FR-1 CCL Catalogue (1-9)

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34
OPPER CLAD LAMINATE
ATALOGUE
R-8700 EF (FR-1)
( SINGLE SIDE )
Lead Free Reflow Soldering Material
FEATURES
1) Excellent Heat resistance. Capable of Lead Free Soldering Re-flow ( 250 °C/ 2 times).
2) Low warp when re-flow.
3) Excellent long term electric reliability.
4) Low Radiation volume of Formaldehyde・phenol.
5) Other general characteristics, workability are equivalent to our R-8700
APPLICATIONS
-TV, VTR, Audio Device, Game Device, Remote control, etc.
 SPECIFICATIONS
Stand Panel Size
(Length X Width
Note :
2
0
X1, 020
2
0
1,220  20 X1, 020
2
0
1, 020
Copper Foil
Thickness
0.035 mm.
(35µm.)
Manufacturing
Thickness
Tolerance of
Thickness
Warp/Twist
Tolerance (%)
0.8 mm.
±0.09
±2
1.0 mm.
±0.11
±2
1.2 mm.
±0.12
±2
1.6 mm.
±0.14
±2
2.0 mm.
±0.15
±2
1) Measured thickness on 10 points according to JISC-6481-5.3.3, 9 of them were in above margin
tolerance, out of tolerance referred to within 125% of margin tolerance.
2) For thickness positioned between the nominal thickness, the tolerance for the next thicker value applies.
3) Copper foil thickness is included.
4) For thickness positioned between the nominal thickness, the twist and warp tolerance for the next thicker
value applies.
Single side for PbH Solder Reflow R8700 EF
1.Single side for Pb Free Reflow Soldering R8700 EF : 250℃、2times
2.Warpage after reflow is smaller.
3.Decrease VOC (Formal dehyde,Phenol)
Reflow Heat Resistance Evaluated result (Measuring Value)
O　：　No Blister　×　：　Blister
PCB Sureface Peak
Temperature (℃)
245
250
255
Tickness : 1.6 mm
Reflow frequency
( times)
1 time
2 times
1 time
2 times
1 time
2 times
R8700EF
R8700
Ο
Ο
Ο
Ο
Ο
X
Ο
Ο
Ο
X
X
X
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OPPER CLAD LAMINATE
ATALOGUE
GENERAL PROPERTIES1
Test Item
Volume Resistance
Unit
M·m
Surface Resistance
- Adhesive sureface
-Laminate surface
M
Actual Value
Assured Value
8x105
Above 5x104
C-96/20/65+C96/40/90
5x105
Above 5x103
C-96/20/65
5x106
Above 1x105
C-96/20/65+C96/40/90
1x106
Above 1x104
C-96/20/65
1x105
Above 1x104
C96/20/65+C96/40/90
1x105
Above 1x102
C-96/20/65
7x106
Above 1x105
Insulation Resistance
M
C-96/20/65+D2/100
5x104
Above 1x103
C-96/20/65
4.4
Less than 5.3
Dielectric Constant(1MHz)
-
C-96/20/65+D24/23
4.5
Less than 5.6
C-96/20/65
0.032
Less than 0.045
Dissipation Factor(1MHz)
-
C-96/20/65+D24/23
0.033
Less than 0.055
Solder Heat Resistance (260°C)
Seconds
A
40
Above 10
A
20.0(2.0)
Above 14.7(1.5)
S2
20.0(2.0)
Above 14.7(1.5)
200°C30min,
190°C30min,
No blistering
No blistering
Peel Strength
(copper foil 0.035 mm)
Heat Resistance
Flexure Strength (Crosswise direction)
Note :
M
Treatment
Conditions
C-96/20/65
N/cm(N/mm)
-
A
N/mm2
A
160
Above 118
0.6
Less than 0.75
Water Absorption
%
E-24/50+D24/23
Flame Resistance
-
A+E-168/70
94V-0
94V-0
Suitable temperature
50~80°C
Punching process
-
A
Suitable temperature
50~80°C
NaOH Resistance
-
Dip (3min)
Normal
Normal
Tracking Resistance (IEC method)
CTI
A
600
-
1) Test piece thickness is 1.6 mm.
2) The above test methods are accordance with JIS-C6481. However, the punching process
would be determined by internal standard test method.
3) Details of test methods and treatment conditions are available on request.
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OPPER CLAD LAMINATE
ATALOGUE
36
CC
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OPPER CLAD LAMINATE
ATALOGUE
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