Ref No. C262-ELF12-009
Date. July 10,2012
Messrs. VALUED CUSTOMER
SUBJECT : Addition of the factory for Chip Inductor
(LQP03_02 series)
Dear valued customer,
thank you very much for your patronage on our products.
We would like to inform you that we will add a new factory (Okayama Murata Manufacturing Co., LTD.),
in Japan to support the delivery of LQP03_02 series.
1. Applicable Products
- LQP03_02 series
Please refer Applicable Products List.
2. Contents of change
New factory is added.
The present production factory
Fukui Murata Manufacturing co.,ltd.
The production factory after change
Fukui Murata Manufacturing co.,ltd.
Okayama Murata Manufacturing co., ltd.
3. Reason for addition
In order to satisfy our customers for the delivery, we would like to start production of LQP03_02
series also in Okayama Murata.
4.The date of starting production by the additional factory
From 1st Nov,2012 onwards
5. Quality
The additional factory has already been certified to ISO9001 and ISO/TS16949.
All the materials, manufacturing equipments, and manufacturing processes, inspections and
specifications of additional factory are exactly same as the present factory.
6. Request to you
We start supplying Okayama Murata factory’s product from 1st Nov 2012..
Please review above and return this letter with your signature or company seal to us
by Oct.,31,2012.
If you have any special inquiry and/or questions, please feel free to contact with us.
If we do not receive any reply or requests from you by Oct.,31.2012, we will proceed
this change.
Thank you very much for your cooperation and understanding in this matter.
Yours faithfully.
The notification for the acceptance
Date：
Company：
Signature：
Comment：
H.Yamada/Manager
Product Engineering Sec.3 EMI Filter Division
Murata Manufacturing Co., Ltd.
Reliability Comparison Data of Chip inductor （LQP03_02 series)
添付資料
Appendix
弊社品番/　LQP03TN56NJ02_
Murata Part No./　LQP03TN56NJ02_
試験項目、条件
Testing Item、Condition
サンプル数
Sample Size
1．初期値/Initial
評価項目
Confirmed Item
L寸法/Dimension L(mm)
W寸法/Dimension W(mm)
10
T寸法/Dimension T(mm)
インダクタンス/Inductance(nH)
(at 300MHz)
Q
10
直流抵抗/DC Resistance(Ω)
自己共振周波数/
Self Resonant Frequency (MHz
min)
10
3. 基板たわみ/Bending Test
試験基板/Substrate:Glass-epoxy substrate
加圧速度/Speed of Applying Force:1mm /s
たわみ量/Deflection:1mm
保持時間/Hold Duration:30 s
10
4. 耐振性/Vibration
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
5. はんだ付け性/Solderability
外観/Appearance
7．耐熱性/Heat Resistance
温度/Temperature : 125±2°C
時間/Time : 1000h(+48h,-0h)
8．耐寒性/Cold Resistance
温度/Temperature : -55±3°C
時間/Time : 1000h(+48h,-0h)
9．耐湿性/Humidity
温度/Temperature : 40±2°C
湿度/Humidity : 90 to 95%(RH)
時間/Time : 1000h(+48h,-0h)
10．温度ｻｲｸﾙ/Temperature Cycle
1) -55 °C±2°C/ 30 min.±3min. 2） Ordinary temp./10-15 min.
3) -125°C±3°C/ 30 min.±2min.　4) Ordinary temp./ 10-15 min.
回数/Total of Cycles :10cycles
0.604
0.61
0.60
0.002
0.287
0.29
0.29
0.002
0.294
0.30
0.29
0.004
55.37
55.7
54.8
0.28
12.91
13.13
12.71
0.118
2.97
3.13
2.77
0.092
1829
1860
1800
20.8
OK
OK
判定
0.6± 0.03 mm
OK
0.3± 0.03 mm
OK
0.3± 0.03 mm
OK
56nH ± 5%
OK
9 MIN
OK
3.90Ω MAX
OK
1200MHz MIN.
OK
OK
No damaged
OK
OK
No damaged
OK
OK
OK
No damaged
OK
AVG
MAX
1.06%
1.37%
1.03%
1.53%
Within ±10%
OK
MIN
0.82%
0.33%
The electrode
shall be at least
90% covered
with　new solder
coating.
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
予熱/Pre-Heating : 150℃ 60 to 90 sec.
