Power Devices Intelligent Power Modules CONTENTS ■IGBT-IPM ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ www.rohm.com P. B12 B Intelligent Power Modules ■MOS-IPM P. B12 Power Devices Intelligent Power Modules ▶ Intelligent Power Modules Intelligent Power Modules ●Quick Reference for Intelligent Power Modules IGBT-IPM Low Speed Switching Type less than 6kHz VDSS / VCES （V） MOS-IPM High Speed Switching Type less than 20kHz ID / IC （A） HSDIP25 600 HSDIP25-VC 10 ☆BM63363S-VA ☆BM63763S-VA − 15 ☆BM63364S-VA ☆BM63364S-VC ☆BM63764S-VA ☆BM65364S-VA 20 − BM63165S-VA − ☆：Under development Intelligent Power Modules IGBT-IPM Part no. Power Device VCES (V) IC (A) Vce(sat) (V) Recomended Switching Frequency (kHz) Isolation Voltage ＊ (Vrms) Package BM63165S-VA IGBT 600 20 1.6 less than 20 1500 ☆BM63363S-VA IGBT 600 10 1.5 less than 6 1500 HSDIP25 ☆BM63763S-VA IGBT 600 10 1.7 less than 20 1500 HSDIP25 ☆BM63364S-VA IGBT 600 15 1.5 less than 6 1500 HSDIP25 ☆BM63364S-VC IGBT 600 15 1.5 less than 6 1500 HSDIP25VC ☆BM63764S-VA IGBT 600 15 1.7 less than 20 1500 HSDIP25 Power Device VCES (V) IC (A) Ron (mΩ) Recomended Switching Frequency (kHz) Isolation Voltage ＊ (Vrms) MOSFET 600 15 120 less than 20 1500 HSDIP25 MOS-IPM Part no. ☆BM65364S-VA Package HSDIP25 ＊：AC 60Hz, 1 minutes, Corresponds to isolation voltage 2500Vrms in the case the convex-shaped heat sink. ☆：Under development ●Block Diagram IGBT-IPM VBU 2 Bootstrap Diode B VBV 3 VBW 4 ･Fast Recovery Diodes High Side Gate Driver (HVIC) 24 P HVIC ( High-side Gate Driver ) 23 U ･Current limiter function for bootstrap diode ･UVLO for floating supply 22 V HINV 6 HINW 7 Inverter Part (IGBT and FWD) 21 W HVCC 8 LVIC( Low-side Gate Driver) GND 9 ･Low Loss Field Stop Trench IGBTs LINU 10 ･UVLO, SCP, TSD LINV 11 20 NU ･Ultra Low VF Fast Recovery Diodes LINW 12 ･Fault signal output LVCC 13 Low Side Gate Driver (LVIC) FO 14 19 NV Protect Circuit UVLO : Under Voltage Lock Out SCP : Short Circuit Protection TSD : Thermal Shut Down CIN 15 GND 16 18 NW ●Packages 14×2.54(=35.56) 0.42 (3.3) 0.42 HEAT SINK SIDE 1.5MIN 0.5 0.5 0.5 (1.2) (2.656) (1.2) (2.756) HEAT SINK SIDE DETAIL B DETAIL A B M 6 3 3 6 4 S Package S B12 (3.5) 14×2.54(=35.56) 0.5 ●Part No. Explanation Part No. 33.7±0.5 8−0.6 HSDIP25 HSDIP25VC -xx Packaging and forming specification VA VC (1.2) (2.656) 5.5±0.5 HEAT SINK SIDE 0.8 2.5MIN 0.5 0.5 (0∼5° ) 0.5 14±0.5 0.5 0.28 2.54±0.2 4−C1.2 Tube, Long pin type (HSDIP25) Tube, Staggered type (control side)(HSDIP25VC) www.rohm.com (0∼5° ) (0∼5° ) 1.5MIN Type name Lot No. 3MIN 1.5±0.05 B 0.42 HEAT SINK SIDE 24±0.5 0.8 2−R1.6 Specular surface finish 29.2±0.5 14.4±0.5 18.9±0.5 14.4±0.5 0.28 2.54±0.2 3.5±0.25 16−0.5 8.0 0.42 4−C1.2 8−0.6 A 35.0±0.3 9.5±0.5 Specular surface finish 0.28 1.778±0.2 5.5±0.5 Type name Lot No. 3MIN B 8.0 24±0.5 8 2−R1.6 1.5±0.05 20×1.778(=35.56) (3.3) 1.778±0.2 16−0.5 (3.5) 0.28 3.8±0.5 3.5±0.25 0.42 35±0.3 HSDIP25VC A 29.4±0.5 3.8±0.5 20×1.778(=35.56) 14.4±0.5 14.4±0.5 HSDIP25 8 Intelligent Power Modules HINU 5 (1.2) (2.756) DETAIL A DETAIL B
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