Fraunhofer IZM at IEEE ECTC 2016, Las Vegas, 31.5.-3.6.2016 Tuesday, May 31 PROFESSIONAL DEVELOPMENT COURSES 8:00 AM – 12:00 PM Fundamentals of electrical Design and Fabrication processes of Interposers, including their RDLs Course Leaders: I. Ndip and M. Töpper –Fraunhofer IZM Wednesday, June 1 MORNING PROGRAM SESSION 8:00 a.m. – 11:40 a.m. Session 1: Advances in Fan-Out Packaging, Room Nolita 1 10:00 AM - Foldable Fan-Out Wafer Level Packaging Tanja Braun, Stefan Raatz, Mathias Minkus, and Rolf Aschenbrenner – Fraunhofer IZM; Ruben Kahle, Leopold Georgi, Steve Voges, and Klaus-Dieter Lang – Technical University Berlin Session 2: TSV Fabrication, Characterization and Reliability, Room Nolita 2 11:15 AM - Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications Kevin Krohnert, Veronika Glaw, Gunter Engelmann, Rafael Jordan, and Karin Hauck – Fraunhofer IZM; Michael Robertson and Richard Cronin – CIP Ipswich; Oswin Ehrmann and Klaus-Dieter Lang – Technical University Berlin Session 4: Next Generation Substrates for Package Integration, Room: Mont-Royal 1 10:00 AM – Ultra-Thin Glasses and Glass Ceramics for Semiconductor Packaging Rüdiger Sprengard, Lutz Parthier, Matthias Jotz, Stefan Hermes, and Frederik Prince – Schott AG; Markus Wöhrmann and Michael Töpper – Fraunhofer IZM AFTERNOON PROGRAM SESSION 1:30 p.m. – 5:10 p.m. Session 11: Optical Interconnects & 3D Photonics, Room: Mont-Royal 2 1:55 PM - Multi-layer Electro-Optical Circuit Board Fabrication on Large Panel Henning Schröder and Christopher Frey – Fraunhofer IZM; Marcel Neitz, Christian Herbst, and Klaus-Dieter Lang – Technical University of Berlin; Simon Whalley – ILFA Industrieelektronik und Leiterplattenfertigung GmbH Thursday, June 2 AFTERNOON PROGRAM SESSION 1:30 p.m. – 5:10 p.m. Session 19: MEMS & Sensor Technologies, Room: Nolita I 3:55 p.m. – LiTaO3 Capping Technology for Wafer Level Chip Size Packaging of SAW Filters Kai Zoschke, Matthias Wegner, and Christina Lopper – Fraunhofer IZM; Matthias Klein, Richard Gruenwald, and Clemens Schoenbein – Vectron International GmbH; Klaus-Dieter Lang – Technical University of Berlin FRIDAY, June 3 MORNING PROGRAM SESSION 8:00 a.m. – 11:40 a.m. Session 29: Advanced Reliability Applications, Room: Mont-Royal 2 8:00 a.m. – Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications Hans Walter, Constanze Weber, Matthias Hutter, Marius von Dijk, and Olaf Wittler – Fraunhofer IZM; KlausDieter Lang – Fraunhofer IZM/Technical University Berlin AFTERNOON PROGRAM SESSION 1:30 p.m. – 5:10 p.m. Session 33: Advances in RF Materials & Components, Room: Nolita 3 2:20 p.m. – High-Frequency Characterization of Silicon Substrates and Through Silicon Vias Xiaomin Duan, Christian Tschoban, Ivan Ndip, and Klaus-Dieter Lang – Fraunhofer IZM; Mathias Böttcher – Fraunhofer IZM-ASSID; David Dahl and Christian Schuster – Technical University Hamburg Session 36: 3D Materials & Processing, Room: Yaletown 4 3:55 p.m. – Rapid Scan In-Situ FT-IR Curing Studies of Low-Temperature Cure Thin Film Polymer Dielectrics in the Solid State Frank Windrich – Fraunhofer IZM; Mikhail Malanin and Klaus-Jochen Eichhorn – Leibniz-Institut für Polymerforschung Dresden e.V.; Brigitte Voit – Technische Universität Dresden Co-Authored Presentations: 1. Inline Monitoring of Epoxy Molding Compound in Transfer Molding Process for Smart Power Modules Burcu Kaya and Jan-Martin Kaiser – Robert Bosch GmbH; Karl-Friedrich Becker and Tanja Braun – Fraunhofer IZM; Klaus-Dieter Lang – Technical University Berlin Interactive Presentation: Wednesday, June 1, 2:00 - 4:00 p.m. & Thursday, June 2, 9:00 - 11:00 a.m. 2. Solder Process for Fluxfree Solder Paste Applications Alexander Hanss and Gordon Elger – Technische Hochschule Ingolstadt; Matthias Hutter – Fraunhofer IZM; Jorg Trodler – Heraeus Deutschland GmbH & Co. KG Session 10: Novel Interconnect Materials, Room Mont-Royal 1 Wednesday, June 1, 1:30-5:10 p.m., 4:20 PM
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