はんだ/Solder : Sn-3.0Ag-0.5Cu
はんだ温度/Solder Temperature : 240±5℃
浸せき時間/Immersion Time : 3±1s
6. はんだ耐熱性/Resistance to Soldering Heat
0.605
0.61
0.60
0.002
0.288
0.29
0.28
0.002
0.292
0.30
0.29
0.004
55.46
56.2
54.5
0.54
12.80
12.96
12.59
0.129
3.02
3.20
2.82
0.144
1820
1840
1800
21.6
判定値
Acceptance Value OK/NG
外観/Appearance
振動周波数/Oscillation Frequency: 10 to 2000 to 10Hz for
20minutes
加速度または振幅/Total amplitude: 1.5mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
試験時間/Testing Time: A period of 2 hours in each of 3 Mutually
perpendicular deirections (Total 6hours)
予熱/Pre-Heating : 150±10℃ 60 to 90 s
はんだ/Solder : Sn-3.0Ag-0.7Cu
はんだ温度/Solder Temperature : 260±5℃
浸せき時間/Immersion Time : 5±1s
変更後
New Factory
外観/Appearance
2.　電極固着力/ Bonding Strength
加圧力/Applying Force = 2.0N
加圧時間/Pressuring time = 5±1s
加圧方向/Applied direction : Parallel to the substrate
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
現行
Current Factory
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
OK
OK
OK
OK
0.63%
1.21%
-0.65%
OK
2.13%
3.34%
1.41%
OK
-0.18%
0.50%
-0.95%
OK
1.90%
2.74%
1.35%
OK
-0.15%
0.18%
-0.47%
1.12%
1.36%
0.96%
OK
0.26%
0.85%
-0.21%
OK
-0.34%
0.00%
-0.82%
OK
0.24%
1.69%
-0.57%
OK
0.01%
0.57%
-0.53%
Reliability Comparison Data of Chip inductor （LQP03_02 series)
添付資料
Appendix
弊社品番/　LQP03TN27NH02_
Murata Part No./　LQP03TN27NH02_
試験項目、条件
Testing Item、Condition
サンプル数
Sample Size
1．初期値/Initial
評価項目
Confirmed Item
L寸法/Dimension L(mm)
W寸法/Dimension W(mm)
10
T寸法/Dimension T(mm)
インダクタンス/Inductance(nH)
(at 500MHz)
Q
10
直流抵抗/DC Resistance(Ω)
自己共振周波数/
Self Resonant Frequency (MHz
min)
10
3. 基板たわみ/Bending Test
試験基板/Substrate:Glass-epoxy substrate
加圧速度/Speed of Applying Force:1mm /s
たわみ量/Deflection:1mm
保持時間/Hold Duration:30 s
10
4. 耐振性/Vibration
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
5. はんだ付け性/Solderability
外観/Appearance
AVG
MAX
MIN
予熱/Pre-Heating : 150℃ 60 to 90 sec.
はんだ/Solder : Sn-3.0Ag-0.5Cu
はんだ温度/Solder Temperature : 240±5℃
浸せき時間/Immersion Time : 3±1s
6. はんだ耐熱性/Resistance to Soldering Heat
7．耐熱性/Heat Resistance
温度/Temperature : 125±2°C
時間/Time : 1000h(+48h,-0h)
8．耐寒性/Cold Resistance
温度/Temperature : -55±3°C
時間/Time : 1000h(+48h,-0h)
9．耐湿性/Humidity
温度/Temperature : 40±2°C
湿度/Humidity : 90 to 95%(RH)
時間/Time : 1000h(+48h,-0h)
10．温度ｻｲｸﾙ/Temperature Cycle
1) -55 °C±2°C/ 30 min.±3min. 2） Ordinary temp./10-15 min.
3) -125°C±3°C/ 30 min.±2min.　4) Ordinary temp./ 10-15 min.
回数/Total of Cycles :10cycles
0.609
0.61
0.60
0.003
0.291
0.29
0.29
0.002
0.294
0.30
0.28
0.005
26.79
27.1
26.3
0.22
17.17
17.83
16.85
0.299
1.71
1.84
1.60
0.073
2748
2790
2710
20.0
0.608
0.61
0.61
0.002
0.291
0.29
0.29
0.002
0.291
0.30
0.28
0.003
26.58
26.9
26.1
0.25
16.99
17.87
16.37
0.484
1.63
1.70
1.54
0.051
2761
2780
2730
17.9
OK
OK
判定値
判定
Acceptance Value OK/NG
0.6± 0.03 mm
OK
0.3± 0.03 mm
OK
0.3± 0.03 mm
OK
27nH ± 3%
OK
12 MIN
OK
2.30 Ω MAX
OK
2000MHz MIN.
