S P E C I F I C A T I O N S Headquarters X-Ray & Imaging System X-ray Source 130 kV max (User adjustable for thinner/thicker PCBAs) Image Resolutions 7 µm,10 µm,15 µm, 20 µm (digital zoom to 5 µm) .................................................................................................................................................................................................................................................................................................................................. 7F., No.45, Dexing West Rd., Shilin Dist., Taipei City 11158, Taiwan TEL: +886-2-2832-8918 FAX: +886-2-2831-0567 E-Mail: [email protected] http://www.tri.com.tw Linkou, Taiwan Inspection Functions Component Level Defects Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity & Skew .................................................................................................................................................................................................................................................................................................................................. Joint Level DefectsInsufficient/Excess Solder, Short, Open, Solder Ball, Non-wetting, Void & Lifted Lead No.256, Huaya 2nd Rd., Guishan Shiang, Taoyuan County 33383, Taiwan TEL: +886-2-2832-8918 FAX: +886-3-328-6579 Hsinchu, Taiwan X-Y Table & Control High-precision ball screw/servo motor with DSP-based motion controller .................................................................................................................................................................................................................................................................................................................................. X-Y Axis Resolution 1 μm PCB & Conveyor System Shenzhen, China Min. PCB Size 50 x 50 mm (1.97 x 1.97 in.) Max. PCB Size 1000 x 660 mm (39.3 x 26.0 in.) PCB Thickness 0.6 - 7 mm PCB Transport Height 880 - 970 mm (34.6 - 38.2 in.)* Max. PCB Weight 12 kg (15 kg optional) PCB Carrier/Fixing Motor Driven/Clamping Clearance Top 20 μm 15 μm 10 μm 50 mm (1.97 in.) 30 mm (1.18 in.) 15 mm (0.59 in.) .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. ......................................................................................................................................................................................................................................................................................................................... Bottom 70 mm (2.75 in.) [85 mm optional] Edge 3 mm (0.11 in.) ......................................................................................................................................................................................................................................................................................................................... Dimensions Dimensions (W) 1796 mm x (D) 2033 mm x (H) 1920 mm (Does not include signal tower, signal tower height: 515 mm [20.3 in.]) (W) 70.7 in. x (D) 80.0 in. x (H) 75.5 in. .................................................................................................................................................................................................................................................................................................................................. Weight 4500 kg (9920 lbs) Power Requirement 200 - 240 V Three Phase, 50/60 Hz 7 kVA (346-416 V Optional Three Phase Transformer) .................................................................................................................................................................................................................................................................................................................................. .................................................................................................................................................................................................................................................................................................................................. Air Requirement 7F., No.47, Guangming 6th Rd., Zhubei City, Hsinchu County 30268, Taiwan TEL: +886-2-2832-8918 FAX: +886-3-553-9786 72 psi - 87 psi (5 - 6 Bar) Optional Accessories Barcode Scanner, Repair Station, Offline Editor & Yield Management System (YMS) 5F.3, Guangxia Rd., Shang-mei-lin Area, Fu-Tian District, Shenzhen, Guangdong, 518049, China TEL: +86-755-83112668 FAX: +86-755-83108177 E-mail: [email protected] Suzhou, China B Unit, Building 4, 78 Xinglin St., Suzhou Industrial Park, 215123, China TEL: +86-512-68250001 FAX: +86-512-68096639 E-mail: [email protected] TR7600LL SII SERIES Shanghai, China Room 6C, Building 14, Aly. 470, Guiping Rd., Xuhui Dist., Shanghai, 200233, China TEL: +86-21-54270101 FAX: +86-21-64957923 E-mail: [email protected] USA 1923 Hartog Drive San Jose, CA 95131 U.S.A TEL: +1-408-567-9898 FAX: +1-408-567-9288 E-mail: [email protected] Europe O’Brien Strasse 14 91126 Schwabach Germany TEL: +49-9122-631-2127 FAX: +49-9122-631-2147 E-mail: [email protected] Japan 2-9-9 Midori, Sumida-ku, Tokyo, 130-0021 Japan TEL: +81-3-6273-0518 FAX: +81-3-6273-0519 E-mail: [email protected] * SMEMA Compatible Korea U.S., Taiwan, China and Japan Patented: System and Method for Laminography Inspection Specifications are subject to change without notice. All trademarks are the property of their owners. The following are trademarks or registered trademarks of Test Research, Inc. (TRI) ® ® ® TRI INNOVATION ® The absence of a product or service name or logo from this list does not constitute a waiver of TRI’s trademark or other intellectual property rights concerning that name or logo. All other trademarks and trade names are the property of their owners. No.207 Daewoo-Technopia, 768-1 Wonsi-Dong, Danwon-Gu, Ansan City, Gyeonggi-Do, Korea TEL: +82-31-470-8858 FAX: +82-31-470-8859 E-mail: [email protected] Malaysia C11-1, Ground Floor, Lorong Bayan Indah 3 Bay Avenue, 11900 Bayan Lepas Penang, Malaysia TEL: +604-6461171 E-mail: [email protected] C-7600LL SII-EN-1408 AUTOMATED X-RAY INSPECTION TR7600LL SII F E A T U R E S Defect Symptom Images Inline 3D Automated X-ray Inspection Accurate Inspection Results TRI’s X-ray systems use intelligent analysis of X-ray data to reliably identify various solder and Yield Management System* • Automated Inspection and Pass/Fail Evaluation Screen Print Radiation Safe Design BGA Head-In-Pillow Designed with safety in mind, TRI’s AXI systems have full lead shielding which prevents harmful Intelligent Software Solution TR7007 Series • Automated Image-based or Manual programming Pick & Place • nts and complex defects BGA Void • Automatic board warp compensation Repair Station Defect Detection Capability monitoring and analysis. This integrated approach offers clear statistical feedback that improves defect management and enhances the efficiency of the inspection process. Components Bridging • BGA/CGA/LGA • Flip Chip • 2/3-layer PoP • QFN • Pressfit/Ventura Connectors • 01005 Chip • Fine Pitch Components/µBGA • Gullwing and J-lead Solder Joints • PTH TR7600LL SII Defect Symptoms • Head-in-Pillow • Opens • Bridging • Voids • Solder Balls • Barrel Fill • Insufficient/Excess Solder • Misalignment • Wrong Size Parts • Reversed Polarized Capacitors • Tombstones • Billboards • Missing Components Patented 6-axis Motion Control TR7500 Series or TR7700 Series X-Ray Inspection System Plug-In AXI Auto Calibration ATPG Inspection Algorithm Statistics Automatic Threshold Auto Warp Compensation Measurement Data CAD Parser Translator Visualize Analyze Data Interface Intelligent Integrated S/W with YMS TR7500 Series or TR7700 Series Insertion & Wave Soldering Control Repair Station Image Defect Detection Top-Ten Statistics Test Model Trend Chart TR7600 Series Yield Chart overlapping components, enabling reliable automated inspection of dual-side PCB assemblies without typical shadowing issues. QFN Open TR518 SII Series SMT Line Integration TRI’s Yield Management System links inspection data from SPI, AOI and AXI systems to trace defect roots throughout the PCB assembly line. Modular architecture provides centralized inspection management, real time defect monitoring with analysis and defect knowledge Top Package Press Fit Pin Defect Package on Package Multi-Layered Inspection Bottom Package TR5000 Series yields. BlockScan Customized Imaging TR8000 Series BlockScan module enhances AXI test program coverage by re-scanning selected areas of the µ SPI SFC Server AXI Data Flow Central Management Console Solder Ball Multiple Resolutions in One Program (5 µm using Digital Zoom) Feedback Flow • Inspection results and data integration • Real time SPC and production yield management • Quality reports and close loop tracking • Support defect component analysis and improvements • Knowledge Management (KM) • Productivity and Quality Management * Optional
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