Faszination Licht
Entwicklungstrends im LED Packaging
Dr. Rafael Jordan
Business Development Team
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Agenda
• Introduction
• Hermetic Packaging
• Large Panel Packaging
• Failure Analysis
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Agenda
• Introduction
• Hermetic Packaging
• Large Panel Packaging
• Failure Analysis
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
FRAUNHOFER IZM
RESEARCH FOR TOMORROW‘S PRODUCTS
Dr. Rafael
Name Jordan
Business
Unit Photonics
Abteilung
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Overview Fraunhofer Gesellschaft
© Fraunhofer IZM
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67 institutes
23,000 employees
app. 2 billion € turnover
app. 70% contract
research
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Information Technology
Light & Surfaces
Life Sciences
Micro Electronics
Production
Defense & Security
Materials & Components
Fraunhofer IZM – Facts
Figures 2013
University Cooperation
 29.4 Mio. € turnover
 77 % contract research
 389 employees
(230 full time, 159 PhD, trainee)
Locations
 Berlin
 Oberpfaffenhofen
 Dresden
 Long term contract with Technical
University of Berlin
 Research Center Microperipheric
Technologies
 Approx. 90 additional staff
 Joint use of equipment, facilities
and infrastructure
Director
Prof. K.-D. Lang
 Material characterization
© Fraunhofer IZM
 Process evaluation
 Reliability testing
 Failure analysis
 Sample production
 Training courses
Mission Fraunhofer IZM
Bringing Microelectronics into Application
© Fraunhofer IZM
LED Packaging Tasks
Optics
Filling
Phosphor
Wire Bond
Submount
Chip
1st & 2nd Level
Underfill
Interconnect
Board
Power
E
v
i
r
o
n
m
e
n
t
Cooling
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Agenda
• Introduction
• Hermetic Packaging
• Large Panel Packaging
• Failure Analysis
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Hermetic Concept
electrical vias
electrical and thermal vias
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Silicon Substrate Wafer with TSVs
Silicon Substrate Wafer
backside view on soldering pads
Silicon Substrate Wafer
overview
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Silicon Glass Cap Wafer
Si/glass cap wafer
with tapered reflector edges
Si/glass cap wafer
overview
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Silicon Substrate
Silicon Substrate with 4
Component Positions with AuSn
Silicon Substrate with Intermediate
Glass Carrier
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Glas Cap
Top View von Glass Cap
Side View on Glas Cap
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Die and Wire Bonded LEDs
Top View Wire Bonded RGB LEDs
(one position free, e.g. for photodiode)
Side View Wire Bonded White LEDs
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Full Assembled Packages
RGB LED Package
White LED Package
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Solder Interconnection Analysis
Glas Cap on Silicon Substrate
Side View Glas Cap on Silicon Substrate
with Intermediate Glass Carrier
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Solder Interconnection Analysis
x-ray Overview
x-ray Focus
Complete void free process!
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Solder Interconnection Analysis
not remalting solder joint
for further assembly
Dielectric Layer
(no gap!)
Glas Cap on Silicon Substrate
Side View Glas Cap on Silicon Substrate
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Acknowledgements
EnLight stands for “Energy efficient &
intelligent lighting systems” and was an
EU funded and Philips Lighting coordinated
project which ran from 2011 to
2014. The consortium consisted of 27
leading European companies and
academic institutions from across the
entire lighting value chain.
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Agenda
• Introduction
• Hermetic Packaging
• Large Panel Packaging
• Failure Analysis
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
New LED Packaging Approach for
Panel Level Packaging
Lighting Panel
conventional LED packaging
?
New Packaging approach required
 Large area manufacturing
 Low cost
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Two Panel Level Packaging Concepts

Collective Transferbonding
• Wafer to Panel
• Transferbonding using temporary carrier
• Top side contact through (wire bonding) or lamination

Pick & Place and Lamination
• Chip on Panel adhesive bonding
• Top side contact through lamination
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Two Panel Level Packaging Concepts

Collective Transferbonding
• Wafer to Panel
• Transferbonding using temporary carrier
• Top side contact through (wire bonding) or lamination

Pick & Place and Lamination
• Chip on Panel adhesive bonding
• Top side contact through lamination
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Collective Transferbonding - Process Flow
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Collective Transferbonding
CarrierChips:
 118 carrier on wafer
 165 x 165 (27225 Chips on carrier)

> 3 Mio. Chips on wafer
 Chipsize 75 µm
 Chips are sticked with PI auf Carrier
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Assembly concept for small LED-Chips
 Temporarily Bonding of LEDs on Intermediate Carrier
 Handling of small Chips (70 µm edge length)
 Collective Soldering
high-precision and plane-parallel
Assembly
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Collective Transferbonding with functional LEDs
Components:
LED-Carrier
Pi-layer
FunctionalLED-Chip
with Au-metallization
PCB with Cu
structure
1.Step: stencil printing of solderpaste
(SAC)
Topview on LED Carrier
Crosssection of PCB with solder depot
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Collective Transferbonding with functional LEDs
2.Step: Alignment between PCB and LED
Carrier
3.Step: Collective Transferbonding
PCB with aligned LED Carrier
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Collective Transferbonding with functional LEDs
4.Step: vertical removing of LEDCarrier
Assembled and
wire bonded
LEDs on a PCB
5.Step: Wire bonding
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Demonstrators with functional LEDs
Serial connections of 10 blue LEDs at about 25V
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Two Panel Level Packaging Concepts