OK
OK
No damaged
OK
OK
No damaged
OK
外観/Appearance
振動周波数/Oscillation Frequency: 10 to 2000 to 10Hz for
20minutes
加速度または振幅/Total amplitude: 1.5mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
試験時間/Testing Time: A period of 2 hours in each of 3 Mutually
perpendicular deirections (Total 6hours)
予熱/Pre-Heating : 150±10℃ 60 to 90 s
はんだ/Solder : Sn-3.0Ag-0.7Cu
はんだ温度/Solder Temperature : 260±5℃
浸せき時間/Immersion Time : 5±1s
変更後
New Factory
外観/Appearance
2.　電極固着力/ Bonding Strength
加圧力/Applying Force = 2.0N
加圧時間/Pressuring time = 5±1s
加圧方向/Applied direction : Parallel to the substrate
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
現行
Current Factory
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
OK
OK
No damaged
OK
0.90%
1.05%
1.01%
1.02%
Within ±10%
OK
2.43%
0.98%
The electrode
shall be at least
90% covered
with　new solder
coating.
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
OK
OK
OK
OK
0.71%
1.16%
0.57%
OK
-1.07%
-0.47%
-1.48%
OK
0.62%
0.96%
0.46%
OK
-1.19%
-0.67%
-1.86%
OK
0.54%
0.97%
0.18%
1.08%
1.29%
0.85%
OK
-1.21%
-0.97%
-1.52%
OK
0.51%
0.65%
0.40%
OK
-0.73%
-0.39%
-1.21%
OK
0.43%
0.67%
0.20%
Reliability Comparison Data of Chip inductor （LQP03_02 series)
添付資料
Appendix
弊社品番/　LQP03TN0N6B02_
Murata Part No./　LQP03TN0N6B02_
試験項目、条件
ｚ
サンプル数
Sample Size
1．初期値/Initial
評価項目
Confirmed Item
L寸法/Dimension L(mm)
W寸法/Dimension W(mm)
10
T寸法/Dimension T(mm)
インダクタンス/Inductance(nH)
(at 500MHz)
Q
10
直流抵抗/DC Resistance(Ω)
自己共振周波数/
Self Resonant Frequency (MHz
min)
10
3. 基板たわみ/Bending Test
試験基板/Substrate:Glass-epoxy substrate
加圧速度/Speed of Applying Force:1mm /s
たわみ量/Deflection:1mm
保持時間/Hold Duration:30 s
10
4. 耐振性/Vibration
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
5. はんだ付け性/Solderability
外観/Appearance
AVG
MAX
MIN
予熱/Pre-Heating : 150℃ 60 to 90 sec.
はんだ/Solder : Sn-3.0Ag-0.5Cu
はんだ温度/Solder Temperature : 240±5℃
浸せき時間/Immersion Time : 3±1s
6. はんだ耐熱性/Resistance to Soldering Heat
7．耐熱性/Heat Resistance
温度/Temperature : 125±2°C
時間/Time : 1000h(+48h,-0h)
8．耐寒性/Cold Resistance
温度/Temperature : -55±3°C
時間/Time : 1000h(+48h,-0h)
9．耐湿性/Humidity
温度/Temperature : 40±2°C
湿度/Humidity : 90 to 95%(RH)
時間/Time : 1000h(+48h,-0h)
10．温度ｻｲｸﾙ/Temperature Cycle
1) -55 °C±2°C/ 30 min.±3min. 2） Ordinary temp./10-15 min.
3) -125°C±3°C/ 30 min.±2min.　4) Ordinary temp./ 10-15 min.
