Signaling ソリューション概要(196KB, PDF*) - Hewlett Packard

Signalingソリューション
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Protocol変換gateway機能
HP OpenCall製品群のUSP-M(Universal Signaling Platform)とOC Diameter、またそれらが提供するSS7とDiameterのAPIを利用した
ゲートウェイ機能を開発することで、DiameterとSS7の相互変換を行うIWFを提供可能です。
IWF Diameter-SS7
ゲートウェイ機能
(C言語、C++言語、ないしJavaによる開発)
HSS
USP-M
OC Diameter
Diameter
DRA
Diameter
Client
API (Diameter)
API (SS7)
Sh,Cx,Ro,Rf
TCAP
Diameter
IP
2
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
SS7
SCCP
M3UA
SCTP
HLR
SCTP
IP
Client
Wi-Fi EAP-SIM/AKA認証用MAP-GW
3
WLAN
UE
Wi-Fi AP
RADIUS
MAPGW
Wi-Fi UE
Wi-Fi AP
Authentication app
Interworking app
(802.1x)
RADIUS
RADIUS
UDP
IP
UDP
IP
MAPGW
RADIUS Adapter
UDP
IP
UDP
IP
MAP
RADIUS TCAP
Adapter
SCCP
M3UA
UDP SCTP
IP
IP
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
SGW
SCCP
M3UA
SCTP
IP
HLR
MAP
TCAP
SCCP
M3UA
SCTP
IP
SMSトラフィックのoff loading
Queue
HLR/VLR
MAP
MAP
SMSC
SMPP
ESME
SS7
MS
MSC
MAP
MAP
MAP
Direct Messaging
Platform
擬似
MSC
擬似
HLR
4
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
直接
送信
ESME
SMPP
UCP
CIMD2
など
(E-mail 通知
Serviceなど)