Fuji Electric The GreenPACK Innovating Energy Technology The innovative package technology Ultra compact Size down by 50% 2-Pack New structure: Thermal impedance -50% Power cycling lifetime: 20 x higher 1010 10 8 Number of Cycles 10 9 Conventional structure New structure Tj,min=25°C Current structure Tj,min = 25°C Tj,max=125°C New structure Power circuit board Silicone gel F(t)=1% line Al wirebond Power chip 107 Terminal DCB-substrate Solder 10 Duty: 1sec ON/9sec OFF 6 Cu-baseplate Tj D Tj 105 TC 1sec Terminal High temperature epoxy resin Power chip Cu-pins Nano-metal-joint Si3N4 substrate Thick Cu-block 9sec 104 10 20 30 40 50 60 80 100 150 175 200 D Tj[°C] Low leakage inductance: <15nH Easy paralleling Modular drive concept Lower junction temperature 160 150 Comparison of junction temperature Conventional packages The GreenPACK 152.9 Test conditions: IC = 84.9 Arms VCC= 600 V Tf = 90°C Tj [°C] 140 130 137.2 130.7 130.6 125.1 120 110 125.1 117.0 113.2 109.5 106.1 100 103.2 97.3 90 80 IGBT FWD Device 7MBR 100VJC-120-50 Chip size ratio Power cycling lifetime [cyc] (at Tj,min=25°C) IGBT FWD 2MBi 100VA-120 IGBT FWD 2MBi 75VA-120 IGBT FWD V-IGBT & V-FWD IGBT FWD RC-IGBT IGBT FWD SiC-Hybrid 100% 100% 75% 75% 75% 75% 1x107 2x107 1x106 5x108 >109 >1010
© Copyright 2024 ExpyDoc