回数/Total of Cycles :10cycles
0.609
0.61
0.61
0.002
0.291
0.29
0.29
0.001
0.292
0.30
0.29
0.003
0.608
0.614
0.601
0.004
64.57
87.34
50.78
10.89
0.015
0.021
0.010
0.0036
20000 and over
20000 and over
20000 and over
-
0.609
0.61
0.61
0.002
0.293
0.30
0.29
0.002
0.290
0.29
0.29
0.002
0.608
0.614
0.598
0.005
44.34
56.39
20.97
10.64
0.014
0.018
0.010
0.0026
20000 and over
20000 and over
20000 and over
-
OK
OK
判定値
判定
Acceptance Value OK/NG
0.6± 0.03 mm
OK
0.3± 0.03 mm
OK
0.3± 0.03 mm
OK
0.6 ± 0.1nH
OK
14 MIN
OK
0.07 Ω MAX
OK
6000MHz MIN.
OK
OK
No damaged
OK
OK
No damaged
OK
外観/Appearance
振動周波数/Oscillation Frequency: 10 to 2000 to 10Hz for
20minutes
加速度または振幅/Total amplitude: 1.5mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
試験時間/Testing Time: A period of 2 hours in each of 3 Mutually
perpendicular deirections (Total 6hours)
予熱/Pre-Heating : 150±10℃ 60 to 90 s
はんだ/Solder : Sn-3.0Ag-0.7Cu
はんだ温度/Solder Temperature : 260±5℃
浸せき時間/Immersion Time : 5±1s
変更後
New Factory
外観/Appearance
2.　電極固着力/ Bonding Strength
加圧力/Applying Force = 2.0N
加圧時間/Pressuring time = 5±1s
加圧方向/Applied direction : Parallel to the substrate
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
AVG
MAX
MIN
σ
現行
Current Factory
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
外観/Appearance
インダクタンス変化率/
Inductance Change
(at 100 MHz)
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
AVG
MAX
MIN
OK
OK
No damaged
OK
0.33%
1.32%
0.32%
1.48%
Within ±10%
OK
-0.77%
-0.31%
The electrode
shall be at least
90% covered
with　new solder
coating.
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
No damaged
OK
Within ±10%
OK
OK
OK
OK
OK
0.29%
0.96%
-0.82%
OK
-0.99%
0.15%
-2.55%
OK
-1.08%
0.45%
-4.77%
OK
-1.2%
1.2%
-2.8%
OK
-0.47%
1.04%
-4.02%
0.52%
1.08%
-1.22%
OK
-1.02%
0.02%
-2.11%
OK
-1.19%
0.83%
-4.12%
OK
-0.74%
1.90%
-2.03%
OK
-1.47%
1.02%
-4.49%
Parts Number
LQP03TN0N6B02D
LQP03TN0N6C02D
LQP03TN0N7B02D
LQP03TN0N7C02D
LQP03TN0N8B02D
LQP03TN0N8C02D
LQP03TN0N9B02D
LQP03TN0N9C02D
LQP03TN1N0B02D
LQP03TN1N0C02D
LQP03TN1N1B02D
LQP03TN1N1C02D
LQP03TN1N2B02D
LQP03TN1N2C02D
LQP03TN1N3B02D
LQP03TN1N3C02D
LQP03TN1N4B02D
LQP03TN1N4C02D
LQP03TN1N5B02D
LQP03TN1N5C02D
LQP03TN1N6B02D
LQP03TN1N6C02D
LQP03TN1N7B02D
LQP03TN1N7C02D
LQP03TN1N8B02D
LQP03TN1N8C02D
LQP03TN1N9B02D
LQP03TN1N9C02D
LQP03TN2N0B02D
LQP03TN2N0C02D
LQP03TN2N1B02D
LQP03TN2N1C02D
LQP03TN2N2B02D
LQP03TN2N2C02D
LQP03TN2N3B02D
LQP03TN2N3C02D
LQP03TN2N4B02D
LQP03TN2N5B02D
LQP03TN2N5C02D
LQP03TN2N6B02D
LQP03TN2N6C02D
LQP03TN2N7B02D
LQP03TN2N7C02D
LQP03TN2N8B02D
LQP03TN2N8C02D
LQP03TN2N9B02D
LQP03TN2N9C02D
Inductance
Tol.
