CSP-BGAパッケージ用封止材料
Encapsulation Material for CSP-BGA Package
Epoxy Molding Compound
KMC-2520L Series
KMC-2800 Series
B Stage Die Attach Material
SFX-513 Series
MSL：Level 1 Pass + 低反り 可能
B stage 材料 特長（Feature of SFX-513 series）
B Stage curable
Prevent
Bleed, Die shift
Low modulus, High adhesion
Low Warpage
High reliability
Stable B Stage
6 month at 25õ
0.3
absorption ratio(%)
85℃/85%RH Moisture
推奨EMCタイプ（Recommend EMC type)
KMC-2520L
Series
0.2
KMC-2800
Series
0.1
0
10
20
30
40
50
Die Possession Ratio in Package(vol%)
お問い合わせ先:信越化学工業株式会社 電子材料事業本部 有機材料部
Contact:Shin-Etsu Chemical Co.,Ltd. Electronics Materials Division, Organic Electronics Materials Dept.
TEL.03-3246-5231 FAX.03-3246-5367

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