIFICATIONS
CL(IDD)
15 cycles
Row Cycle Time (tRCmin)
46.75ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
29.125ns(min.)
Maximum Operating Power
TBD W*
UL Rating
94 V - 0
Operating Temperature
0o C to +85o C
Storage Temperature
-55o C to +100o C
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
HyperX HX424C15FBK4/64 is a kit of four 2G x 64-bit (16GB)
• Power Supply: VDD = 1.2V Typical
DDR4-2400 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory
• VDDQ = 1.2V Typical
module, based on sixteen 1G x 8-bit FBGA components per module.
• VPP - 2.5V Typical
Each module kit supports Intel® Extreme Memory Profiles
• VDDSPD = 2.2V to 3.6V
(Intel® XMP) 2.0. Total kit capacity is 64GB. Each module has
• Nominal and dynamic on-die termination (ODT) for
been tested to run at DDR4-2400 at a low latency timing of 15-15-15
data, strobe, and mask signals
at 1.2V. Additional timing parameters are shown in the
• Low-power auto self refresh (LPASR)
Plug-N-Play (PnP) Timing Parameters section below. The
• Data bus inversion (DBI) for data bus
JEDEC standard electrical and mechanical specifications are
• On-die VREFDQ generation and calibration
as follows:
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
JEDEC/XMP TIMING PARAMETERS
• Fly-by topology
• Terminated control command and address bus
• JEDEC/PnP:
DDR4-2400 CL15-15-15 @1.2V
• Height 1.340” (34.04mm), w/heatsink
DDR4-2133 CL14-14-14 @1.2V
•XMP Profile #1:
DDR4-2400 CL15-15-15 @1.2V
Continued >>
kingston.com/hyperx
Document No. 4807672-001.A00
03/18/16
Page 1
continued
continued
HyperX
MODULE WITH HEAT SPREADER
7.08 mm
34.04 mm
133.35 mm
MODULE DIMENSIONS
133.35
129.55
31.25
2.10±
±0.15
Pin 1
Detail A
3.35
Detail B
Pin 35
Pin 47
Detail D
Detail E
64.60
28.90
14.60
17.60
8.00
11.00
2.70±0.15
3.00
Detail C
Pin 105
Pin 117
56.10
22.95
FOR MORE INFORMATION, GO TO HYPERXGAMING.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
HyperX is a division of Kingston.
©2016 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.
Document No. 4807672-001.A00
Page 2
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