Collective Transferbonding
• Wafer to Panel
• Transferbonding using temporary carrier
• Top side contact through (wire bonding) or lamination

Pick & Place and Lamination
• Chip on Panel adhesive bonding
• Top side contact through lamination
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Panel Level Packaging Concept
LED with top and bottom contact
 pairwise connection of LEDs
and z-feedthrougs (0 Ωcontact dies) at PCB by
conductive adhesive (ICA)
and on top by copper paths
 the whole sandwich is hold
together by a polymeric
adhesive layer
Assembling on PCBs of different sizes
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Process Flow
Assembling of LEDs
Electrical Contacting
screen printing of ICA
on structured PCB
placing of adhesive layer and
copper foil on top
lamination under pressure at
elevated temperatures
placing of LEDs
and z-contacts
structuring of copper to connect
top contacts of LEDs
curing of ICA
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Placement of LEDs
LEDs > 200 µm²
Pick-and-Place
process with
high yield
ASM Siplace CA3
 High precision placement (± 15 µm)
 on large area up to 24“ x 18“ / 610 x 457 mm²
 High Speed (> 5000 c.p.h.)
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Lamination
temperature, pressure, vacuum
lamination of adhesive layer
together with structured or
unstructured copper foil
pressure
temperature
vacuum
time
laminated unstructured board
lamination cycle
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Lamination
lamination of adhesive layer
together with structured or
unstructured copper foil
low pressure
middle - optimum pressure
high pressure
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Electrical Connection
Cu-structuring using
PCB-processes
laser drilled via to LED pad
close up look to hole
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Electrical Connection
structured Cu-foil with Cu-via
to contact pad of LED
structured Cu-connection between
LED and z-feedthrough
Reliable electrical connection achieved using
PCB based processes
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Electrical Connection
 Successful proof of
technology concept
 Cost-effective PCBtechnology used
 Boards of variable sizes
can be produced easily
 Light-forming elements
(white-light converters,
lenses, diffusors ..)
can easily be added
connection in series of 30
blue LEDs
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Summary
 A new concept collective Transfer Bonding using a temporary
Carrier was developed.
 Large LED Panels can be produced by Lamination and Board
Technologies.
 Both Technologies were successfully developed for a
functional demonstrator and has potential for low cost and
large area lightning panels up to 24“ x 18“ / 610 x 457 mm²
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Acknowledgements
Results are partially achieved in the joint
project Hi-Q-LED:








OSRAM Opto Semiconductors GmbH, Regensburg
Fraunhofer IAF, Freiburg
Universität Ulm
Fraunhofer IZM, Berlin
ASEM Präzisionsautomaten GmbH, Dresden
Cerion GmbH, Minden
Fresnel Optics GmbH, Apolda
OSRAM GmbH, München
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Agenda
• Introduction
• Hermetic Packaging
• Large Panel Packaging
• Failure Analysis
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Aging of Polymers
0,18
0,18
LED reference
0,15
5h
59h
119h
269h
359h
449h
0,13
0,10
0,08
0,05
optical power [W/nm]
optical power [W/nm]
0,15
5h
59h
119h
269h
359h
449h
0,13
0,10
0,08
0,05
0,03
0,03
0,00
0,00
400
LED with polymer coated
400
600
600
wavelength [nm]
wavelength [nm]
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Aging of Polymers
442,0
442,0
441,5
LED reference
441,5
441,0
wavelength [nm]
441,0
wavelength [nm]
LED polymere coated
440,5
440,0
439,5
440,5
440,0
439,5
439,0
439,0
438,5
438,5
438,0
438,0
0
100
200
300
400
500
0
100
200
300
400
500
time [h]
time [h]
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Aging of Polymers
optical power [W/nm]
transmission [Io/Ii]
absorbance [lg(1/T)]
1,0
LED with polymer coated
0,8
0,6
emission 5h
emission 269 h
emission 509 h
transmission at 269 h
transmission at 509 h
Absorbance at 269 h
Absorbance at 509 h
0,4
0,2
0,0
410
420
430
440
450
460
470
Wellenlänge / nm
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Delamination of filling
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Delamination of filling
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Delamination of glued interface
cross section
ball bond
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Delamination of ball bond
SEM of cross section
ball bond interface
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Multiple interfaces to take care on
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Damage of die
overview
focus below epilayer
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Inhomogeneous amount of pores
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Brittle solder alloys
Pb
Sn
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Risk of the AuSn4 Phase
degradation / I/I0
1.1
1.0
0.9
0.8
B at 150°C
C at 150°C
D at 200°C
0.7
0
200
400
600
aging / h
C & D : Au80Sn20
B
: Au10Sn90
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Brittle solder alloys
Sn
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Gap inside solder interconnect
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Local overheating
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Cracks in encapsulant
Failure due to overheating:
cracks in the epoxy mold due to CTE
mismatch
laser scanning fluorescence microscopic analysis of cracks
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Cracks and collapsed pores
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik
Thank you for you Attention!
Dr. Rafael Jordan
Business Development Team
Tel.: +49 (30) 46403 - 219
[email protected]
www.izm.fraunhofer.de
Joseph Fraunhofer, (* 6. March 1787; † 7. June 1826)
Dr. Rafael Jordan, Business Development Team
© Fraunhofer IZM
Forschungsschwerpunkt
Technologien der Mikroperipherik