(nH)
0,6
0,6
0,7
0,7
0,8
0,8
0,9
0,9
1
1
1,1
1,1
1,2
1,2
1,3
1,3
1,4
1,4
1,5
1,5
1,6
1,6
1,7
1,7
1,8
1,8
1,9
1,9
2
2
2,1
2,1
2,2
2,2
2,3
2,3
2,4
2,5
2,5
2,6
2,6
2,7
2,7
2,8
2,8
2,9
2,9
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
Q
(min)
Rdc
SRF
Rated Current
(ohm Max.) (MHz Min.) (mA)
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
0,07
0,07
0,08
0,08
0,08
0,08
0,1
0,1
0,1
0,1
0,1
0,1
0,1
0,1
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,15
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
0,2
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
850
850
800
800
800
800
750
750
750
750
750
750
750
750
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
500
500
500
500
500
500
Parts Number
LQP03TN3N0B02D
LQP03TN3N0C02D
LQP03TN3N1B02D
LQP03TN3N1C02D
LQP03TN3N2B02D
LQP03TN3N2C02D
LQP03TN3N3B02D
LQP03TN3N3C02D
LQP03TN3N4B02D
LQP03TN3N4C02D
LQP03TN3N5B02D
LQP03TN3N5C02D
LQP03TN3N6B02D
LQP03TN3N6C02D
LQP03TN3N7B02D
LQP03TN3N7C02D
LQP03TN3N8B02D
LQP03TN3N8C02D
LQP03TN3N9B02D
LQP03TN3N9C02D
LQP03TN4N3H02D
LQP03TN4N3J02D
LQP03TN4N7H02D
LQP03TN4N7J02D
LQP03TN5N1H02D
LQP03TN5N1J02D
LQP03TN5N6H02D
LQP03TN5N6J02D
LQP03TN6N2H02D
LQP03TN6N2J02D
LQP03TN6N8H02D
LQP03TN6N8J02D
LQP03TN7N5H02D
LQP03TN7N5J02D
LQP03TN8N2H02D
LQP03TN8N2J02D
LQP03TN9N1H02D
LQP03TN9N1J02D
LQP03TN10NH02D
LQP03TN10NJ02D
LQP03TN12NH02D
LQP03TN12NJ02D
LQP03TN15NH02D
LQP03TN15NJ02D
LQP03TN18NH02D
LQP03TN18NJ02D
LQP03TN22NH02D
Inductance
Tol.
(nH)
3
3
3,1
3,1
3,2
3,2
3,3
3,3
3,4
3,4
3,5
3,5
3,6
3,6
3,7
3,7
3,8
3,8
3,9
3,9
4,3
4,3
4,7
4,7
5,1
5,1
5,6
5,6
6,2
6,2
6,8
6,8
7,5
7,5
8,2
8,2
9,1
9,1
10
10
12
12
15
15
18
18
22
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐0.1nH
+/‐0.2nH
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
+/‐5%
+/‐3%
Q
(min)
Rdc
SRF
Rated Current
(ohm Max.) (MHz Min.) (mA)
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
12
12
12
12
12
12
12
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,25
0,3
0,3
0,3
0,3
0,3
0,3
0,3
0,3
0,4
0,4
0,4
0,4
0,4
0,4
0,4
0,4
0,6
0,6
0,6
0,6
0,6
0,6
0,7
0,7
0,7
0,7
0,7
0,7
0,7
0,7
0,7
0,7
0,8
0,8
1,9
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
5700
5700
5300
5300
4400
4400
4200
4200
4000
4000
4000
4000
3900
3900
3700
3700
3600
3600
3300
3300
3200
3200
2900
2900
2600
2600
2200
2200
2200
450
450
450
450
450
450
450
450
450
450
450
450
400
400
400
400
400
400
400
400
350
350
350
350
350
350
350
350
300
300
300
300
300
300
250
250
250
250
250
250
250
250
250
250
200
200
150
Parts Number
LQP03TN22NJ02D
LQP03TN27NH02D
LQP03TN27NJ02D
LQP03TN33NJ02D
LQP03TN39NJ02D
LQP03TN47NJ02D
LQP03TN56NJ02D
LQP03TN68NJ02D
LQP03TN82NJ02D
LQP03TNR10J02D
LQP03TNR12J02D
Inductance
Tol.
(nH)
22
27
27
33
39
47
56
68
82
100
120
+/‐5%
+/‐3%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
+/‐5%
Q
(min)
Rdc
SRF
Rated Current
(ohm Max.) (MHz Min.) (mA)
12
12
12
9
9
9
9
8
8
8
8
1,9
2,3
2,3
2,95
3
3,6
3,9
8
10
10
12
2200
2000
2000
1700
1500
1300
1200
1100
1000
900
800
150
140
140
120
120
100
100
50
50
40
40