LEONI 10/2014 Ready for NEXT generation SFP+ copper cable assemblies ■■ Industry leading NEXT and insertion loss performance The LEONI SFP+ cable assemblies are designed for the next-generation Small Form Factor Pluggable plus (SFP+) I/O interconnect, which minimises size, cost-, and power of network ports used in high density data center and high performance computing environments. Network protocols such as 10 Gb/s Ethernet, 8,5 GBd Fibre Channel and 10 Gb/s Fibre Channel are all supported with ■■ Supporting 10 Gb/s over 7 m the SFP+ products. The unique SFP+ plug design's key feature is a completely EMI optimised die cast housing with no ■■ Excellent EMIscreening open and/or emitting areas and EMI spring fingers which are firmly attached to the back shell. The inner and outer crimp rings provide electro-mechanical robustness with 360 degree braid and shield contact, superior cable retention performance and elimination of conductor pistoning. ■■ Strain relief of minimum 250 N The SFP+ assemblies are constructed with ParaLink copper cables using the LEONIzell dielectric technology. This dielectric technology enables the cable’s outer dimension to be reduced to a ■■ Connector designed for one-hand operation diameter of 3,5 mm for the 32 AWG assembly, enabling optimum flexure performance over a small bending radius, while maintaining up to a 10 percent lower insertion loss than the industry average. All cable assemblies are available with an outer jacket of either halogen or lead-free proprietary elastomer, which is certified according to UL 13 CL2 in compliance with CSA FT4. Part Number L45593 - C100 - A70 Length Conductor m AWG 7 24 L45593 - C100 - A50 5 24 L45593 - C100 - D30 3 30 L45593 - C100 - D20 2 30 L45593 - C100 - D10 1 30 L45593 - C100 - D 5 30 0,5 LEONI Special Cables GmbH Business Unit Telecommunication Systems Phone +49 (0)4491-291-5060 · [email protected] · www.leoni-telecom.com China contact information: LEONI Cable (China) Co., Ltd., Shanghai, Phone +86 (0)21-623 75 569
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